JPS4936517B1 - - Google Patents
Info
- Publication number
- JPS4936517B1 JPS4936517B1 JP45051619A JP5161970A JPS4936517B1 JP S4936517 B1 JPS4936517 B1 JP S4936517B1 JP 45051619 A JP45051619 A JP 45051619A JP 5161970 A JP5161970 A JP 5161970A JP S4936517 B1 JPS4936517 B1 JP S4936517B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Conductive Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83783669A | 1969-06-30 | 1969-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4936517B1 true JPS4936517B1 (https=) | 1974-10-01 |
Family
ID=25275578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45051619A Pending JPS4936517B1 (https=) | 1969-06-30 | 1970-06-16 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS4936517B1 (https=) |
| AU (1) | AU1678170A (https=) |
| CA (1) | CA945690A (https=) |
| DE (1) | DE2032317A1 (https=) |
| FR (1) | FR2048038B1 (https=) |
| GB (1) | GB1305236A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044287A (ja) * | 2019-09-06 | 2021-03-18 | 株式会社東芝 | 半導体装置およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115966472B (zh) * | 2022-12-21 | 2025-12-23 | 福建闽航电子有限公司 | 一种陶瓷外壳封装体的制造方法及陶瓷外壳封装体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1540581A (fr) * | 1966-12-30 | 1968-09-27 | Texas Instruments Inc | Circuit intégré à contacts ohmiques et à interconnexions à niveaux multiples |
-
1970
- 1970-06-02 FR FR7020073A patent/FR2048038B1/fr not_active Expired
- 1970-06-12 CA CA085,321A patent/CA945690A/en not_active Expired
- 1970-06-16 JP JP45051619A patent/JPS4936517B1/ja active Pending
- 1970-06-16 GB GB2911470A patent/GB1305236A/en not_active Expired
- 1970-06-24 AU AU16781/70A patent/AU1678170A/en not_active Expired
- 1970-06-30 DE DE19702032317 patent/DE2032317A1/de not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044287A (ja) * | 2019-09-06 | 2021-03-18 | 株式会社東芝 | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2048038B1 (https=) | 1974-05-03 |
| CA945690A (en) | 1974-04-16 |
| AU1678170A (en) | 1972-01-06 |
| DE2032317A1 (de) | 1971-01-07 |
| GB1305236A (https=) | 1973-01-31 |
| FR2048038A1 (https=) | 1971-03-19 |