GB1163434A - Improvements in or relating to Ceramic Electrical Components - Google Patents

Improvements in or relating to Ceramic Electrical Components

Info

Publication number
GB1163434A
GB1163434A GB3603466A GB3603466A GB1163434A GB 1163434 A GB1163434 A GB 1163434A GB 3603466 A GB3603466 A GB 3603466A GB 3603466 A GB3603466 A GB 3603466A GB 1163434 A GB1163434 A GB 1163434A
Authority
GB
United Kingdom
Prior art keywords
stack
layers
resistive layer
ceramic
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3603466A
Inventor
Stanislaus Marian Domanski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telegraph Condenser Co Ltd
Original Assignee
Telegraph Condenser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telegraph Condenser Co Ltd filed Critical Telegraph Condenser Co Ltd
Priority to GB3603466A priority Critical patent/GB1163434A/en
Priority to FR69049017A priority patent/FR1535862A/en
Publication of GB1163434A publication Critical patent/GB1163434A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

1,163,434. Circuit assemblies. TELEGRAPH CONDENSER CO. Ltd. 1 Aug., 1967 [11 Aug., 1966], No. 36034/66. Heading H1R In an R.C. network the capacitor comprises an integral monolithic stack of fired layers of ceramic dielectric material with electrodes sandwiched therebetween and the resistor a resistive layer coated on a face of the stack. Sheets of thin ceramic material are prepared in their green state and printed with the required electrode pattern on one or both surfaces. After stacking of the layers 1 the layers are sintered to produce an integral block. A conductive coating is then coated on opposite faces of the stack so that each coating comes into contact with two of the capacitor electrodes 2. Resistive layer 5 of a vitreous glaze is then applied and finally terminals 7 are secured to the conductive members. The resultant structure is a parallel R.C. combination. The sequence of applying the conductive members and resistive layers may be reversed, Fig. 1 (not shown). A borosilicate type of glaze may be applied over the whole body. In the arrangement of Fig. 5 (not shown), the resistive layer extends only partially over the top surface of the stack and a third conductive member is provided on the free end of the resistive layer and uncovered portion of the ceramic to provide an external connection, one of the others being omitted so as to form a series R.C. circuit.
GB3603466A 1966-08-11 1966-08-11 Improvements in or relating to Ceramic Electrical Components Expired GB1163434A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB3603466A GB1163434A (en) 1966-08-11 1966-08-11 Improvements in or relating to Ceramic Electrical Components
FR69049017A FR1535862A (en) 1966-08-11 1967-08-04 Improvements to ceramic-based electrical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3603466A GB1163434A (en) 1966-08-11 1966-08-11 Improvements in or relating to Ceramic Electrical Components

Publications (1)

Publication Number Publication Date
GB1163434A true GB1163434A (en) 1969-09-04

Family

ID=10384242

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3603466A Expired GB1163434A (en) 1966-08-11 1966-08-11 Improvements in or relating to Ceramic Electrical Components

Country Status (2)

Country Link
FR (1) FR1535862A (en)
GB (1) GB1163434A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981002652A1 (en) * 1980-03-11 1981-09-17 S Leppaevuori A compound with trimmable electric impedance i.e.a stub
DE3134680A1 (en) * 1980-09-02 1982-04-08 Thomson-CSF, 75360 Paris Ceramic micro-encapsulation housing for electronic circuits
US4423463A (en) * 1981-12-07 1983-12-27 General Electric Company Combined capacitor and resistor
US4740863A (en) * 1987-05-15 1988-04-26 Sfe Technologies Current-limiting thin film termination for capacitors
DE4118771A1 (en) * 1990-06-20 1992-01-09 Murata Manufacturing Co COMPOSED ELECTRONIC COMPONENT
DE19714544A1 (en) * 1996-04-09 1997-10-30 Rohm Co Ltd Dry-electrolyte capacitor mounting method for printed circuit board
US5936485A (en) * 1996-07-25 1999-08-10 Roederstein Electronics, Inc. Resistor-capacitor network with a stripe of resistive ink on the surface of a wound capacitor
WO2009043826A1 (en) * 2007-09-28 2009-04-09 Epcos Ag Electrical multilayer component and method for producing an electrical multilayer component
EP2471079A2 (en) * 2009-08-24 2012-07-04 Kemet Electronics Corporation Externally fused and resistively loaded safety capacitor
CN106409508A (en) * 2016-09-30 2017-02-15 广东风华高新科技股份有限公司 Chip-type composite component and fabrication method thereof
CN106449093A (en) * 2016-09-30 2017-02-22 广东风华高新科技股份有限公司 Composite electronic component and preparation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS581915A (en) * 1981-06-27 1983-01-07 日本メクトロン株式会社 High capacitance laminated bus
GB9512527D0 (en) * 1995-06-20 1995-08-23 Explosive Dev Ltd Improvements in or relating to capacitors

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981002652A1 (en) * 1980-03-11 1981-09-17 S Leppaevuori A compound with trimmable electric impedance i.e.a stub
DE3134680A1 (en) * 1980-09-02 1982-04-08 Thomson-CSF, 75360 Paris Ceramic micro-encapsulation housing for electronic circuits
US4423463A (en) * 1981-12-07 1983-12-27 General Electric Company Combined capacitor and resistor
US4740863A (en) * 1987-05-15 1988-04-26 Sfe Technologies Current-limiting thin film termination for capacitors
WO1988009043A1 (en) * 1987-05-15 1988-11-17 Sfe Technologies Current-limiting thin film termination for capacitors
DE4118771A1 (en) * 1990-06-20 1992-01-09 Murata Manufacturing Co COMPOSED ELECTRONIC COMPONENT
DE19714544B4 (en) * 1996-04-09 2004-04-01 Rohm Co. Ltd. Method of mounting a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the board
DE19714544A1 (en) * 1996-04-09 1997-10-30 Rohm Co Ltd Dry-electrolyte capacitor mounting method for printed circuit board
US5936485A (en) * 1996-07-25 1999-08-10 Roederstein Electronics, Inc. Resistor-capacitor network with a stripe of resistive ink on the surface of a wound capacitor
WO2009043826A1 (en) * 2007-09-28 2009-04-09 Epcos Ag Electrical multilayer component and method for producing an electrical multilayer component
US8134447B2 (en) 2007-09-28 2012-03-13 Epcos Ag Electrical multilayer component and method for producing an electrical multilayer component
EP2471079A2 (en) * 2009-08-24 2012-07-04 Kemet Electronics Corporation Externally fused and resistively loaded safety capacitor
EP2471079A4 (en) * 2009-08-24 2012-09-05 Kemet Electronics Corp Externally fused and resistively loaded safety capacitor
US8904609B2 (en) 2009-08-24 2014-12-09 Kemet Electronics Corporation Externally fused and resistively loaded safety capacitor
CN106409508A (en) * 2016-09-30 2017-02-15 广东风华高新科技股份有限公司 Chip-type composite component and fabrication method thereof
CN106449093A (en) * 2016-09-30 2017-02-22 广东风华高新科技股份有限公司 Composite electronic component and preparation method thereof
CN106409508B (en) * 2016-09-30 2019-02-12 广东风华高新科技股份有限公司 Compound component of chip and preparation method thereof

Also Published As

Publication number Publication date
FR1535862A (en) 1968-08-09

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees