CA970079A - Method of soldering a semiconductor plate - Google Patents

Method of soldering a semiconductor plate

Info

Publication number
CA970079A
CA970079A CA148,789A CA148789A CA970079A CA 970079 A CA970079 A CA 970079A CA 148789 A CA148789 A CA 148789A CA 970079 A CA970079 A CA 970079A
Authority
CA
Canada
Prior art keywords
soldering
semiconductor plate
semiconductor
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA148,789A
Other languages
English (en)
Other versions
CA148789S (en
Inventor
Hisao Okuno
Minoru Andou
Kanji Mizukoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5968971A external-priority patent/JPS509383B2/ja
Priority claimed from JP1374172A external-priority patent/JPS5211874B2/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of CA970079A publication Critical patent/CA970079A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA148,789A 1971-08-07 1972-08-04 Method of soldering a semiconductor plate Expired CA970079A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (enExample) 1971-08-07 1971-08-07
JP1374172A JPS5211874B2 (enExample) 1972-02-07 1972-02-07

Publications (1)

Publication Number Publication Date
CA970079A true CA970079A (en) 1975-06-24

Family

ID=26349573

Family Applications (1)

Application Number Title Priority Date Filing Date
CA148,789A Expired CA970079A (en) 1971-08-07 1972-08-04 Method of soldering a semiconductor plate

Country Status (5)

Country Link
US (1) US3879837A (enExample)
CA (1) CA970079A (enExample)
DE (1) DE2238569C3 (enExample)
FR (1) FR2148480B1 (enExample)
GB (1) GB1331028A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4784310A (en) * 1986-03-24 1988-11-15 General Motors Corporation Method for screen printing solder paste onto a substrate with device premounted thereon
US4927069A (en) * 1988-07-15 1990-05-22 Sanken Electric Co., Ltd. Soldering method capable of providing a joint of reduced thermal resistance
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE4303790A1 (de) * 1993-02-10 1994-08-11 Daimler Benz Ag Verfahren zur Erzeugung einer formschlüssigen Verbindung zwischen Halbleiterbauelementen und metallischen Oberflächen von Trägerelementen
DE4322715A1 (de) * 1993-07-08 1995-01-12 Bosch Gmbh Robert Bauelementeinheit mit lunkerarmer Lötverbindung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB851544A (en) * 1957-10-28 1960-10-19 English Electric Valve Co Ltd Improvements in or relating to semi-conductor devices
BE575988A (enExample) * 1958-02-22
DE1127180B (de) * 1960-02-02 1962-04-05 Siemens Ag Verfahren zum Hartloeten von vorzugsweise gesinterten Kontaktplaettchen mit seinem Traeger
NL258204A (enExample) * 1960-11-21 1900-01-01
AT231568B (de) * 1962-02-03 1964-02-10 Siemens Ag Halbleiteranordnung
US3503631A (en) * 1968-11-01 1970-03-31 Carrier Corp Brazed joints

Also Published As

Publication number Publication date
FR2148480B1 (enExample) 1977-07-29
DE2238569C3 (de) 1981-05-21
DE2238569A1 (de) 1973-02-22
US3879837A (en) 1975-04-29
FR2148480A1 (enExample) 1973-03-23
GB1331028A (en) 1973-09-19
DE2238569B2 (de) 1976-04-15

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