GB1341454A - Packaging of semiconductor devices - Google Patents

Packaging of semiconductor devices

Info

Publication number
GB1341454A
GB1341454A GB4909671A GB4909671A GB1341454A GB 1341454 A GB1341454 A GB 1341454A GB 4909671 A GB4909671 A GB 4909671A GB 4909671 A GB4909671 A GB 4909671A GB 1341454 A GB1341454 A GB 1341454A
Authority
GB
United Kingdom
Prior art keywords
tracks
conductive
fingers
semi
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4909671A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB1341454A publication Critical patent/GB1341454A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
GB4909671A 1970-10-22 1971-10-21 Packaging of semiconductor devices Expired GB1341454A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8287270A 1970-10-22 1970-10-22

Publications (1)

Publication Number Publication Date
GB1341454A true GB1341454A (en) 1973-12-19

Family

ID=22173983

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4909671A Expired GB1341454A (en) 1970-10-22 1971-10-21 Packaging of semiconductor devices

Country Status (7)

Country Link
US (1) US3691289A (enExample)
JP (1) JPS5116257B1 (enExample)
CA (1) CA939830A (enExample)
FR (1) FR2111767B1 (enExample)
GB (1) GB1341454A (enExample)
IT (1) IT939645B (enExample)
NL (1) NL7113968A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
GB2140205A (en) * 1983-05-18 1984-11-21 Rollin Woodruff Mettler Integrated circuit module and method of making same
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930115A (en) * 1971-05-19 1975-12-30 Philips Corp Electric component assembly comprising insulating foil bearing conductor tracks
US3766639A (en) * 1972-01-20 1973-10-23 Us Air Force Method for testing electronic circuits using variable liquid dielectric constant testing media
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US3936928A (en) * 1973-10-04 1976-02-10 Motorola, Inc. Method for providing mounting assemblies for a plurality of transistor integrated circuit chips
US4005288A (en) * 1975-09-19 1977-01-25 Honeywell Inc. Photodetector mounting and connecting
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
JPS6013078B2 (ja) * 1978-09-05 1985-04-04 日本特殊陶業株式会社 金メツキされた電子部品及びその製法
US4236777A (en) * 1979-07-27 1980-12-02 Amp Incorporated Integrated circuit package and manufacturing method
US4470507A (en) * 1980-03-24 1984-09-11 National Semiconductor Corporation Assembly tape for hermetic tape packaging semiconductor devices
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
WO1988006348A1 (en) * 1987-02-20 1988-08-25 Lsi Logic Corporation Integrated circuit package assembly
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US5310055A (en) * 1990-08-21 1994-05-10 National Semiconductor Corporation Magazine and shipping tray for lead frames
US5140404A (en) * 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5419946A (en) * 1993-09-30 1995-05-30 Hitachi Chemical Co., Ltd. Adhesive for printed wiring board and production thereof
US5717163A (en) * 1994-12-02 1998-02-10 Wu; Conny Plastic material pouring device for forming electronic components
US5836454A (en) * 1996-01-17 1998-11-17 Micron Technology, Inc. Lead frame casing
JP2000239542A (ja) * 1999-02-18 2000-09-05 Matsushita Electric Ind Co Ltd 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法
US6373125B1 (en) 2000-02-23 2002-04-16 International Business Machines Corporation Chip scale package with direct attachment of chip to lead frame
US6675755B2 (en) * 2000-04-06 2004-01-13 Visteon Global Technologies, Inc. Integrated powertrain control system for large engines
DE10228593A1 (de) * 2002-06-26 2004-01-15 Infineon Technologies Ag Elektronisches Bauteil mit einer Gehäusepackung
US20060131616A1 (en) * 2004-12-21 2006-06-22 Devaney Douglas E Copperless flexible circuit
US20060262452A1 (en) * 2005-05-18 2006-11-23 Samsung Electronics Co., Ltd. Method of making hermetically sealed hard disk drive by encapulation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322387Y1 (enExample) * 1968-02-22 1968-09-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
GB2140205A (en) * 1983-05-18 1984-11-21 Rollin Woodruff Mettler Integrated circuit module and method of making same
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise

Also Published As

Publication number Publication date
IT939645B (it) 1973-02-10
CA939830A (en) 1974-01-08
JPS5116257B1 (enExample) 1976-05-22
FR2111767B1 (enExample) 1977-06-03
FR2111767A1 (enExample) 1972-06-09
DE2153015A1 (de) 1972-05-04
US3691289A (en) 1972-09-12
DE2153015B2 (de) 1976-12-30
NL7113968A (enExample) 1972-04-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee