DE2209815A1 - Leitfahiger Gegenstand - Google Patents

Leitfahiger Gegenstand

Info

Publication number
DE2209815A1
DE2209815A1 DE19722209815 DE2209815A DE2209815A1 DE 2209815 A1 DE2209815 A1 DE 2209815A1 DE 19722209815 DE19722209815 DE 19722209815 DE 2209815 A DE2209815 A DE 2209815A DE 2209815 A1 DE2209815 A1 DE 2209815A1
Authority
DE
Germany
Prior art keywords
nickel
boron
copper
coating
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722209815
Other languages
German (de)
English (en)
Inventor
Harold Edward Hockessin Del Belhs (V St A )
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE2209815A1 publication Critical patent/DE2209815A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
DE19722209815 1971-03-01 1972-03-01 Leitfahiger Gegenstand Pending DE2209815A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11981371A 1971-03-01 1971-03-01

Publications (1)

Publication Number Publication Date
DE2209815A1 true DE2209815A1 (de) 1972-09-21

Family

ID=22386560

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722209815 Pending DE2209815A1 (de) 1971-03-01 1972-03-01 Leitfahiger Gegenstand

Country Status (5)

Country Link
JP (1) JPS4729889A (enExample)
CA (1) CA989151A (enExample)
DE (1) DE2209815A1 (enExample)
FR (1) FR2128376A1 (enExample)
GB (1) GB1382883A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3175416D1 (en) * 1980-09-15 1986-11-06 Ciba Geigy Ag Use of flexible materials in printed circuits
JPS59204295A (ja) * 1983-04-29 1984-11-19 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属回路構造体
FR2546704B1 (fr) * 1983-05-27 1986-04-18 Rhone Poulenc Sa Substrats metallisables pour circuits imprimes et leur procede de preparation
CN102615888B (zh) * 2012-04-09 2015-07-15 昆山同寅兴业机电制造有限公司 电子产品外壳材料叠层结构及其制造方法

Also Published As

Publication number Publication date
FR2128376A1 (enExample) 1972-10-20
CA989151A (en) 1976-05-18
JPS4729889A (enExample) 1972-11-07
GB1382883A (en) 1975-02-05

Similar Documents

Publication Publication Date Title
DE69614857T2 (de) Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten
DE3782522T2 (de) Leitfaehige kupferpastenzusammensetzung.
DE2905857A1 (de) Gegenstaende zur elektrischen anwendung und dafuer geeignete zusammensetzungen
DE3485930T2 (de) Mehrschichtiges keramisches substrat und verfahren zum herstellen desselben.
EP0167020A2 (de) Flexible Polyimid-Mehrschichtlaminate
DE69225418T2 (de) Mehrlagen-Leiterplattenstruktur und Verfahren zur Herstellung mehrlagiger Konstruktionen
DE3853690T2 (de) Hitzebeständiges isolierendes Überzugsmaterial.
DE69920629T2 (de) Verfahren zur Herstellung einer biegsamen Schaltungsplatte
DE68922360T2 (de) Verfahren zur Herstellung von Metall-Polyimid-Verbundwerkstoffen.
DE69613046T2 (de) Isolierter elektrischer Draht
DE60124321T2 (de) Polyimidzusammensetzung mit verbessertem abschälwiderstand
EP0006509B1 (de) Verfahren zur Herstellung eines abdichtenden Überzugs auf elektronischen Schaltkreisen und Beschichtungsmaterial
DE3132981A1 (de) Polymere beschichtungen und aufbringungsverfahren
DE69307948T2 (de) Verfahren zur Herstellung eines kupferkaschierten Laminats
DE69414444T2 (de) Warmehärtbare Harzzusammensetzungen und ihre Verwendung zur Herstellung von Kunstharzgegenständen und Dünnschicht Leiterplatten
DE69320498T2 (de) Verfahren zur Herstellung von Dünnfilm-Leiterplatten
DE68914375T2 (de) Verfahren zur Herstellung eines aus Kupfer oder Silber/Polyimid zusammengesetzten Artikels.
EP0116297A2 (de) Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung
DE2419882A1 (de) Waermebestaendige klebstoffzusammensetzung
DE1704666C3 (de) Schichtpreßstoff, Verfahren zu seiner Herstellung und seine Verwendung für gedruckte Schaltungen
US3894330A (en) Manufacture of conductive articles
DE3424232A1 (de) Flexible polyimid-mehrschicht-laminate
DE2128733A1 (de) Schichtstoff und Verfahren zur Her stellung desselben
DE2125026A1 (de) Befestigungsanordnung für das Chip eines integrierten Schaltkreises
DE3800889C2 (de) Haftvermittlermischung zur festhaftenden Verankerung auf Metalloberflächen