GB1285258A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1285258A
GB1285258A GB51099/70A GB5109970A GB1285258A GB 1285258 A GB1285258 A GB 1285258A GB 51099/70 A GB51099/70 A GB 51099/70A GB 5109970 A GB5109970 A GB 5109970A GB 1285258 A GB1285258 A GB 1285258A
Authority
GB
United Kingdom
Prior art keywords
layer
depositing
layers
oct
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB51099/70A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1285258A publication Critical patent/GB1285258A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/95—Multilayer mask including nonradiation sensitive layer

Landscapes

  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
GB51099/70A 1969-10-29 1970-10-28 Improvements in or relating to semiconductor devices Expired GB1285258A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691954499 DE1954499A1 (de) 1969-10-29 1969-10-29 Verfahren zur Herstellung von Halbleiterschaltkreisen mit Leitbahnen

Publications (1)

Publication Number Publication Date
GB1285258A true GB1285258A (en) 1972-08-16

Family

ID=5749597

Family Applications (1)

Application Number Title Priority Date Filing Date
GB51099/70A Expired GB1285258A (en) 1969-10-29 1970-10-28 Improvements in or relating to semiconductor devices

Country Status (9)

Country Link
US (1) US3689332A (https=)
JP (1) JPS498458B1 (https=)
AT (1) AT312053B (https=)
CH (1) CH515614A (https=)
DE (1) DE1954499A1 (https=)
FR (1) FR2065563B1 (https=)
GB (1) GB1285258A (https=)
NL (1) NL7014116A (https=)
SE (1) SE352200B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948701A (en) * 1971-07-20 1976-04-06 Aeg-Isolier-Und Kunststoff Gmbh Process for manufacturing base material for printed circuits
US3874072A (en) * 1972-03-27 1975-04-01 Signetics Corp Semiconductor structure with bumps and method for making the same
NL163370C (nl) * 1972-04-28 1980-08-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
FR2183603B1 (https=) * 1972-05-12 1974-08-30 Cit Alcatel
US3993515A (en) * 1975-03-31 1976-11-23 Rca Corporation Method of forming raised electrical contacts on a semiconductor device
US4334348A (en) * 1980-07-21 1982-06-15 Data General Corporation Retro-etch process for forming gate electrodes of MOS integrated circuits
US4495222A (en) * 1983-11-07 1985-01-22 Motorola, Inc. Metallization means and method for high temperature applications
US4674174A (en) * 1984-10-17 1987-06-23 Kabushiki Kaisha Toshiba Method for forming a conductor pattern using lift-off
USH434H (en) 1985-02-15 1988-02-02 American Telephone And Telegraph Company, At&T Bell Laboratories Contacts to III-V semiconductors
US4742023A (en) * 1986-08-28 1988-05-03 Fujitsu Limited Method for producing a semiconductor device
US4878990A (en) * 1988-05-23 1989-11-07 General Dynamics Corp., Pomona Division Electroformed and chemical milled bumped tape process
US5620611A (en) * 1996-06-06 1997-04-15 International Business Machines Corporation Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads
EP0914797B1 (de) * 1997-11-06 2005-04-13 LEIFHEIT Aktiengesellschaft Feuchtwischer für plane Flächen
US8584300B2 (en) 2007-11-29 2013-11-19 Carl Freudenberg Kg Squeeze mop

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact

Also Published As

Publication number Publication date
FR2065563A1 (https=) 1971-07-30
NL7014116A (https=) 1971-05-04
JPS498458B1 (https=) 1974-02-26
AT312053B (de) 1973-12-10
CH515614A (de) 1971-11-15
SE352200B (https=) 1972-12-18
DE1954499A1 (de) 1971-05-06
FR2065563B1 (https=) 1975-02-21
US3689332A (en) 1972-09-05

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees