JPS6225475A - Electrostrictive effect element and manufacture thereof - Google Patents
Electrostrictive effect element and manufacture thereofInfo
- Publication number
- JPS6225475A JPS6225475A JP60165163A JP16516385A JPS6225475A JP S6225475 A JPS6225475 A JP S6225475A JP 60165163 A JP60165163 A JP 60165163A JP 16516385 A JP16516385 A JP 16516385A JP S6225475 A JPS6225475 A JP S6225475A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrostrictive
- internal electrode
- electrode layer
- effect element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000011810 insulating material Substances 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 4
- 239000012212 insulator Substances 0.000 abstract 3
- 229910019653 Mg1/3Nb2/3 Inorganic materials 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- FKSZLDCMQZJMFN-UHFFFAOYSA-N [Mg].[Pb] Chemical compound [Mg].[Pb] FKSZLDCMQZJMFN-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電歪効果素子およびその製造方法に関し、とく
に縦効果を利用した電歪効果素子の電極の構造8よびそ
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrostrictive effect element and a manufacturing method thereof, and more particularly to an electrode structure 8 of an electrostrictive effect element using a longitudinal effect and a manufacturing method thereof.
従来、この種の電歪効果素子は第2図に示すような構造
である。すなわち膜または薄板状の電歪材料からなる電
歪層31の一方の表面に内部電極層32を設けたシート
を複数枚積層して積層体を形成し、その1つの側面、す
なわち左側間に露出した内部電極層32の端面に一層E
きに絶縁部33aを設け、この上から導電ペーストを被
着して第1の導電層34aを形成して、下部電極36に
接続する。Conventionally, this type of electrostrictive effect element has a structure as shown in FIG. That is, a laminate is formed by laminating a plurality of sheets in which an internal electrode layer 32 is provided on one surface of an electrostrictive layer 31 made of an electrostrictive material in the form of a film or a thin plate, and one side surface, that is, the left side is exposed between the sheets. A layer of E is formed on the end surface of the internal electrode layer 32.
Then, an insulating part 33a is provided, and a conductive paste is applied thereon to form a first conductive layer 34a, which is connected to the lower electrode 36.
一方、反対面の側面、すなわち右側面は前述左側面に絶
縁部33aを設けなかった内部電極層32の右端面に絶
縁部33bを設け、この上から第2の導電層34bを形
成して、上部を極35に接続して電歪効果素子を作製し
ている。On the other hand, on the opposite side surface, that is, the right side surface, an insulating section 33b is provided on the right end surface of the internal electrode layer 32 where the insulating section 33a was not provided on the left side surface, and a second conductive layer 34b is formed on this. The upper part is connected to the pole 35 to produce an electrostrictive element.
この従来′1歪効果素子は上部の電極板35と下部の電
極板36とに外部端子50.51をそれぞれ接触させて
電圧を印加すると、すべての電歪層31に電圧が印加さ
れ、比較的低電圧で大きな動作歪を発生して、電歪効果
素子の全体として1図中矢印X、Yで示した上下方向に
歪みを生ずる。In this conventional '1 strain effect element, when the external terminals 50 and 51 are brought into contact with the upper electrode plate 35 and the lower electrode plate 36, respectively, and a voltage is applied, the voltage is applied to all the electrostrictive layers 31, and the voltage is applied to all the electrostrictive layers 31. A large operational strain is generated at a low voltage, and the electrostrictive effect element as a whole is distorted in the vertical direction indicated by arrows X and Y in FIG.
前述の従来電歪効果素子は電歪層31は膜または薄板状
のため厚さは約()、 i nと薄いため、内部電極層
32間も約0.1 Mと間隔が狭いので、絶縁部を塗布
する上で極めて困難であり、絶縁の信頼性8よび量産性
に大きな問題があった。In the above-mentioned conventional electrostrictive effect element, the electrostrictive layer 31 is in the form of a film or a thin plate, so the thickness is as thin as approximately (), i. It was extremely difficult to coat the parts, and there were major problems in insulation reliability8 and mass production.
本発明の目的はかかる従来の問題を解決し、製造が容易
であり、高信頼性の電歪効果素子を提供することにある
。An object of the present invention is to solve such conventional problems and provide an electrostrictive effect element that is easy to manufacture and has high reliability.
本発明の電歪効果素子は電歪材料層と内部電極層を交互
に積層形成した積層チップ型の電歪効果素子の上下の各
電極面に接続する導電材料が塗布された断面に、上記内
部電極層の各層の片側端部が上記電歪材料層と異なる絶
縁物質で構成され、かつ各層の絶縁物質が交互に反対向
きに積層され、上記導電材料と内部電極層とを一層おき
に絶縁した構造を特徴とする。The electrostrictive effect element of the present invention is a multilayer chip-type electrostrictive effect element in which electrostrictive material layers and internal electrode layers are alternately laminated. One end of each layer of the electrode layer is composed of an insulating material different from the electrostrictive material layer, and the insulating material of each layer is alternately stacked in opposite directions, so that the conductive material and the internal electrode layer are insulated every other layer. Characterized by structure.
さらに本発明の電歪効果素子の製造方法は電歪材料層を
形成する工程と、この電歪材料層の表面に導電ペースト
をスクリーン印判して内部電極層を被着形成した後、絶
縁物質と有機バインダとの混合ペーストを内部電極層と
同一面内に印刷して、複合シートを形成する工程と、こ
の複合シートを交互に積層してff層体を形成した後、
加熱して焼結する工程と、この積層体の絶縁物質と内部
電極とを切断して端部を交互に露出させる切断工程と、
上記切断面に導°1物質層を塗布し、かつ積層体の上、
下の極性の異なる電極板にそれぞれ接続させる工程とか
らなることを特徴とする。Furthermore, the method for manufacturing an electrostrictive effect element of the present invention includes a step of forming an electrostrictive material layer, and forming an internal electrode layer by applying a conductive paste to the surface of the electrostrictive material layer with a screen stamp, and then forming an insulating material. A step of printing a mixed paste with an organic binder on the same plane as the internal electrode layer to form a composite sheet, and after alternately laminating the composite sheets to form an FF layer body.
a step of heating and sintering; a cutting step of cutting the insulating material and internal electrodes of the laminate to alternately expose the ends;
A conductive material layer is applied to the cut surface, and on top of the laminate,
The method is characterized in that it consists of a step of connecting the lower electrode plates of different polarities, respectively.
以下、本発明について図面を参照して詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to the drawings.
第1図は本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
すなわち5例えばマグネシウム−ニオブ酸鉛Pb(M、
!i’ V、 Nb z/s ) Osを主成分と−j
6i1E歪材料i媒中に分散させた泥漿を準備し、この
泥漿を通常の積層チップコンデンザを製造する成膜装置
によりフィラーフィルム上に数100ミクロンの厚さに
塗布乾燥した後、マイラーフィルムから剥離して、電歪
層31を形成する。この電歪層31の表面に白金などの
導電ペーストをスクリーン印刷して所望の位置に内部電
極層32を形成した後、あらかじめ内部電極層22の一
端を平行に切除して設ケタ切欠き部にZrO2,BaT
iOx、C+Pb セラミックなどの絶縁物質と有機バ
インダとの混合ペーストを再度スクリーン印刷して、内
部電極層22の一端に絶縁部33a、33bを塗布・乾
燥させて形成する。That is, 5 e.g. magnesium-lead niobate Pb (M,
! i' V, Nb z/s ) with Os as the main component and -j
A slurry dispersed in a 6i1E strained material i medium is prepared, and this slurry is coated onto a filler film to a thickness of several hundred microns using a film-forming device that manufactures ordinary laminated chip capacitors. After drying, the slurry is dispersed in a Mylar film. The electrostrictive layer 31 is formed by peeling off. After screen-printing a conductive paste such as platinum on the surface of this electrostrictive layer 31 to form an internal electrode layer 32 at a desired position, one end of the internal electrode layer 22 is cut out in parallel in advance to form a cut-out portion. ZrO2, BaT
A mixed paste of an insulating material such as iOx, C+Pb ceramic, and an organic binder is screen printed again to form insulating parts 33a and 33b on one end of the internal electrode layer 22 by coating and drying.
次に電歪層31上に内部電極層32と絶縁部33a、3
3bを片側の表面の端に印刷形成した複合シートを絶縁
部33a、331)を上下一段Sきに左右交互に反対向
きとなるように積層して、熱プレスにより仮成形後、焼
結炉にて温度約1250℃で焼結すれば電歪層31、内
部電極層32、絶縁部33a、33bを有する積層体が
得られる。Next, the internal electrode layer 32 and the insulating parts 33a, 3 are placed on the electrostrictive layer 31.
3b is printed on the edge of one surface, and the insulating parts 33a, 331) are laminated in opposite directions alternately on the left and right with one layer S above and below, and after being temporarily formed by hot press, it is placed in a sintering furnace. By sintering at a temperature of about 1250° C., a laminate having an electrostrictive layer 31, an internal electrode layer 32, and insulating portions 33a and 33b can be obtained.
次にこの積層体を第1図の如く所定の位置で切断した後
、一方の絶縁部33aが露出した左側面に白金などの導
電ペーストを塗布・乾燥し、第1の導電層34aを形成
する。一方、絶縁部33bを露出させた右側面に第1の
導電層と同材質の導電ペーストを塗布・乾燥して、第2
の導電層34bを形成する。Next, after cutting this laminate at a predetermined position as shown in FIG. 1, a conductive paste such as platinum is applied and dried on the left side surface where one insulating portion 33a is exposed, thereby forming a first conductive layer 34a. . On the other hand, a conductive paste made of the same material as the first conductive layer is applied and dried on the right side surface where the insulating part 33b is exposed.
A conductive layer 34b is formed.
次にこの積層体の上、下両面に白金などの導電ペースト
を塗布し、電極板35.36を形成−すると同時に各導
′成層34.35とそれぞれ電気的に接dされる。Next, a conductive paste such as platinum is applied to the upper and lower surfaces of this laminate to form electrode plates 35 and 36, which are electrically connected to each of the conductor layers 34 and 35, respectively.
このようにして、一方の絶縁部33aと交互に露出した
内部電臘層32のそれぞれの端部と第1の導電層34が
電気的に接続され、他方の絶縁部33bと交互に露出し
た内部電極層32aのそれぞれの端部と第2の導電層3
4bが電気的に接続され、上下の外部端子50.51間
に電圧を印加すれば上、下のt極板35.36を介して
、各内部電極層320間に電圧を印加することができる
。In this way, the first conductive layer 34 is electrically connected to each end of the internal conductive layer 32 which is exposed alternately with one insulating part 33a, and the internal part which is alternately exposed with the other insulating part 33b is electrically connected to the first conductive layer 34. Each end of the electrode layer 32a and the second conductive layer 3
4b is electrically connected and a voltage is applied between the upper and lower external terminals 50.51, a voltage can be applied between each internal electrode layer 320 via the upper and lower T electrode plates 35.36. .
以上説明したように本発明は、内部電極層と同一面内に
絶縁層を形成するため、積層体形成後に内部電極層と直
交する側面に絶縁材を塗布する必要がないので、量産が
容易となり、かつ電気的絶縁の信頼性が飛躍的に向上す
る効果がある。As explained above, in the present invention, since the insulating layer is formed in the same plane as the internal electrode layer, there is no need to apply an insulating material to the side surface perpendicular to the internal electrode layer after forming the laminate, which facilitates mass production. , and has the effect of dramatically improving the reliability of electrical insulation.
第1図は本発明道歪効果素子の一実施例を示す断面図。
第2図は従来電歪効果素子の一例を示す断面図。
31・・・・・・・屯歪層、32・・・・・・内部電極
層、33a。
33b・・−・・・絶縁部、34 a 、 34b・・
・・・・導電層。
35.36・・・・・・1極板、50,51・・・・・
・外部端子。
代理人 弁理士 内 原 音
第 iaFIG. 1 is a sectional view showing one embodiment of the strain effect element of the present invention. FIG. 2 is a sectional view showing an example of a conventional electrostrictive effect element. 31...Tun strained layer, 32...Internal electrode layer, 33a. 33b...Insulation section, 34a, 34b...
...Conductive layer. 35.36...1 pole plate, 50,51...
・External terminal. Agent: Patent Attorney Otode Uchihara IA
Claims (2)
積層チップコンデンサ型の電歪効果素子の上下の各電極
面に接続する導電材料が塗布された断面に、前記内部電
極層の各層の片側端部が前記電歪材料層と異なる絶縁物
質で構成され、かつ各層の絶縁物質が交互に反対向きに
積層され、前記導電材料と前記内部電極層とを一層おき
に絶縁した構造を有することを特徴とする電歪効果素子
。(1) A multilayer chip capacitor type electrostrictive effect element in which electrostrictive material layers and internal electrode layers are alternately laminated is coated with a conductive material that connects to each of the upper and lower electrode surfaces of the internal electrode layer. One end of each layer is made of an insulating material different from the electrostrictive material layer, and the insulating materials of each layer are alternately stacked in opposite directions, and the conductive material and the internal electrode layer are insulated every other layer. An electrostrictive effect element comprising:
面に導電ペーストをスクリーン印刷して内部電極層を被
着形成した後、絶縁物質と有機バインダとの混合ペース
トを内部電極層と同一面内に印刷して複合シートを形成
する工程と、前記複合シートを交互に積層して積層体を
形成した後、加熱して焼結する工程と、前記積層体の絶
縁質と内部電極層とを切断して端部を交互に露出させる
切断工程と、前記切断面に導電物質層を塗布し、かつ積
層体の上、下の極性の異なる電極板にそれぞれ接続させ
る工程とからなることを特徴とする電歪効果素子の製造
方法。(2) A step of forming an electrostrictive material layer, and after forming an internal electrode layer by screen printing a conductive paste on the surface of the electrostrictive material layer, a mixed paste of an insulating material and an organic binder is applied to the internal electrode layer. a step of printing on the same plane as the layer to form a composite sheet; a step of alternately stacking the composite sheets to form a laminate and then heating and sintering; The process consists of a cutting process in which the electrode layers are cut to expose the ends alternately, and a process in which a conductive material layer is applied to the cut surfaces and connected to electrode plates of different polarities on the top and bottom of the laminate, respectively. A method of manufacturing an electrostrictive element, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60165163A JPS6225475A (en) | 1985-07-25 | 1985-07-25 | Electrostrictive effect element and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60165163A JPS6225475A (en) | 1985-07-25 | 1985-07-25 | Electrostrictive effect element and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6225475A true JPS6225475A (en) | 1987-02-03 |
Family
ID=15807061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60165163A Pending JPS6225475A (en) | 1985-07-25 | 1985-07-25 | Electrostrictive effect element and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6225475A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009016333A (en) * | 2007-06-05 | 2009-01-22 | Ono Seisakusho:Kk | Manufacturing method of female electric contact of electrical connector and female electric contact of electrical connector |
CN102110767A (en) * | 2006-11-21 | 2011-06-29 | Tdk株式会社 | Multilayer piezoelectric element |
-
1985
- 1985-07-25 JP JP60165163A patent/JPS6225475A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110767A (en) * | 2006-11-21 | 2011-06-29 | Tdk株式会社 | Multilayer piezoelectric element |
DE102007049575B4 (en) * | 2006-11-21 | 2014-11-27 | Tdk Corp. | Piezoelectric multilayer element |
JP2009016333A (en) * | 2007-06-05 | 2009-01-22 | Ono Seisakusho:Kk | Manufacturing method of female electric contact of electrical connector and female electric contact of electrical connector |
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