GB1331028A - Method of soldering a semiconductor plate - Google Patents

Method of soldering a semiconductor plate

Info

Publication number
GB1331028A
GB1331028A GB3613572A GB3613572A GB1331028A GB 1331028 A GB1331028 A GB 1331028A GB 3613572 A GB3613572 A GB 3613572A GB 3613572 A GB3613572 A GB 3613572A GB 1331028 A GB1331028 A GB 1331028A
Authority
GB
United Kingdom
Prior art keywords
groove
solder
plate
soldering
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3613572A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP46059689A external-priority patent/JPS509383B2/ja
Priority claimed from JP47013741A external-priority patent/JPS5211874B2/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of GB1331028A publication Critical patent/GB1331028A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB3613572A 1971-08-07 1972-08-02 Method of soldering a semiconductor plate Expired GB1331028A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP46059689A JPS509383B2 (enExample) 1971-08-07 1971-08-07
JP47013741A JPS5211874B2 (enExample) 1972-02-07 1972-02-07

Publications (1)

Publication Number Publication Date
GB1331028A true GB1331028A (en) 1973-09-19

Family

ID=26349573

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3613572A Expired GB1331028A (en) 1971-08-07 1972-08-02 Method of soldering a semiconductor plate

Country Status (5)

Country Link
US (1) US3879837A (enExample)
CA (1) CA970079A (enExample)
DE (1) DE2238569C3 (enExample)
FR (1) FR2148480B1 (enExample)
GB (1) GB1331028A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4784310A (en) * 1986-03-24 1988-11-15 General Motors Corporation Method for screen printing solder paste onto a substrate with device premounted thereon
US4927069A (en) * 1988-07-15 1990-05-22 Sanken Electric Co., Ltd. Soldering method capable of providing a joint of reduced thermal resistance
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE4303790A1 (de) * 1993-02-10 1994-08-11 Daimler Benz Ag Verfahren zur Erzeugung einer formschlüssigen Verbindung zwischen Halbleiterbauelementen und metallischen Oberflächen von Trägerelementen
DE4322715A1 (de) * 1993-07-08 1995-01-12 Bosch Gmbh Robert Bauelementeinheit mit lunkerarmer Lötverbindung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB851544A (en) * 1957-10-28 1960-10-19 English Electric Valve Co Ltd Improvements in or relating to semi-conductor devices
NL131155C (enExample) * 1958-02-22
DE1127180B (de) * 1960-02-02 1962-04-05 Siemens Ag Verfahren zum Hartloeten von vorzugsweise gesinterten Kontaktplaettchen mit seinem Traeger
NL258204A (enExample) * 1960-11-21 1900-01-01
AT231568B (de) * 1962-02-03 1964-02-10 Siemens Ag Halbleiteranordnung
US3503631A (en) * 1968-11-01 1970-03-31 Carrier Corp Brazed joints

Also Published As

Publication number Publication date
FR2148480B1 (enExample) 1977-07-29
DE2238569B2 (de) 1976-04-15
DE2238569A1 (de) 1973-02-22
DE2238569C3 (de) 1981-05-21
US3879837A (en) 1975-04-29
FR2148480A1 (enExample) 1973-03-23
CA970079A (en) 1975-06-24

Similar Documents

Publication Publication Date Title
US3860949A (en) Semiconductor mounting devices made by soldering flat surfaces to each other
US3486223A (en) Solder bonding
GB1481015A (en) Bonding of a semiconductor device to an electrical conductor on a supporting substrate
FR2363891B1 (enExample)
JPS6418246A (en) Lead frame for semiconductor device
GB1389542A (en) Methods of securing a semiconductor body to a support
GB1031436A (en) Improvements in and relating to methods of soft-soldering
US4650107A (en) Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate
US3470611A (en) Semiconductor device assembly method
US3772575A (en) High heat dissipation solder-reflow flip chip transistor
GB1352946A (en) Semiconductor device with solder bond and process for its fabrication
GB1240977A (en) Improvements in or relating to semiconductor components
JPH05315490A (ja) 半導体素子
GB1426874A (en) Method of sealing electrical component envelopes
US3879837A (en) Method of soldering a semiconductor plate
US4493143A (en) Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered
GB1529857A (en) Semiconductors
US3823469A (en) High heat dissipation solder-reflow flip chip transistor
JP3008675B2 (ja) 半導体チップの組立治具
GB1280610A (en) Improvements in or relating to semiconductor components
JPS5935439A (ja) バンプ付リ−ドレスチツプキヤリアの基板搭載方法
JP2677642B2 (ja) 加熱ヘッドおよび電子部品の実装方法
JPS57202747A (en) Electronic circuit device
JPS6471136A (en) Semiconductor device
JPS5732660A (en) Semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
746 Register noted 'licences of right' (sect. 46/1977)
PE20 Patent expired after termination of 20 years