GB1382883A - Laminated articles with conductive surfaces - Google Patents

Laminated articles with conductive surfaces

Info

Publication number
GB1382883A
GB1382883A GB963072A GB963072A GB1382883A GB 1382883 A GB1382883 A GB 1382883A GB 963072 A GB963072 A GB 963072A GB 963072 A GB963072 A GB 963072A GB 1382883 A GB1382883 A GB 1382883A
Authority
GB
United Kingdom
Prior art keywords
substrate
march
nickel
particles
sheet material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB963072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1382883A publication Critical patent/GB1382883A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
GB963072A 1971-03-01 1972-03-01 Laminated articles with conductive surfaces Expired GB1382883A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11981371A 1971-03-01 1971-03-01

Publications (1)

Publication Number Publication Date
GB1382883A true GB1382883A (en) 1975-02-05

Family

ID=22386560

Family Applications (1)

Application Number Title Priority Date Filing Date
GB963072A Expired GB1382883A (en) 1971-03-01 1972-03-01 Laminated articles with conductive surfaces

Country Status (5)

Country Link
JP (1) JPS4729889A (enExample)
CA (1) CA989151A (enExample)
DE (1) DE2209815A1 (enExample)
FR (1) FR2128376A1 (enExample)
GB (1) GB1382883A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615888A (zh) * 2012-04-09 2012-08-01 昆山帆宏表面处理有限公司 电子产品外壳材料叠层结构及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3175416D1 (en) * 1980-09-15 1986-11-06 Ciba Geigy Ag Use of flexible materials in printed circuits
JPS59204295A (ja) * 1983-04-29 1984-11-19 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン 金属回路構造体
FR2546704B1 (fr) * 1983-05-27 1986-04-18 Rhone Poulenc Sa Substrats metallisables pour circuits imprimes et leur procede de preparation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615888A (zh) * 2012-04-09 2012-08-01 昆山帆宏表面处理有限公司 电子产品外壳材料叠层结构及其制造方法
CN102615888B (zh) * 2012-04-09 2015-07-15 昆山同寅兴业机电制造有限公司 电子产品外壳材料叠层结构及其制造方法

Also Published As

Publication number Publication date
DE2209815A1 (de) 1972-09-21
FR2128376A1 (enExample) 1972-10-20
CA989151A (en) 1976-05-18
JPS4729889A (enExample) 1972-11-07

Similar Documents

Publication Publication Date Title
GB1392125A (en) Mounting preformed circuits on preformed dielectric substrates
JPS5829983U (ja) 電磁気シ−ルド包装体
GB1022167A (en) Process of laminating polytetraflucroethylene to metal and product
GB1261483A (en) A method of preparing laminated boards
JPS6018340A (ja) 導電性シ−ト及び導電性プラスチツク
JPS63265494A (ja) 多層配線板
JPS6453594A (en) Flexible wiring board and manufacture thereof
JPS6169409A (ja) プリプレグの製法
JPH0433389A (ja) セラミック複合銅張積層板とその製造法
JPS6260640A (ja) 金属と樹脂との積層体
GB1410456A (en) Plated metal sheet
JPS62132392A (ja) 金属ベ−ス配線基板
JPS62108054A (ja) 金属箔張積層板の製造方法
JPS6256134A (ja) 金属箔張積層板
JPH02130146A (ja) 電気用積層板
JPH06252549A (ja) 接着剤被覆積層板の製造方法
JPS60214953A (ja) 金属ベ−スプリント配線基板
JPS54126467A (en) Lead frame for semiconductor device
JPS6237152A (ja) 金属箔張積層板
JPH03215988A (ja) アルミニウムベース配線基板
JPS6428992A (en) Printed circuit board and manufacture thereof
JPS58173648A (ja) 金属ベ−ス積層板
GB867682A (en) Bonding metals to synthetic resins
JPS62106691A (ja) 配線用板
JPH04323888A (ja) 銅箔張りプリプレグ

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees