GB1300881A - Improvements in or relating to stacked arrangements of semiconductor bodies - Google Patents

Improvements in or relating to stacked arrangements of semiconductor bodies

Info

Publication number
GB1300881A
GB1300881A GB03988/71A GB1398871A GB1300881A GB 1300881 A GB1300881 A GB 1300881A GB 03988/71 A GB03988/71 A GB 03988/71A GB 1398871 A GB1398871 A GB 1398871A GB 1300881 A GB1300881 A GB 1300881A
Authority
GB
United Kingdom
Prior art keywords
bodies
crosspieces
frames
frame
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB03988/71A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1300881A publication Critical patent/GB1300881A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB03988/71A 1970-05-11 1971-05-10 Improvements in or relating to stacked arrangements of semiconductor bodies Expired GB1300881A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022895 DE2022895B2 (de) 1970-05-11 1970-05-11 Stapelfoermige anordnung von halbleiterkoerpern und verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
GB1300881A true GB1300881A (en) 1972-12-20

Family

ID=5770762

Family Applications (1)

Application Number Title Priority Date Filing Date
GB03988/71A Expired GB1300881A (en) 1970-05-11 1971-05-10 Improvements in or relating to stacked arrangements of semiconductor bodies

Country Status (8)

Country Link
AT (1) AT322059B (https=)
CA (1) CA922818A (https=)
CH (1) CH519247A (https=)
DE (1) DE2022895B2 (https=)
FR (1) FR2088490A1 (https=)
GB (1) GB1300881A (https=)
NL (1) NL7106459A (https=)
SE (1) SE369028B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150749A (en) * 1983-12-03 1985-07-03 Standard Telephones Cables Ltd Integrated circuits
EP0706217A3 (en) * 1994-09-30 1996-11-06 Ibm Contact for IV with improved characteristics with regard to electromigration and associated manufacturing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2806685A1 (de) * 1978-02-16 1979-08-23 Siemens Ag Stapelbauweise fuer halbleiter- speicherbausteine
JPS5837948A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 積層半導体記憶装置
US4982264A (en) * 1985-02-27 1991-01-01 Texas Instruments Incorporated High density integrated circuit package
DE3640072A1 (de) * 1986-11-24 1988-06-01 Rolf Tiedeken Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist
FR2645681B1 (fr) * 1989-04-07 1994-04-08 Thomson Csf Dispositif d'interconnexion verticale de pastilles de circuits integres et son procede de fabrication
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150749A (en) * 1983-12-03 1985-07-03 Standard Telephones Cables Ltd Integrated circuits
EP0706217A3 (en) * 1994-09-30 1996-11-06 Ibm Contact for IV with improved characteristics with regard to electromigration and associated manufacturing method
US5696030A (en) * 1994-09-30 1997-12-09 International Business Machines Corporation Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
US5760477A (en) * 1994-09-30 1998-06-02 International Business Machines Corporation Integrated circuit contacts having resistive electromigration characteristics

Also Published As

Publication number Publication date
FR2088490A1 (https=) 1972-01-07
AT322059B (de) 1975-05-12
DE2022895A1 (de) 1971-12-30
CA922818A (en) 1973-03-13
DE2022895B2 (de) 1976-12-02
SE369028B (https=) 1974-07-29
NL7106459A (https=) 1971-11-15
CH519247A (de) 1972-02-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees