NL153722B - Halfgeleiderelement in een huis. - Google Patents

Halfgeleiderelement in een huis.

Info

Publication number
NL153722B
NL153722B NL666601886A NL6601886A NL153722B NL 153722 B NL153722 B NL 153722B NL 666601886 A NL666601886 A NL 666601886A NL 6601886 A NL6601886 A NL 6601886A NL 153722 B NL153722 B NL 153722B
Authority
NL
Netherlands
Prior art keywords
gold
bonding layer
semi
casing
gold wires
Prior art date
Application number
NL666601886A
Other languages
English (en)
Other versions
NL6601886A (nl
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of NL6601886A publication Critical patent/NL6601886A/xx
Publication of NL153722B publication Critical patent/NL153722B/nl

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
NL666601886A 1965-02-16 1966-02-14 Halfgeleiderelement in een huis. NL153722B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEJ27519A DE1283969B (de) 1965-02-16 1965-02-16 Halbleiterbauelement mit elektrisch isolierendem Zwischenkoerper zwischen dem Halbleiterkoerper und einem Gehaeuseteil, sowie Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
NL6601886A NL6601886A (nl) 1966-08-17
NL153722B true NL153722B (nl) 1977-06-15

Family

ID=7202990

Family Applications (1)

Application Number Title Priority Date Filing Date
NL666601886A NL153722B (nl) 1965-02-16 1966-02-14 Halfgeleiderelement in een huis.

Country Status (6)

Country Link
US (1) US3471752A (nl)
BE (1) BE676467A (nl)
DE (1) DE1283969B (nl)
GB (1) GB1066200A (nl)
IE (1) IE29877L (nl)
NL (1) NL153722B (nl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631892B2 (nl) * 1972-04-27 1981-07-24
JPS49113555U (nl) * 1973-01-25 1974-09-27
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Also Published As

Publication number Publication date
US3471752A (en) 1969-10-07
NL6601886A (nl) 1966-08-17
IE29877L (en) 1966-08-16
DE1283969B (de) 1968-11-28
BE676467A (nl) 1966-08-16
GB1066200A (en) 1967-04-19

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