FR2088490A1 - - Google Patents

Info

Publication number
FR2088490A1
FR2088490A1 FR7116896A FR7116896A FR2088490A1 FR 2088490 A1 FR2088490 A1 FR 2088490A1 FR 7116896 A FR7116896 A FR 7116896A FR 7116896 A FR7116896 A FR 7116896A FR 2088490 A1 FR2088490 A1 FR 2088490A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7116896A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2088490A1 publication Critical patent/FR2088490A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7116896A 1970-05-11 1971-05-11 Withdrawn FR2088490A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022895 DE2022895B2 (de) 1970-05-11 1970-05-11 Stapelfoermige anordnung von halbleiterkoerpern und verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
FR2088490A1 true FR2088490A1 (fr) 1972-01-07

Family

ID=5770762

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7116896A Withdrawn FR2088490A1 (fr) 1970-05-11 1971-05-11

Country Status (8)

Country Link
AT (1) AT322059B (fr)
CA (1) CA922818A (fr)
CH (1) CH519247A (fr)
DE (1) DE2022895B2 (fr)
FR (1) FR2088490A1 (fr)
GB (1) GB1300881A (fr)
NL (1) NL7106459A (fr)
SE (1) SE369028B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073486A2 (fr) * 1981-08-31 1983-03-09 Kabushiki Kaisha Toshiba Mémoire semi-conductrice empilée
DE3640072A1 (de) * 1986-11-24 1988-06-01 Rolf Tiedeken Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist
FR2645681A1 (fr) * 1989-04-07 1990-10-12 Thomson Csf Dispositif d'interconnexion verticale de pastilles de circuits integres et son procede de fabrication

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2806685A1 (de) * 1978-02-16 1979-08-23 Siemens Ag Stapelbauweise fuer halbleiter- speicherbausteine
GB2150749B (en) * 1983-12-03 1987-09-23 Standard Telephones Cables Ltd Integrated circuits
US4982264A (en) * 1985-02-27 1991-01-01 Texas Instruments Incorporated High density integrated circuit package
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members
US5696030A (en) * 1994-09-30 1997-12-09 International Business Machines Corporation Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073486A2 (fr) * 1981-08-31 1983-03-09 Kabushiki Kaisha Toshiba Mémoire semi-conductrice empilée
EP0073486A3 (en) * 1981-08-31 1986-03-26 Kabushiki Kaisha Toshiba Stacked semiconductor memory
DE3640072A1 (de) * 1986-11-24 1988-06-01 Rolf Tiedeken Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist
FR2645681A1 (fr) * 1989-04-07 1990-10-12 Thomson Csf Dispositif d'interconnexion verticale de pastilles de circuits integres et son procede de fabrication

Also Published As

Publication number Publication date
AT322059B (de) 1975-05-12
GB1300881A (en) 1972-12-20
NL7106459A (fr) 1971-11-15
SE369028B (fr) 1974-07-29
DE2022895B2 (de) 1976-12-02
CH519247A (de) 1972-02-15
DE2022895A1 (de) 1971-12-30
CA922818A (en) 1973-03-13

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Legal Events

Date Code Title Description
ST Notification of lapse