GB1305236A - - Google Patents

Info

Publication number
GB1305236A
GB1305236A GB2911470A GB2911470A GB1305236A GB 1305236 A GB1305236 A GB 1305236A GB 2911470 A GB2911470 A GB 2911470A GB 2911470 A GB2911470 A GB 2911470A GB 1305236 A GB1305236 A GB 1305236A
Authority
GB
United Kingdom
Prior art keywords
chromium
tracks
nickel
silver
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2911470A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1305236A publication Critical patent/GB1305236A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB2911470A 1969-06-30 1970-06-16 Expired GB1305236A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83783669A 1969-06-30 1969-06-30

Publications (1)

Publication Number Publication Date
GB1305236A true GB1305236A (https=) 1973-01-31

Family

ID=25275578

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2911470A Expired GB1305236A (https=) 1969-06-30 1970-06-16

Country Status (6)

Country Link
JP (1) JPS4936517B1 (https=)
AU (1) AU1678170A (https=)
CA (1) CA945690A (https=)
DE (1) DE2032317A1 (https=)
FR (1) FR2048038B1 (https=)
GB (1) GB1305236A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115966472A (zh) * 2022-12-21 2023-04-14 福建闽航电子有限公司 一种cbcc型陶瓷外壳封装体的制造方法及陶瓷外壳封装体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7241649B2 (ja) * 2019-09-06 2023-03-17 株式会社東芝 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1540581A (fr) * 1966-12-30 1968-09-27 Texas Instruments Inc Circuit intégré à contacts ohmiques et à interconnexions à niveaux multiples

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115966472A (zh) * 2022-12-21 2023-04-14 福建闽航电子有限公司 一种cbcc型陶瓷外壳封装体的制造方法及陶瓷外壳封装体
CN115966472B (zh) * 2022-12-21 2025-12-23 福建闽航电子有限公司 一种陶瓷外壳封装体的制造方法及陶瓷外壳封装体

Also Published As

Publication number Publication date
FR2048038B1 (https=) 1974-05-03
CA945690A (en) 1974-04-16
JPS4936517B1 (https=) 1974-10-01
AU1678170A (en) 1972-01-06
DE2032317A1 (de) 1971-01-07
FR2048038A1 (https=) 1971-03-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee