CH515614A - Verfahren zum Herstellen von Halbleiterschaltkreisen mit Leitbahnen - Google Patents

Verfahren zum Herstellen von Halbleiterschaltkreisen mit Leitbahnen

Info

Publication number
CH515614A
CH515614A CH1585870A CH1585870A CH515614A CH 515614 A CH515614 A CH 515614A CH 1585870 A CH1585870 A CH 1585870A CH 1585870 A CH1585870 A CH 1585870A CH 515614 A CH515614 A CH 515614A
Authority
CH
Switzerland
Prior art keywords
interconnects
production
semiconductor circuits
circuits
semiconductor
Prior art date
Application number
CH1585870A
Other languages
English (en)
Inventor
Dietrich Manfred
Eger Helmut
Neubert Eckart
Wolfgang Dr Krueger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH515614A publication Critical patent/CH515614A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/945Special, e.g. metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/948Radiation resist
    • Y10S438/95Multilayer mask including nonradiation sensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
CH1585870A 1969-10-29 1970-10-27 Verfahren zum Herstellen von Halbleiterschaltkreisen mit Leitbahnen CH515614A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691954499 DE1954499A1 (de) 1969-10-29 1969-10-29 Verfahren zur Herstellung von Halbleiterschaltkreisen mit Leitbahnen

Publications (1)

Publication Number Publication Date
CH515614A true CH515614A (de) 1971-11-15

Family

ID=5749597

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1585870A CH515614A (de) 1969-10-29 1970-10-27 Verfahren zum Herstellen von Halbleiterschaltkreisen mit Leitbahnen

Country Status (9)

Country Link
US (1) US3689332A (de)
JP (1) JPS498458B1 (de)
AT (1) AT312053B (de)
CH (1) CH515614A (de)
DE (1) DE1954499A1 (de)
FR (1) FR2065563B1 (de)
GB (1) GB1285258A (de)
NL (1) NL7014116A (de)
SE (1) SE352200B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948701A (en) * 1971-07-20 1976-04-06 Aeg-Isolier-Und Kunststoff Gmbh Process for manufacturing base material for printed circuits
US3874072A (en) * 1972-03-27 1975-04-01 Signetics Corp Semiconductor structure with bumps and method for making the same
NL163370C (nl) * 1972-04-28 1980-08-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
FR2183603B1 (de) * 1972-05-12 1974-08-30 Cit Alcatel
US3993515A (en) * 1975-03-31 1976-11-23 Rca Corporation Method of forming raised electrical contacts on a semiconductor device
US4334348A (en) * 1980-07-21 1982-06-15 Data General Corporation Retro-etch process for forming gate electrodes of MOS integrated circuits
US4495222A (en) * 1983-11-07 1985-01-22 Motorola, Inc. Metallization means and method for high temperature applications
US4674174A (en) * 1984-10-17 1987-06-23 Kabushiki Kaisha Toshiba Method for forming a conductor pattern using lift-off
US4742023A (en) * 1986-08-28 1988-05-03 Fujitsu Limited Method for producing a semiconductor device
US4878990A (en) * 1988-05-23 1989-11-07 General Dynamics Corp., Pomona Division Electroformed and chemical milled bumped tape process
US5620611A (en) * 1996-06-06 1997-04-15 International Business Machines Corporation Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads
DE59712269D1 (de) * 1997-11-06 2005-05-19 Leifheit Ag Feuchtwischer für plane Flächen
DE19915245A1 (de) * 1999-04-03 2000-10-05 Philips Corp Intellectual Pty Verfahren zur Herstellung von elektronischen Bauelementen mit Streifenleitungen
US8584300B2 (en) 2007-11-29 2013-11-19 Carl Freudenberg Kg Squeeze mop

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact

Also Published As

Publication number Publication date
FR2065563A1 (de) 1971-07-30
AT312053B (de) 1973-12-10
GB1285258A (en) 1972-08-16
JPS498458B1 (de) 1974-02-26
SE352200B (de) 1972-12-18
NL7014116A (de) 1971-05-04
US3689332A (en) 1972-09-05
DE1954499A1 (de) 1971-05-06
FR2065563B1 (de) 1975-02-21

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Legal Events

Date Code Title Description
PL Patent ceased