FR2385192A1 - ADHESION LAYER FOR THE APPLICATION OF PROTECTIVE LAYERS RESISTANT TO ELECTROLYTIC DEPOSIT AND ITS USE IN THE MANUFACTURE OF PRINTED CIRCUITS - Google Patents

ADHESION LAYER FOR THE APPLICATION OF PROTECTIVE LAYERS RESISTANT TO ELECTROLYTIC DEPOSIT AND ITS USE IN THE MANUFACTURE OF PRINTED CIRCUITS

Info

Publication number
FR2385192A1
FR2385192A1 FR7808487A FR7808487A FR2385192A1 FR 2385192 A1 FR2385192 A1 FR 2385192A1 FR 7808487 A FR7808487 A FR 7808487A FR 7808487 A FR7808487 A FR 7808487A FR 2385192 A1 FR2385192 A1 FR 2385192A1
Authority
FR
France
Prior art keywords
manufacture
printed circuits
application
adhesion layer
protective layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7808487A
Other languages
French (fr)
Other versions
FR2385192B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2385192A1 publication Critical patent/FR2385192A1/en
Application granted granted Critical
Publication of FR2385192B1 publication Critical patent/FR2385192B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Matériau de support revêtu d'une couche mince de cuivre destiné à la fabrication de circuits imprimés par un procédé dans lequel on applique sur cette couche de cuivre une couche de masquage et on edifie les conducteurs par dépôt de métal dans les tétons non recouvertes. La couche mince de cuivre présente une surface rendue microrugueuse par traitement avec un oxydant ou par usinage mécanique entre une ou plusieurs paires de rouleaux, avec addition simultanée d'une suspension d'une substance sous forme de fins cristaux ou de grains fins.A support material coated with a thin layer of copper intended for the manufacture of printed circuits by a process in which a masking layer is applied to this layer of copper and the conductors are edified by depositing metal in the uncovered nipples. The thin layer of copper has a surface made micro-rough by treatment with an oxidant or by mechanical machining between one or more pairs of rollers, with the simultaneous addition of a suspension of a substance in the form of fine crystals or fine grains.

FR7808487A 1977-03-23 1978-03-23 ADHESION LAYER FOR THE APPLICATION OF PROTECTIVE LAYERS RESISTANT TO ELECTROLYTIC DEPOSIT AND ITS USE IN THE MANUFACTURE OF PRINTED CIRCUITS Granted FR2385192A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2713391A DE2713391C3 (en) 1977-03-23 1977-03-23 Process for the production of a carrier material for printed circuits

Publications (2)

Publication Number Publication Date
FR2385192A1 true FR2385192A1 (en) 1978-10-20
FR2385192B1 FR2385192B1 (en) 1980-10-17

Family

ID=6004742

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7808487A Granted FR2385192A1 (en) 1977-03-23 1978-03-23 ADHESION LAYER FOR THE APPLICATION OF PROTECTIVE LAYERS RESISTANT TO ELECTROLYTIC DEPOSIT AND ITS USE IN THE MANUFACTURE OF PRINTED CIRCUITS

Country Status (9)

Country Link
JP (1) JPS53147265A (en)
AT (1) AT379279B (en)
AU (1) AU516016B2 (en)
CA (1) CA1099031A (en)
DE (1) DE2713391C3 (en)
FR (1) FR2385192A1 (en)
GB (1) GB1588998A (en)
IT (1) IT7848565A0 (en)
NL (1) NL180163C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117258B1 (en) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Process for the production of metallic layers adhering to plastic supports
JPS59227188A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Printed board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Also Published As

Publication number Publication date
AT379279B (en) 1985-12-10
DE2713391A1 (en) 1978-09-28
IT7848565A0 (en) 1978-03-23
NL180163B (en) 1986-08-01
DE2713391B2 (en) 1979-06-28
ATA205078A (en) 1985-04-15
JPS53147265A (en) 1978-12-21
NL180163C (en) 1987-01-02
CA1099031A (en) 1981-04-07
AU3469778A (en) 1979-10-11
GB1588998A (en) 1981-05-07
FR2385192B1 (en) 1980-10-17
AU516016B2 (en) 1981-05-14
DE2713391C3 (en) 1980-03-06
NL7803106A (en) 1978-09-26

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Legal Events

Date Code Title Description
ST Notification of lapse