SE353439B - - Google Patents
Info
- Publication number
- SE353439B SE353439B SE06627/70A SE662770A SE353439B SE 353439 B SE353439 B SE 353439B SE 06627/70 A SE06627/70 A SE 06627/70A SE 662770 A SE662770 A SE 662770A SE 353439 B SE353439 B SE 353439B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacture Of Motors, Generators (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82721569A | 1969-05-23 | 1969-05-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE353439B true SE353439B (xx) | 1973-01-29 |
Family
ID=25248604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE06627/70A SE353439B (xx) | 1969-05-23 | 1970-05-14 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3647585A (xx) |
BE (1) | BE750564A (xx) |
DE (1) | DE2024494B2 (xx) |
ES (1) | ES380665A1 (xx) |
FR (1) | FR2044816B1 (xx) |
GB (1) | GB1308477A (xx) |
NL (1) | NL7007353A (xx) |
SE (1) | SE353439B (xx) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850710A (en) * | 1972-11-06 | 1974-11-26 | Rca Corp | Method of making a quasi-monolithic integrated circuit structure |
US4026759A (en) * | 1975-12-11 | 1977-05-31 | International Business Machines Corporation | Method of making ingrown lead frame with strain relief |
NL7608901A (nl) * | 1976-08-11 | 1978-02-14 | Philips Nv | Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze. |
US4106050A (en) * | 1976-09-02 | 1978-08-08 | International Business Machines Corporation | Integrated circuit structure with fully enclosed air isolation |
NL181611C (nl) * | 1978-11-14 | 1987-09-16 | Philips Nv | Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem. |
ATE5115T1 (de) * | 1980-04-17 | 1983-11-15 | The Post Office | Gold-metallisierung in halbleiteranordnungen. |
IT1184723B (it) * | 1985-01-28 | 1987-10-28 | Telettra Lab Telefon | Transistore mesfet con strato d'aria tra le connessioni dell'elettrodo di gate al supporto e relativo procedimento difabbricazione |
US4847445A (en) * | 1985-02-01 | 1989-07-11 | Tektronix, Inc. | Zirconium thin-film metal conductor systems |
JPS61188997A (ja) * | 1985-02-18 | 1986-08-22 | オ−ケ−プリント配線株式会社 | プリント配線基板およびその製造方法 |
US4751349A (en) * | 1986-10-16 | 1988-06-14 | International Business Machines Corporation | Zirconium as an adhesion material in a multi-layer metallic structure |
JPH02220464A (ja) * | 1989-02-22 | 1990-09-03 | Toshiba Corp | 半導体装置及びその製造方法 |
US4920639A (en) * | 1989-08-04 | 1990-05-01 | Microelectronics And Computer Technology Corporation | Method of making a multilevel electrical airbridge interconnect |
JP2856778B2 (ja) * | 1989-09-07 | 1999-02-10 | 株式会社東芝 | 半導体装置の配線構造 |
JP2516314Y2 (ja) * | 1990-10-15 | 1996-11-06 | 日本シイエムケイ株式会社 | 電磁波シールドプリント配線板 |
US5181874A (en) * | 1991-03-26 | 1993-01-26 | Hughes Aircraft Company | Method of making microelectronic field emission device with air bridge anode |
US5324683A (en) * | 1993-06-02 | 1994-06-28 | Motorola, Inc. | Method of forming a semiconductor structure having an air region |
US5976917A (en) * | 1998-01-29 | 1999-11-02 | Micron Technology, Inc. | Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
US6521970B1 (en) * | 2000-09-01 | 2003-02-18 | National Semiconductor Corporation | Chip scale package with compliant leads |
US7696089B1 (en) * | 2004-05-11 | 2010-04-13 | Johnson Research & Development Co., Inc. | Passivated thin film and method of producing same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1333007A (fr) * | 1962-02-16 | 1963-07-19 | Intermetall | Procédé de fabrication de transistors à haute fréquence et transistors conformesà ceux ainsi obtenus |
NL134170C (xx) * | 1963-12-17 | 1900-01-01 | ||
FR1535233A (fr) * | 1966-11-02 | 1968-08-02 | Western Electric Co | Procédé pour former deux couches conductrices rapprochées sans court-circuit par piqûres |
-
1969
- 1969-05-23 US US827215A patent/US3647585A/en not_active Expired - Lifetime
-
1970
- 1970-05-14 SE SE06627/70A patent/SE353439B/xx unknown
- 1970-05-19 BE BE750564D patent/BE750564A/xx unknown
- 1970-05-20 DE DE19702024494 patent/DE2024494B2/de active Pending
- 1970-05-21 ES ES380665A patent/ES380665A1/es not_active Expired
- 1970-05-21 GB GB2456370A patent/GB1308477A/en not_active Expired
- 1970-05-21 NL NL7007353A patent/NL7007353A/xx unknown
- 1970-05-22 FR FR7018840A patent/FR2044816B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2044816A1 (xx) | 1971-02-26 |
BE750564A (fr) | 1970-11-03 |
GB1308477A (en) | 1973-02-21 |
DE2024494A1 (de) | 1970-12-10 |
FR2044816B1 (xx) | 1973-11-16 |
US3647585A (en) | 1972-03-07 |
NL7007353A (xx) | 1970-11-25 |
ES380665A1 (es) | 1972-10-16 |
DE2024494B2 (de) | 1971-08-15 |