GB1159152A - Improvements in or relating to Electric Circuit Components - Google Patents
Improvements in or relating to Electric Circuit ComponentsInfo
- Publication number
- GB1159152A GB1159152A GB3895366A GB3895366A GB1159152A GB 1159152 A GB1159152 A GB 1159152A GB 3895366 A GB3895366 A GB 3895366A GB 3895366 A GB3895366 A GB 3895366A GB 1159152 A GB1159152 A GB 1159152A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrode layers
- resistor
- block
- capacitor
- edges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 abstract 4
- 210000002105 tongue Anatomy 0.000 abstract 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US48403665A | 1965-08-31 | 1965-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1159152A true GB1159152A (en) | 1969-07-23 |
Family
ID=23922472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3895366A Expired GB1159152A (en) | 1965-08-31 | 1966-08-31 | Improvements in or relating to Electric Circuit Components |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS509980B1 (fr) |
DE (1) | DE1273638B (fr) |
FR (1) | FR1468115A (fr) |
GB (1) | GB1159152A (fr) |
SE (1) | SE325638B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106340387A (zh) * | 2016-09-30 | 2017-01-18 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106384681A (zh) * | 2016-09-30 | 2017-02-08 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106783163A (zh) * | 2016-12-16 | 2017-05-31 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2456388A1 (fr) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier |
DE3035668C2 (de) * | 1980-09-22 | 1983-10-27 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches Netzwerk mit zumindest einer Widerstandsschicht und Herstellungsverfahren dafür |
JPS59154268A (ja) * | 1983-02-18 | 1984-09-03 | 中西 謙治 | 立体駐車方法およびその装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3021589A (en) * | 1958-06-05 | 1962-02-20 | Vitramon Inc | Methods for installing terminal leads in composite electrical components and resulting products |
DE1150721B (de) * | 1960-01-18 | 1963-06-27 | Siemens Ag | Miniaturbaugruppen besonders kleinen Raumbedarfs |
-
1966
- 1966-02-11 FR FR49366A patent/FR1468115A/fr not_active Expired
- 1966-02-15 SE SE01942/66A patent/SE325638B/xx unknown
- 1966-08-22 JP JP5487966A patent/JPS509980B1/ja active Pending
- 1966-08-26 DE DE1966V0031806 patent/DE1273638B/de active Pending
- 1966-08-31 GB GB3895366A patent/GB1159152A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106340387A (zh) * | 2016-09-30 | 2017-01-18 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106384681A (zh) * | 2016-09-30 | 2017-02-08 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106384681B (zh) * | 2016-09-30 | 2018-11-20 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106340387B (zh) * | 2016-09-30 | 2019-02-12 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106783163A (zh) * | 2016-12-16 | 2017-05-31 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
CN106783163B (zh) * | 2016-12-16 | 2019-02-12 | 广东风华高新科技股份有限公司 | 片式复合元器件及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS509980B1 (fr) | 1975-04-17 |
SE325638B (fr) | 1970-07-06 |
DE1273638B (de) | 1968-07-25 |
FR1468115A (fr) | 1967-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |