JPS58196073A - Electrostrictive effect element - Google Patents

Electrostrictive effect element

Info

Publication number
JPS58196073A
JPS58196073A JP57078449A JP7844982A JPS58196073A JP S58196073 A JPS58196073 A JP S58196073A JP 57078449 A JP57078449 A JP 57078449A JP 7844982 A JP7844982 A JP 7844982A JP S58196073 A JPS58196073 A JP S58196073A
Authority
JP
Japan
Prior art keywords
electrostrictive
holes
internal electrode
electrostrictive material
effect element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57078449A
Other languages
Japanese (ja)
Inventor
Takeshige Hamatsuki
浜付 武重
Takeshi Yano
健 矢野
Izumi Fukui
福井 泉
Sadayuki Takahashi
高橋 貞行
Masatomo Yonezawa
米沢 正智
Atsushi Ochi
篤 越智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57078449A priority Critical patent/JPS58196073A/en
Priority to EP83104556A priority patent/EP0094078B1/en
Priority to DE8383104556T priority patent/DE3378393D1/en
Priority to AU14422/83A priority patent/AU553391B2/en
Priority to CA000427828A priority patent/CA1206193A/en
Priority to US06/493,583 priority patent/US4523121A/en
Publication of JPS58196073A publication Critical patent/JPS58196073A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872Connection electrodes of multilayer piezoelectric or electrostrictive devices, e.g. external electrodes
    • H10N30/874Connection electrodes of multilayer piezoelectric or electrostrictive devices, e.g. external electrodes embedded within piezoelectric or electrostrictive material, e.g. via connections

Abstract

PURPOSE:To facilitate the manufacture of a lamination type electrostrictive effect element by a method wherein holes are opened on a film of electrostrictive material, and this hole is filled with conductor. CONSTITUTION:After being coated over a Mylar film and dried, the electrostrictive material is exfoliated from the Mylar film, and accordingly a green sheet 31 is obtained. Next, the holes 32 and 32' are opened at symmetrical positions of the green sheet 31, and platinum paste is coated by leaving the part 33 around the hole 32. Then, the sheet 31 and inversed one at 180 deg. are laminated alternately and formed into an integral body by thermal press, thus sintered. The platinum paste turns into platinum electrodes 42 and 42' being connected between up and low parts.

Description

【発明の詳細な説明】 本発明は、縦効果を利用した電歪効果素子の構造に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of an electrostrictive element that utilizes the longitudinal effect.

電歪効果の大きな材料を用いて第1図に示すような積層
チップコンデンサ構造の素子を構成すると、低電圧で大
きな歪の発生する電歪効果素子が得られる。すなわち、
第1図(a)に示すように、電歪材料からなる膜またF
i博版板1間に正の内部電極板2.負の内部電極&2′
管交互に挾んで積層し、内部電極板2 、2’lそれぞ
れ外部電極3.3′に接続した構造である。しかし、上
述の従来の電歪効果素子は、同wJ(b)の平面図から
理解されるように、内部電極板2と2′との重なり部分
が素子面の全面積より小となり、周辺部分では両電極は
重なっていない。従って、外部電極3.3′間に電圧を
印加すると上記電極の重なり部分のみ電界強度が強くな
9、周辺部分の電界強度は弱い。このため単層周辺部分
は変形しないばかりでなく、素子全体の変形を阻害し材
料固有の歪量を得ることができないという欠点がある。
When an element having a multilayer chip capacitor structure as shown in FIG. 1 is constructed using a material having a large electrostrictive effect, an electrostrictive effect element that generates a large strain at a low voltage can be obtained. That is,
As shown in FIG. 1(a), a film made of electrostrictive material or F
Positive internal electrode plate 2. Negative internal electrode &2'
The structure is such that the tubes are alternately sandwiched and stacked, and the internal electrode plates 2 and 2'l are connected to external electrodes 3 and 3', respectively. However, in the above-mentioned conventional electrostrictive effect element, as can be understood from the plan view of wJ(b), the overlapping part between the internal electrode plates 2 and 2' is smaller than the total area of the element surface, and the peripheral part The two electrodes do not overlap. Therefore, when a voltage is applied between the external electrodes 3 and 3', the electric field strength is strong only at the overlapping portion of the electrodes 9, while the electric field strength is weak at the peripheral portion. For this reason, there is a drawback that not only the peripheral portion of the single layer does not deform, but also the deformation of the entire element is inhibited, making it impossible to obtain the amount of strain specific to the material.

さらに、変形する部分と、変形しない部分との境界に応
力集中が起こり、高電圧印加、〈υ返し印加または長時
間部加勢により機械的に素子が破壊するという欠点もあ
る。
Furthermore, stress concentration occurs at the boundary between the deformed part and the non-deformed part, and there is also the disadvantage that the element is mechanically destroyed by high voltage application, <υ return application, or long-term part stress.

上述の欠点を改良するため、第2図(a) 、 (b)
に示すような構造にすることが考えられる。すなわち、
同図(a)に示すように、内部電極板2.2′を電歪材
料の腺(または薄板)1の全面に交互に形成して積層し
、複数の内部電極板2の端部を相互に接続して外部端子
AK接続し、複数の内部電極板2′は外部端子BK接続
した構造である。従って同図(b)に示すように内部電
極板2およびr/fix子全面に形成されているので、
&極端子A、B間に電圧を印加すると、電歪材料の膜1
内の電界分布が一様となり、素子は均一に変形し、応力
集中も起こらない。すなわち、素子Fiはは材料固有の
変形′jlを示しかつ破壊しにくくなる。しかし、内部
電極板2.2′は接近しているので、内部電極板2相互
間および内部電極板2′相互関を電気的に接続すること
が非常に#Lい。
In order to improve the above-mentioned drawbacks, Figs. 2(a) and (b)
It is conceivable to have a structure as shown in the figure below. That is,
As shown in Figure (a), internal electrode plates 2.2' are alternately formed and laminated on the entire surface of the gland (or thin plate) 1 made of electrostrictive material, and the ends of the plurality of internal electrode plates 2 are mutually connected. The structure is such that the internal electrode plates 2' are connected to the external terminal AK, and the plurality of internal electrode plates 2' are connected to the external terminal BK. Therefore, as shown in the same figure (b), since it is formed on the entire surface of the internal electrode plate 2 and the r/fix element,
& When voltage is applied between pole terminals A and B, the film 1 of electrostrictive material
The electric field distribution inside becomes uniform, the element deforms uniformly, and stress concentration does not occur. That is, the element Fi exhibits deformation 'jl inherent to the material and becomes difficult to break. However, since the internal electrode plates 2.2' are close to each other, it is very difficult to electrically connect the internal electrode plates 2 to each other and the internal electrode plates 2' to each other.

本発明の目的は、上述の事情に鑑み、素子全面に形成さ
れた内部電極板を交互に容易かつ安定に外部電極箋に接
続することが可能な電歪効果素子の構造を提案すること
にある。
In view of the above-mentioned circumstances, an object of the present invention is to propose a structure of an electrostrictive effect element in which internal electrode plates formed on the entire surface of the element can be alternately and easily and stably connected to external electrode plates. .

本発明の電歪効果素子は、同一寸法の電歪材料の膜ま光
は薄板の中心に始して対称の位置に孔を穿設して該孔に
導電体を充填し、片方の前記孔の周辺部を残して前記電
歪材料のWaまた妹薄板の表面に内部電極板を形成し、
前記電歪材料の膜または薄板を交互に反転させて積層し
、前記孔内の導電体を介して一層おきの前記内部電極板
相互間が接続されたことをIl#像とする。
In the electrostrictive effect element of the present invention, holes are formed at symmetrical positions starting from the center of a thin plate of an electrostrictive material having the same dimensions, and the holes are filled with a conductor, and one of the holes is forming an internal electrode plate on the surface of the Wa or sister thin plate of the electrostrictive material, leaving the peripheral part of
The film or thin plate of the electrostrictive material is alternately inverted and stacked, and the Il# image is that every other internal electrode plate is connected to each other via the conductor in the hole.

次に、本発明について、図面を参照して詳細に説明する
Next, the present invention will be explained in detail with reference to the drawings.

第3図は、本発明の一実施例を示す断面図である。すな
わち、先ずマグネシウム・ニオブ酸鉛Pb(Mgx/s
 Nbz7魯)Onを主成分とする電歪材料の予焼粉末
に微量の有機バインダーを添加し、これを有機溶媒中に
分散させた泥漿を準備し、該泥漿を、通常の積層チップ
コンデンサを製造する成農機により、マイラーフィルム
上に数100ミクロンの厚さに塗布乾燥後マイラーフィ
ルムから剥離してグリーンシート31を得る。鋏グリー
ンシート31上の対称の位置に孔32 、32’を穿設
し、鍍グリーンシート31の表面上に第3図(−に斜線
で示したように孔32の周囲の部分33を残して白金ペ
ーストを塗布し、孔32 、32’には白金ペースiを
充填する。該グリーンシートを1806回転させれば同
図(b)に示すように、2つの孔の位置状同じで、白金
ペーストが塗布されない部分謔が左右反転した状態とな
る。同図(&)に示したものと伽)に示したものを交互
に積層し、熱プレスにより一体化した後、1200℃の
温度で約1時間焼結する。焼結されたセラミックは、第
4図に示すように各層の孔に充填された白金ペーストは
、上下間で接続されて白金電極42 、42’となる。
FIG. 3 is a sectional view showing one embodiment of the present invention. That is, first, magnesium lead niobate Pb (Mgx/s
A small amount of organic binder is added to a pre-fired powder of an electrostrictive material whose main component is Nbz7lu)On, a slurry is prepared by dispersing this in an organic solvent, and the slurry is used to manufacture ordinary multilayer chip capacitors. The green sheet 31 is obtained by applying the green sheet to a thickness of several 100 microns on a Mylar film using a commercial machine, drying it, and then peeling it off from the Mylar film. Holes 32 and 32' are bored at symmetrical positions on the scissor green sheet 31, and a portion 33 around the hole 32 is left as shown in FIG. Platinum paste is applied and the holes 32 and 32' are filled with platinum paste i.If the green sheet is rotated 1806 times, as shown in FIG. The parts that are not coated will be left and right reversed.The parts shown in (&) and the parts shown in () are laminated alternately and integrated by heat pressing, and then heated at a temperature of 1200℃ for about 1 Time to sinter. As shown in FIG. 4, the platinum paste filled in the holes of each layer of the sintered ceramic is connected between the upper and lower layers to form platinum electrodes 42, 42'.

従って、各層の白金ペーストは一層おきに接続されてい
る。すなわち、各層の電歪材料の膜41に挾まれた内部
電極板43は、2つの孔にそれぞれ貫通された白金電極
42.42’に交互に接続される。
Therefore, the platinum paste of each layer is connected every other layer. That is, the internal electrode plates 43 sandwiched between the electrostrictive material films 41 of each layer are alternately connected to platinum electrodes 42 and 42' penetrated through the two holes, respectively.

本実施例では、素子の断面81jは10−1各層の内部
電極板2相互約0.1 mとし、貫通孔の直径は(11
5mとし、第3図に示した白金ペーストを塗布しない部
分33の直径は0.6mとして製作することにより、内
部電極板43が交互に接続され、電極間の短絡は起こら
なかった。
In this example, the cross section 81j of the element is approximately 0.1 m from each other of the internal electrode plates 2 of each layer of 10-1, and the diameter of the through hole is (11
5 m, and the diameter of the portion 33 not coated with platinum paste shown in FIG. 3 was 0.6 m, so that the internal electrode plates 43 were connected alternately and no short circuit between the electrodes occurred.

以上のように構成された電歪効果素子は、製造が容易で
あり、低電圧の印加により大なる歪を発生できる効果が
ある。すなわち、本発明により、素子の断面積に等しい
内部電極板を有する積層型の電歪効果素子を工業的規模
で生産するに適した構造が提供される。
The electrostrictive effect element configured as described above is easy to manufacture and has the effect of generating a large strain by applying a low voltage. That is, the present invention provides a structure suitable for producing on an industrial scale a laminated electrostrictive element having an internal electrode plate having a cross-sectional area equal to the cross-sectional area of the element.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a) 、 (b)は従来の[r−チップコンデ
ンサ型の電歪効果素子の一例を示す断面図および平面図
、第2図−)、伽)は電歪材料の膜(または薄板)の全
面に内部電極板、管形成して積層し九構造の積階型電歪
効釆素子を示す断面図および平面図、9.3図は本発明
の一実施例におけるグリーンシート上の白金ペースト印
刷パターンの一例を示す平面図、第4図は本発明の一実
施例を示、す一部縦断血図である。 図において、1・・・電歪材料の膜(または薄板)、2
.2′・・・内部電極板、3.3’・・・外部電極、3
1・・・グリーンシー)、32.32’・・・孔、33
・・・白金ペーストを塗布しない部分、41・・・電歪
材料の膜(または薄板)、42.42・・・白金電極、
43・−・内部電極板。 第7図 I 拭2 図 2(2′ジ
Figures 1 (a) and (b) are cross-sectional views and plan views showing an example of a conventional r-chip capacitor type electrostrictive effect element; Figure 9.3 is a cross-sectional view and a plan view showing a laminated multilayer electrostrictive element with internal electrode plates and tubes formed on the entire surface of a thin plate. FIG. 4 is a plan view showing an example of a platinum paste printing pattern, and FIG. 4 is a partially longitudinal blood sectional view showing an embodiment of the present invention. In the figure, 1... A film (or thin plate) of electrostrictive material, 2
.. 2'...Internal electrode plate, 3.3'...External electrode, 3
1...green sea), 32.32'...hole, 33
... Part where platinum paste is not applied, 41 ... Film (or thin plate) of electrostrictive material, 42.42 ... Platinum electrode,
43.--Internal electrode plate. Figure 7 I Wipe 2 Figure 2 (2'

Claims (1)

【特許請求の範囲】[Claims] 同一寸法の電歪材料の膜または薄板の中心に対して対称
の位置に孔を穿設して該孔に導電体を充填し、片方の前
記孔の周辺部を残して前記電歪材料の膜または薄板の表
面に内部電歪板を形成し、前記電歪材料の膜またFi□
薄板を交互に反転させて積層し、前記・孔内の導電体を
介して一層おきの前記内部電極板相互間が接続されたこ
とを特徴とする電歪効果素子。
Holes are formed at symmetrical positions with respect to the center of a membrane or thin plate of electrostrictive material having the same dimensions, and the holes are filled with a conductor, leaving the peripheral area of one of the holes and forming the membrane of electrostrictive material. Alternatively, an internal electrostrictive plate is formed on the surface of the thin plate, and a film of the electrostrictive material or Fi□
An electrostrictive effect element characterized in that thin plates are alternately inverted and stacked, and every other internal electrode plate is connected to each other via the conductor in the hole.
JP57078449A 1982-05-11 1982-05-12 Electrostrictive effect element Pending JPS58196073A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP57078449A JPS58196073A (en) 1982-05-12 1982-05-12 Electrostrictive effect element
EP83104556A EP0094078B1 (en) 1982-05-11 1983-05-09 Multilayer electrostrictive element which withstands repeated application of pulses
DE8383104556T DE3378393D1 (en) 1982-05-11 1983-05-09 Multilayer electrostrictive element which withstands repeated application of pulses
AU14422/83A AU553391B2 (en) 1982-05-11 1983-05-10 Multilayer electrostrictive element
CA000427828A CA1206193A (en) 1982-05-11 1983-05-10 Multilayer electrostrictive element which withstands repeated application of pulses
US06/493,583 US4523121A (en) 1982-05-11 1983-05-11 Multilayer electrostrictive element which withstands repeated application of pulses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57078449A JPS58196073A (en) 1982-05-12 1982-05-12 Electrostrictive effect element

Publications (1)

Publication Number Publication Date
JPS58196073A true JPS58196073A (en) 1983-11-15

Family

ID=13662340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57078449A Pending JPS58196073A (en) 1982-05-11 1982-05-12 Electrostrictive effect element

Country Status (1)

Country Link
JP (1) JPS58196073A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177480A (en) * 1987-01-16 1988-07-21 Nec Corp Electrostrictive effect device
JPH02192186A (en) * 1989-01-19 1990-07-27 Toto Ltd Piezoelectric element
JPH0480125U (en) * 1990-11-27 1992-07-13
JPH05335871A (en) * 1992-05-29 1993-12-17 Murata Mfg Co Ltd Electronic component
DE102010049311A1 (en) * 2010-10-22 2012-04-26 Epcos Ag Piezoelectric actuator component, has piezoelectric layers stack region connected with one of multiple electrically interconnected first conductive layers and disconnected from electrically interconnected second conductive layers

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177480A (en) * 1987-01-16 1988-07-21 Nec Corp Electrostrictive effect device
JPH02192186A (en) * 1989-01-19 1990-07-27 Toto Ltd Piezoelectric element
JPH0480125U (en) * 1990-11-27 1992-07-13
JPH05335871A (en) * 1992-05-29 1993-12-17 Murata Mfg Co Ltd Electronic component
DE102010049311A1 (en) * 2010-10-22 2012-04-26 Epcos Ag Piezoelectric actuator component, has piezoelectric layers stack region connected with one of multiple electrically interconnected first conductive layers and disconnected from electrically interconnected second conductive layers
DE102010049311B4 (en) 2010-10-22 2018-04-19 Epcos Ag Method for producing a piezoelectric actuator component

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