GB718811A - Improvements in or relating to printed circuits and circuit components - Google Patents
Improvements in or relating to printed circuits and circuit componentsInfo
- Publication number
- GB718811A GB718811A GB2387850A GB2387850A GB718811A GB 718811 A GB718811 A GB 718811A GB 2387850 A GB2387850 A GB 2387850A GB 2387850 A GB2387850 A GB 2387850A GB 718811 A GB718811 A GB 718811A
- Authority
- GB
- United Kingdom
- Prior art keywords
- organdie
- paste
- heat
- deposited
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
718,811. Printed circuits; resistance coatings and deposits; electric condensers. STANDARD TELEPHONES & CABLES, Ltd. Sept. 21, 1951, [Sept. 29, 1950.] No. 23878/50. Classes 36 and 37. Electric circuits are made by printing or otherwise depositing electrical component pastes, in the configuration required for components such as conductors, condensers and resistances, on to organdie, and then applying heat or heat and pressure to consolidate the pastes. A condenser is made by printing or otherwise depositing dielectric paste and electrode paste on to a porous fabric (e.g. organdie). A paste containing dielectric material such as barium titanate is deposited on area B of a sheet A of organdie, and a paste containing a resistive material such as carbon or a metallic oxide is deposited on area C. Heat and pressure is then applied to consolidate the pastes and drive off solvents or other liquids. The condenser plates and conductive connections are then deposited, using a silver paste, the plate D 2 and connections D 3 and Ci being applied simultaneously to one side of sheet A, the other plate and connection E being applied to the other side. The silver paste is then consolidated. The printed sheet is then placed on top of or interleaved between a stack of sheets of uncured resin-impregnated paper. Silver plated metallic tags G and F are positioned to make contact with connections D 3 and G 1 and the assembly is moulded under heat and pressure. If desired, the condenser plates and certain of the conductive tracks may be printed on separate sheets of organdie, the sheets being assembled so that the necessary contacts are made. A single condenser may be produced on organdie. Figs. 3 and 4 (not shown), and manufacture is similar to that outlined above. Specification 675,752 is referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2387850A GB718811A (en) | 1950-09-29 | 1950-09-29 | Improvements in or relating to printed circuits and circuit components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2387850A GB718811A (en) | 1950-09-29 | 1950-09-29 | Improvements in or relating to printed circuits and circuit components |
Publications (1)
Publication Number | Publication Date |
---|---|
GB718811A true GB718811A (en) | 1954-11-24 |
Family
ID=10202780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2387850A Expired GB718811A (en) | 1950-09-29 | 1950-09-29 | Improvements in or relating to printed circuits and circuit components |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB718811A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3019150A (en) * | 1955-03-15 | 1962-01-30 | Benjamin L Davis | Tape capacitor |
US3022448A (en) * | 1958-04-15 | 1962-02-20 | Gen Electric | Modular electronic sub-assemblies and method of fabricating |
US3098955A (en) * | 1959-07-31 | 1963-07-23 | Benjamin L Davis | Tape capacitor |
US3200298A (en) * | 1963-05-27 | 1965-08-10 | United Aircraft Corp | Multilayer ceramic circuitry |
EP3785497A4 (en) * | 2018-06-07 | 2022-06-08 | The Governors Of The University Of Alberta | Elastic printed conductors |
-
1950
- 1950-09-29 GB GB2387850A patent/GB718811A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3019150A (en) * | 1955-03-15 | 1962-01-30 | Benjamin L Davis | Tape capacitor |
US3022448A (en) * | 1958-04-15 | 1962-02-20 | Gen Electric | Modular electronic sub-assemblies and method of fabricating |
US3098955A (en) * | 1959-07-31 | 1963-07-23 | Benjamin L Davis | Tape capacitor |
US3200298A (en) * | 1963-05-27 | 1965-08-10 | United Aircraft Corp | Multilayer ceramic circuitry |
EP3785497A4 (en) * | 2018-06-07 | 2022-06-08 | The Governors Of The University Of Alberta | Elastic printed conductors |
US11849540B2 (en) | 2018-06-07 | 2023-12-19 | The Governors Of The University Of Alberta | Elastic printed conductors |
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