DE2209815A1 - Leitfahiger Gegenstand - Google Patents
Leitfahiger GegenstandInfo
- Publication number
- DE2209815A1 DE2209815A1 DE19722209815 DE2209815A DE2209815A1 DE 2209815 A1 DE2209815 A1 DE 2209815A1 DE 19722209815 DE19722209815 DE 19722209815 DE 2209815 A DE2209815 A DE 2209815A DE 2209815 A1 DE2209815 A1 DE 2209815A1
- Authority
- DE
- Germany
- Prior art keywords
- nickel
- boron
- copper
- coating
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11981371A | 1971-03-01 | 1971-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2209815A1 true DE2209815A1 (de) | 1972-09-21 |
Family
ID=22386560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722209815 Pending DE2209815A1 (de) | 1971-03-01 | 1972-03-01 | Leitfahiger Gegenstand |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS4729889A (enExample) |
| CA (1) | CA989151A (enExample) |
| DE (1) | DE2209815A1 (enExample) |
| FR (1) | FR2128376A1 (enExample) |
| GB (1) | GB1382883A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0048219B1 (de) * | 1980-09-15 | 1986-10-01 | Ciba-Geigy Ag | Verwendung von flexiblem Basismaterial zur Herstellung von gedruckten Schaltungen |
| JPS59204295A (ja) * | 1983-04-29 | 1984-11-19 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属回路構造体 |
| FR2546704B1 (fr) * | 1983-05-27 | 1986-04-18 | Rhone Poulenc Sa | Substrats metallisables pour circuits imprimes et leur procede de preparation |
| CN102615888B (zh) * | 2012-04-09 | 2015-07-15 | 昆山同寅兴业机电制造有限公司 | 电子产品外壳材料叠层结构及其制造方法 |
-
1972
- 1972-02-24 CA CA135,517A patent/CA989151A/en not_active Expired
- 1972-02-28 FR FR7206681A patent/FR2128376A1/fr not_active Withdrawn
- 1972-02-29 JP JP2029072A patent/JPS4729889A/ja active Pending
- 1972-03-01 DE DE19722209815 patent/DE2209815A1/de active Pending
- 1972-03-01 GB GB963072A patent/GB1382883A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2128376A1 (enExample) | 1972-10-20 |
| CA989151A (en) | 1976-05-18 |
| GB1382883A (en) | 1975-02-05 |
| JPS4729889A (enExample) | 1972-11-07 |
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