GB1126079A - A heat dissipator for an electric circuit component - Google Patents

A heat dissipator for an electric circuit component

Info

Publication number
GB1126079A
GB1126079A GB1577966A GB1577966A GB1126079A GB 1126079 A GB1126079 A GB 1126079A GB 1577966 A GB1577966 A GB 1577966A GB 1577966 A GB1577966 A GB 1577966A GB 1126079 A GB1126079 A GB 1126079A
Authority
GB
United Kingdom
Prior art keywords
plate
wires
wire
undulations
coils
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1577966A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chausson Usines SA
Original Assignee
Chausson Usines SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chausson Usines SA filed Critical Chausson Usines SA
Publication of GB1126079A publication Critical patent/GB1126079A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1577966A 1965-04-07 1966-04-07 A heat dissipator for an electric circuit component Expired GB1126079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR12342A FR1439195A (fr) 1965-04-07 1965-04-07 Dissipateur de chaleur pour composants électroniques divers, notamment pour transistors

Publications (1)

Publication Number Publication Date
GB1126079A true GB1126079A (en) 1968-09-05

Family

ID=8575877

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1577966A Expired GB1126079A (en) 1965-04-07 1966-04-07 A heat dissipator for an electric circuit component

Country Status (6)

Country Link
BE (1) BE679248A (fr)
DE (1) DE1564562C3 (fr)
ES (1) ES325322A1 (fr)
FR (1) FR1439195A (fr)
GB (1) GB1126079A (fr)
NL (1) NL6604678A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4915858U (fr) * 1972-05-12 1974-02-09
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element
US5195576A (en) * 1990-02-28 1993-03-23 Hitachi, Ltd. Lsi cooling apparatus and computer cooling apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4915858U (fr) * 1972-05-12 1974-02-09
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element
US5195576A (en) * 1990-02-28 1993-03-23 Hitachi, Ltd. Lsi cooling apparatus and computer cooling apparatus

Also Published As

Publication number Publication date
BE679248A (fr) 1966-09-16
ES325322A1 (es) 1967-01-01
FR1439195A (fr) 1966-05-20
DE1564562A1 (de) 1970-10-15
DE1564562B2 (de) 1973-09-13
DE1564562C3 (de) 1974-04-18
NL6604678A (fr) 1966-10-10

Similar Documents

Publication Publication Date Title
CN106233552A (zh) 电路结构体及电连接箱
ES411907A1 (es) Perfeccionamientos en motores de induccion.
GB1126079A (en) A heat dissipator for an electric circuit component
US3170130A (en) Transformer cooling using thermoelectric devices
GB1111293A (en) Improvements in or relating to electro-mechanical transducers
US2502044A (en) Resistor support
US2290901A (en) Electric heating element
JP2885857B2 (ja) 電磁調理器
US1599842A (en) Ignition coil
JPS60175345A (ja) 偏向ヨ−ク
JPH0917564A (ja) 誘導加熱調理器
NL153722B (nl) Halfgeleiderelement in een huis.
JP2016207705A (ja) 半導体装置
US2274845A (en) Resistance device
GB1157052A (en) Improvements in or relating to Electrical Connections
JPS6240438Y2 (fr)
JPH11251780A (ja) シールド部材のアース構造
JPH0732219B2 (ja) 半導体装置
JPS6062168A (ja) 固体発光表示装置
JPS62163285A (ja) 電磁調理器
JP2944588B2 (ja) 半導体装置及び半導体装置用リードフレーム
JPS5844636Y2 (ja) 混成集積回路装置
JPS5943741Y2 (ja) 半導体整流装置
JP2017028057A (ja) 電子回路装置
JPS56153962A (en) Manufacture of armature for flat motor