FR2148480B1 - - Google Patents

Info

Publication number
FR2148480B1
FR2148480B1 FR7228210A FR7228210A FR2148480B1 FR 2148480 B1 FR2148480 B1 FR 2148480B1 FR 7228210 A FR7228210 A FR 7228210A FR 7228210 A FR7228210 A FR 7228210A FR 2148480 B1 FR2148480 B1 FR 2148480B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7228210A
Other languages
French (fr)
Other versions
FR2148480A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5968971A external-priority patent/JPS509383B2/ja
Priority claimed from JP1374172A external-priority patent/JPS5211874B2/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of FR2148480A1 publication Critical patent/FR2148480A1/fr
Application granted granted Critical
Publication of FR2148480B1 publication Critical patent/FR2148480B1/fr
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7228210A 1971-08-07 1972-08-04 Expired FR2148480B1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (enExample) 1971-08-07 1971-08-07
JP1374172A JPS5211874B2 (enExample) 1972-02-07 1972-02-07

Publications (2)

Publication Number Publication Date
FR2148480A1 FR2148480A1 (enExample) 1973-03-23
FR2148480B1 true FR2148480B1 (enExample) 1977-07-29

Family

ID=26349573

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7228210A Expired FR2148480B1 (enExample) 1971-08-07 1972-08-04

Country Status (5)

Country Link
US (1) US3879837A (enExample)
CA (1) CA970079A (enExample)
DE (1) DE2238569C3 (enExample)
FR (1) FR2148480B1 (enExample)
GB (1) GB1331028A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4784310A (en) * 1986-03-24 1988-11-15 General Motors Corporation Method for screen printing solder paste onto a substrate with device premounted thereon
US4927069A (en) * 1988-07-15 1990-05-22 Sanken Electric Co., Ltd. Soldering method capable of providing a joint of reduced thermal resistance
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE4303790A1 (de) * 1993-02-10 1994-08-11 Daimler Benz Ag Verfahren zur Erzeugung einer formschlüssigen Verbindung zwischen Halbleiterbauelementen und metallischen Oberflächen von Trägerelementen
DE4322715A1 (de) * 1993-07-08 1995-01-12 Bosch Gmbh Robert Bauelementeinheit mit lunkerarmer Lötverbindung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB851544A (en) * 1957-10-28 1960-10-19 English Electric Valve Co Ltd Improvements in or relating to semi-conductor devices
BE575988A (enExample) * 1958-02-22
DE1127180B (de) * 1960-02-02 1962-04-05 Siemens Ag Verfahren zum Hartloeten von vorzugsweise gesinterten Kontaktplaettchen mit seinem Traeger
NL258204A (enExample) * 1960-11-21 1900-01-01
AT231568B (de) * 1962-02-03 1964-02-10 Siemens Ag Halbleiteranordnung
US3503631A (en) * 1968-11-01 1970-03-31 Carrier Corp Brazed joints

Also Published As

Publication number Publication date
CA970079A (en) 1975-06-24
DE2238569C3 (de) 1981-05-21
DE2238569A1 (de) 1973-02-22
US3879837A (en) 1975-04-29
FR2148480A1 (enExample) 1973-03-23
GB1331028A (en) 1973-09-19
DE2238569B2 (de) 1976-04-15

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