GB1265007A - - Google Patents

Info

Publication number
GB1265007A
GB1265007A GB5845668A GB1265007DA GB1265007A GB 1265007 A GB1265007 A GB 1265007A GB 5845668 A GB5845668 A GB 5845668A GB 1265007D A GB1265007D A GB 1265007DA GB 1265007 A GB1265007 A GB 1265007A
Authority
GB
United Kingdom
Prior art keywords
layer
heat sink
titania
alumina
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5845668A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1265007A publication Critical patent/GB1265007A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB5845668A 1968-12-09 1968-12-09 Expired GB1265007A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5845668 1968-12-09

Publications (1)

Publication Number Publication Date
GB1265007A true GB1265007A (https=) 1972-03-01

Family

ID=10481665

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5845668A Expired GB1265007A (https=) 1968-12-09 1968-12-09

Country Status (1)

Country Link
GB (1) GB1265007A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141859A (en) * 1983-06-20 1985-01-03 Adco Ind Components A display device
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2222721A (en) * 1988-08-23 1990-03-14 Nobuo Mikoshiba Cooling semiconductor devices
EP0771023A3 (en) * 1995-10-27 1999-03-24 Honeywell Inc. Method of applying a protective coating on a semiconductor integrated circuit
EP0843508A3 (en) * 1996-11-15 2000-04-19 Honeywell Inc. Coating circuits to dissipate heat
EP2245913A4 (en) * 2008-01-22 2011-01-26 Valtion Teknillinen PROCESS FOR COOLING ARRANGEMENT FOR A COMPONENT AND COOLING ELEMENT
EP2273181B1 (de) * 2009-07-07 2014-05-07 Siteco Beleuchtungstechnik GmbH Außen- oder Innenraumleuchte
DE102019201292A1 (de) * 2019-02-01 2020-08-06 Zf Friedrichshafen Ag Leistungselektronikanordnung für ein Fahrzeug, insbesondere ein Elektro- und/oder Hybridfahrzeug, sowie Verfahren zum Herstellen einer solchen Leistungselektronikanordnung

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141859A (en) * 1983-06-20 1985-01-03 Adco Ind Components A display device
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2219133B (en) * 1988-05-26 1991-11-20 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2222721A (en) * 1988-08-23 1990-03-14 Nobuo Mikoshiba Cooling semiconductor devices
GB2222721B (en) * 1988-08-23 1993-07-28 Nobuo Mikoshiba Cooling semiconductor devices
EP0771023A3 (en) * 1995-10-27 1999-03-24 Honeywell Inc. Method of applying a protective coating on a semiconductor integrated circuit
EP0843508A3 (en) * 1996-11-15 2000-04-19 Honeywell Inc. Coating circuits to dissipate heat
EP2245913A4 (en) * 2008-01-22 2011-01-26 Valtion Teknillinen PROCESS FOR COOLING ARRANGEMENT FOR A COMPONENT AND COOLING ELEMENT
EP2273181B1 (de) * 2009-07-07 2014-05-07 Siteco Beleuchtungstechnik GmbH Außen- oder Innenraumleuchte
DE102019201292A1 (de) * 2019-02-01 2020-08-06 Zf Friedrichshafen Ag Leistungselektronikanordnung für ein Fahrzeug, insbesondere ein Elektro- und/oder Hybridfahrzeug, sowie Verfahren zum Herstellen einer solchen Leistungselektronikanordnung

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed