GB1307038A - Semiconductor arrangements - Google Patents

Semiconductor arrangements

Info

Publication number
GB1307038A
GB1307038A GB1481571*[A GB1481571A GB1307038A GB 1307038 A GB1307038 A GB 1307038A GB 1481571 A GB1481571 A GB 1481571A GB 1307038 A GB1307038 A GB 1307038A
Authority
GB
United Kingdom
Prior art keywords
substrate
semi
bonded
carrier bodies
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1481571*[A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1307038A publication Critical patent/GB1307038A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB1481571*[A 1970-05-14 1971-05-13 Semiconductor arrangements Expired GB1307038A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2023680A DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
GB1307038A true GB1307038A (en) 1973-02-14

Family

ID=5771149

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1481571*[A Expired GB1307038A (en) 1970-05-14 1971-05-13 Semiconductor arrangements

Country Status (8)

Country Link
JP (1) JPS55905B1 (cg-RX-API-DMAC7.html)
AT (1) AT321996B (cg-RX-API-DMAC7.html)
CA (1) CA938737A (cg-RX-API-DMAC7.html)
CH (1) CH524247A (cg-RX-API-DMAC7.html)
DE (1) DE2023680C3 (cg-RX-API-DMAC7.html)
GB (1) GB1307038A (cg-RX-API-DMAC7.html)
NL (1) NL7106597A (cg-RX-API-DMAC7.html)
SE (1) SE365652B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
JPS63193496U (cg-RX-API-DMAC7.html) * 1987-05-30 1988-12-13

Also Published As

Publication number Publication date
NL7106597A (cg-RX-API-DMAC7.html) 1971-11-16
AT321996B (de) 1975-04-25
DE2023680C3 (de) 1975-07-24
SE365652B (cg-RX-API-DMAC7.html) 1974-03-25
CA938737A (en) 1973-12-18
CH524247A (de) 1972-06-15
JPS55905B1 (cg-RX-API-DMAC7.html) 1980-01-10
DE2023680A1 (de) 1971-11-25
DE2023680B2 (de) 1974-12-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee