IT939645B - Dispositivo contenitore per dispositivi a semiconduttore - Google Patents
Dispositivo contenitore per dispositivi a semiconduttoreInfo
- Publication number
- IT939645B IT939645B IT53625/71A IT5362571A IT939645B IT 939645 B IT939645 B IT 939645B IT 53625/71 A IT53625/71 A IT 53625/71A IT 5362571 A IT5362571 A IT 5362571A IT 939645 B IT939645 B IT 939645B
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor devices
- container device
- container
- semiconductor
- devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8287270A | 1970-10-22 | 1970-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT939645B true IT939645B (it) | 1973-02-10 |
Family
ID=22173983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT53625/71A IT939645B (it) | 1970-10-22 | 1971-10-21 | Dispositivo contenitore per dispositivi a semiconduttore |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3691289A (enExample) |
| JP (1) | JPS5116257B1 (enExample) |
| CA (1) | CA939830A (enExample) |
| FR (1) | FR2111767B1 (enExample) |
| GB (1) | GB1341454A (enExample) |
| IT (1) | IT939645B (enExample) |
| NL (1) | NL7113968A (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3930115A (en) * | 1971-05-19 | 1975-12-30 | Philips Corp | Electric component assembly comprising insulating foil bearing conductor tracks |
| US3766639A (en) * | 1972-01-20 | 1973-10-23 | Us Air Force | Method for testing electronic circuits using variable liquid dielectric constant testing media |
| US3919602A (en) * | 1972-03-23 | 1975-11-11 | Bosch Gmbh Robert | Electric circuit arrangement and method of making the same |
| US3936928A (en) * | 1973-10-04 | 1976-02-10 | Motorola, Inc. | Method for providing mounting assemblies for a plurality of transistor integrated circuit chips |
| US4005288A (en) * | 1975-09-19 | 1977-01-25 | Honeywell Inc. | Photodetector mounting and connecting |
| US4142203A (en) * | 1976-12-20 | 1979-02-27 | Avx Corporation | Method of assembling a hermetically sealed semiconductor unit |
| US4147889A (en) * | 1978-02-28 | 1979-04-03 | Amp Incorporated | Chip carrier |
| US4246697A (en) * | 1978-04-06 | 1981-01-27 | Motorola, Inc. | Method of manufacturing RF power semiconductor package |
| USRE34484E (en) * | 1978-09-05 | 1993-12-21 | Ngk Spark Plug Co., Ltd. | Gold-plated electronic components |
| JPS6013078B2 (ja) * | 1978-09-05 | 1985-04-04 | 日本特殊陶業株式会社 | 金メツキされた電子部品及びその製法 |
| US4236777A (en) * | 1979-07-27 | 1980-12-02 | Amp Incorporated | Integrated circuit package and manufacturing method |
| US4470507A (en) * | 1980-03-24 | 1984-09-11 | National Semiconductor Corporation | Assembly tape for hermetic tape packaging semiconductor devices |
| FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
| GB2124433B (en) * | 1982-07-07 | 1986-05-21 | Int Standard Electric Corp | Electronic component assembly |
| US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
| US4627533A (en) * | 1984-10-29 | 1986-12-09 | Hughes Aircraft Company | Ceramic package for compensated crystal oscillator |
| DE3619636A1 (de) * | 1986-06-11 | 1987-12-17 | Bosch Gmbh Robert | Gehaeuse fuer integrierte schaltkreise |
| WO1988006348A1 (en) * | 1987-02-20 | 1988-08-25 | Lsi Logic Corporation | Integrated circuit package assembly |
| US4853826A (en) * | 1988-08-01 | 1989-08-01 | Rogers Corporation | Low inductance decoupling capacitor |
| US5310055A (en) * | 1990-08-21 | 1994-05-10 | National Semiconductor Corporation | Magazine and shipping tray for lead frames |
| US5140404A (en) * | 1990-10-24 | 1992-08-18 | Micron Technology, Inc. | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
| US5177032A (en) * | 1990-10-24 | 1993-01-05 | Micron Technology, Inc. | Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
| US5419946A (en) * | 1993-09-30 | 1995-05-30 | Hitachi Chemical Co., Ltd. | Adhesive for printed wiring board and production thereof |
| US5717163A (en) * | 1994-12-02 | 1998-02-10 | Wu; Conny | Plastic material pouring device for forming electronic components |
| US5836454A (en) * | 1996-01-17 | 1998-11-17 | Micron Technology, Inc. | Lead frame casing |
| JP2000239542A (ja) * | 1999-02-18 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法 |
| US6373125B1 (en) | 2000-02-23 | 2002-04-16 | International Business Machines Corporation | Chip scale package with direct attachment of chip to lead frame |
| US6675755B2 (en) * | 2000-04-06 | 2004-01-13 | Visteon Global Technologies, Inc. | Integrated powertrain control system for large engines |
| DE10228593A1 (de) * | 2002-06-26 | 2004-01-15 | Infineon Technologies Ag | Elektronisches Bauteil mit einer Gehäusepackung |
| US20060131616A1 (en) * | 2004-12-21 | 2006-06-22 | Devaney Douglas E | Copperless flexible circuit |
| US20060262452A1 (en) * | 2005-05-18 | 2006-11-23 | Samsung Electronics Co., Ltd. | Method of making hermetically sealed hard disk drive by encapulation |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4322387Y1 (enExample) * | 1968-02-22 | 1968-09-19 |
-
1970
- 1970-10-22 US US82872A patent/US3691289A/en not_active Expired - Lifetime
-
1971
- 1971-10-12 NL NL7113968A patent/NL7113968A/xx unknown
- 1971-10-21 CA CA125,783A patent/CA939830A/en not_active Expired
- 1971-10-21 IT IT53625/71A patent/IT939645B/it active
- 1971-10-21 JP JP46082920A patent/JPS5116257B1/ja active Pending
- 1971-10-21 FR FR7137839A patent/FR2111767B1/fr not_active Expired
- 1971-10-21 GB GB4909671A patent/GB1341454A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1341454A (en) | 1973-12-19 |
| CA939830A (en) | 1974-01-08 |
| JPS5116257B1 (enExample) | 1976-05-22 |
| FR2111767B1 (enExample) | 1977-06-03 |
| FR2111767A1 (enExample) | 1972-06-09 |
| DE2153015A1 (de) | 1972-05-04 |
| US3691289A (en) | 1972-09-12 |
| DE2153015B2 (de) | 1976-12-30 |
| NL7113968A (enExample) | 1972-04-25 |
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