GB1308477A - Thin film circuits - Google Patents

Thin film circuits

Info

Publication number
GB1308477A
GB1308477A GB2456370A GB2456370A GB1308477A GB 1308477 A GB1308477 A GB 1308477A GB 2456370 A GB2456370 A GB 2456370A GB 2456370 A GB2456370 A GB 2456370A GB 1308477 A GB1308477 A GB 1308477A
Authority
GB
United Kingdom
Prior art keywords
layer
thin film
conductors
upper conductive
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2456370A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1308477A publication Critical patent/GB1308477A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Motors, Generators (AREA)
GB2456370A 1969-05-23 1970-05-21 Thin film circuits Expired GB1308477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82721569A 1969-05-23 1969-05-23

Publications (1)

Publication Number Publication Date
GB1308477A true GB1308477A (en) 1973-02-21

Family

ID=25248604

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2456370A Expired GB1308477A (en) 1969-05-23 1970-05-21 Thin film circuits

Country Status (8)

Country Link
US (1) US3647585A (enExample)
BE (1) BE750564A (enExample)
DE (1) DE2024494B2 (enExample)
ES (1) ES380665A1 (enExample)
FR (1) FR2044816B1 (enExample)
GB (1) GB1308477A (enExample)
NL (1) NL7007353A (enExample)
SE (1) SE353439B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850710A (en) * 1972-11-06 1974-11-26 Rca Corp Method of making a quasi-monolithic integrated circuit structure
US4026759A (en) * 1975-12-11 1977-05-31 International Business Machines Corporation Method of making ingrown lead frame with strain relief
NL7608901A (nl) * 1976-08-11 1978-02-14 Philips Nv Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze.
US4106050A (en) * 1976-09-02 1978-08-08 International Business Machines Corporation Integrated circuit structure with fully enclosed air isolation
NL181611C (nl) * 1978-11-14 1987-09-16 Philips Nv Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem.
ATE5115T1 (de) * 1980-04-17 1983-11-15 The Post Office Gold-metallisierung in halbleiteranordnungen.
IT1184723B (it) * 1985-01-28 1987-10-28 Telettra Lab Telefon Transistore mesfet con strato d'aria tra le connessioni dell'elettrodo di gate al supporto e relativo procedimento difabbricazione
US4847445A (en) * 1985-02-01 1989-07-11 Tektronix, Inc. Zirconium thin-film metal conductor systems
JPS61188997A (ja) * 1985-02-18 1986-08-22 オ−ケ−プリント配線株式会社 プリント配線基板およびその製造方法
US4751349A (en) * 1986-10-16 1988-06-14 International Business Machines Corporation Zirconium as an adhesion material in a multi-layer metallic structure
JPH02220464A (ja) * 1989-02-22 1990-09-03 Toshiba Corp 半導体装置及びその製造方法
US4920639A (en) * 1989-08-04 1990-05-01 Microelectronics And Computer Technology Corporation Method of making a multilevel electrical airbridge interconnect
JP2856778B2 (ja) * 1989-09-07 1999-02-10 株式会社東芝 半導体装置の配線構造
JP2516314Y2 (ja) * 1990-10-15 1996-11-06 日本シイエムケイ株式会社 電磁波シールドプリント配線板
US5181874A (en) * 1991-03-26 1993-01-26 Hughes Aircraft Company Method of making microelectronic field emission device with air bridge anode
US5324683A (en) * 1993-06-02 1994-06-28 Motorola, Inc. Method of forming a semiconductor structure having an air region
US5976917A (en) 1998-01-29 1999-11-02 Micron Technology, Inc. Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry
US6521970B1 (en) * 2000-09-01 2003-02-18 National Semiconductor Corporation Chip scale package with compliant leads
US7696089B1 (en) * 2004-05-11 2010-04-13 Johnson Research & Development Co., Inc. Passivated thin film and method of producing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1333007A (fr) * 1962-02-16 1963-07-19 Intermetall Procédé de fabrication de transistors à haute fréquence et transistors conformesà ceux ainsi obtenus
NL134170C (enExample) * 1963-12-17 1900-01-01
FR1535233A (fr) * 1966-11-02 1968-08-02 Western Electric Co Procédé pour former deux couches conductrices rapprochées sans court-circuit par piqûres

Also Published As

Publication number Publication date
ES380665A1 (es) 1972-10-16
DE2024494B2 (de) 1971-08-15
FR2044816A1 (enExample) 1971-02-26
NL7007353A (enExample) 1970-11-25
FR2044816B1 (enExample) 1973-11-16
SE353439B (enExample) 1973-01-29
US3647585A (en) 1972-03-07
DE2024494A1 (de) 1970-12-10
BE750564A (fr) 1970-11-03

Similar Documents

Publication Publication Date Title
GB1308477A (en) Thin film circuits
GB728606A (en) Electric resistance devices
GB1527108A (en) Methods of forming conductors on substrates involving electroplating
GB1342487A (en) Electrical connectors
GB1207134A (en) Method for forming two spaced conductive layers
GB1125394A (en) Thin-film electrical components
GB1130341A (en) Thin-film electrical components
US3812019A (en) Method of producing electric wiring arrangement
US3324362A (en) Electrical components formed by thin metallic form on solid substrates
GB1241574A (en) A method of plating conductive metals on film-forming materials
GB1105412A (en) Improvements in or relating to the making of thin film circuit devices
GB1009455A (en) Improvements in or relating to electrical contacts
JPS5536915A (en) Electronic circuit and its manufacturing
GB1369689A (en) Method of forming thin film circuitry
GB1287791A (en) A microcircuit and manufacture of same
JPS5797682A (en) Variable capacitance device
JPS5240968A (en) Process for production of semiconductor device
CA1000415A (en) Method of manufacturing electrically conductive metal layers on substrates
GB1000570A (en) Methods of manufacturing thin film conductors and to conductors manufactured thereby
GB1232126A (enExample)
GB1102832A (en) Improvements in or relating to the manufacture of thin film modules
GB1497583A (en) Thin film circuits
GB1205134A (en) Improvements relating to electrical interconnections
ES344101A1 (es) Metodo de fabricacion de un dispositivo semiconductor.
GB1088648A (en) Metal film resistors

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees