GB1271576A - Improvements in and relating to semiconductor devices - Google Patents

Improvements in and relating to semiconductor devices

Info

Publication number
GB1271576A
GB1271576A GB37572/69A GB3757269A GB1271576A GB 1271576 A GB1271576 A GB 1271576A GB 37572/69 A GB37572/69 A GB 37572/69A GB 3757269 A GB3757269 A GB 3757269A GB 1271576 A GB1271576 A GB 1271576A
Authority
GB
United Kingdom
Prior art keywords
conductors
conductor
semi
integrated circuit
synthetic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37572/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1271576A publication Critical patent/GB1271576A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
GB37572/69A 1968-07-30 1969-07-25 Improvements in and relating to semiconductor devices Expired GB1271576A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.

Publications (1)

Publication Number Publication Date
GB1271576A true GB1271576A (en) 1972-04-19

Family

ID=19804247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37572/69A Expired GB1271576A (en) 1968-07-30 1969-07-25 Improvements in and relating to semiconductor devices

Country Status (11)

Country Link
US (1) US3646409A (enExample)
AT (1) AT312686B (enExample)
BE (1) BE736743A (enExample)
CH (1) CH506883A (enExample)
DE (1) DE1937664C3 (enExample)
DK (1) DK123553B (enExample)
ES (1) ES369959A1 (enExample)
FR (1) FR2014777A1 (enExample)
GB (1) GB1271576A (enExample)
NL (1) NL157456B (enExample)
SE (1) SE355260B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (enExample) * 1970-10-19 1976-04-16 Ates Componenti Elettron
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3721747A (en) * 1972-03-15 1973-03-20 Coilcraft Inc Dual in-line package
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3801728A (en) * 1972-10-20 1974-04-02 Bell Telephone Labor Inc Microelectronic packages
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
IN148328B (enExample) * 1977-04-18 1981-01-17 Rca Corp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS592364B2 (ja) * 1979-04-27 1984-01-18 富士通株式会社 集合抵抗モジユ−ル
US4642419A (en) * 1981-04-06 1987-02-10 International Rectifier Corporation Four-leaded dual in-line package module for semiconductor devices
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5872395A (en) * 1996-09-16 1999-02-16 International Packaging And Assembly Corporation Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages
DE19638438A1 (de) 1996-09-19 1998-04-02 Siemens Ag Durch Feldeffekt steuerbares, vertikales Halbleiterbauelement
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
TWI268732B (en) * 2004-12-16 2006-12-11 Au Optronics Corp Organic light emitting device
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Also Published As

Publication number Publication date
ES369959A1 (es) 1971-07-16
US3646409A (en) 1972-02-29
DE1937664C3 (de) 1978-11-30
DK123553B (da) 1972-07-03
AT312686B (de) 1974-01-10
FR2014777A1 (enExample) 1970-04-17
SE355260B (enExample) 1973-04-09
NL157456B (nl) 1978-07-17
CH506883A (de) 1971-04-30
DE1937664A1 (de) 1970-02-05
NL6810761A (enExample) 1970-02-03
BE736743A (fr) 1970-01-29
DE1937664B2 (de) 1973-11-22

Similar Documents

Publication Publication Date Title
GB1271576A (en) Improvements in and relating to semiconductor devices
GB1341294A (en) Electronic header system having omni-directional heat dissipating characteristics
MY7400286A (en) Heat dissipation for power intergrated circuit
IL35503A0 (en) An electrical socket and an insulating carrier for an integrated circuit module
GB1362136A (en) Transistor package
GB1207728A (en) Housing assembly for an electric circuit
GB1191887A (en) Semiconductor Rectifier Assemblies
GB1292636A (en) Semiconductor devices and methods for their fabrication
GB862453A (en) Improvements in or relating to semi-conductor devices
GB1209901A (en) Improvements relating to the mounting of integrated circuit assemblies
GB1245610A (en) Improvements in and relating to semiconductor devices
GB1079382A (en) Heat sink structure and method of making the same
GB1302827A (enExample)
GB1362730A (en) Microwave hermetic transistor package
GB1258639A (enExample)
GB1285735A (en) Integrated semiconductor unit
GB1020151A (en) Electrical semiconductor device
GB1072775A (en) Improvements in electric structural elements
GB971703A (en) A semiconductor device
GB985672A (en) A semiconductor transistor or rectifier
GB1210584A (en) Semiconductor device and method of manufacturing the same
GB1177899A (en) Improvements in and relating to Semiconductor Devices
SU1443056A1 (ru) Транзисторный модуль
GB1204732A (en) Mounting and cooling means for electrical devices
GB982193A (en) Improvements in or relating to semiconductor devices