GB1396680A - Hermetically sealed semi-conductor device - Google Patents

Hermetically sealed semi-conductor device

Info

Publication number
GB1396680A
GB1396680A GB5522973A GB5522973A GB1396680A GB 1396680 A GB1396680 A GB 1396680A GB 5522973 A GB5522973 A GB 5522973A GB 5522973 A GB5522973 A GB 5522973A GB 1396680 A GB1396680 A GB 1396680A
Authority
GB
United Kingdom
Prior art keywords
carrier
border
metallizations
supported
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5522973A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power Hybrids Inc
Original Assignee
Power Hybrids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Hybrids Inc filed Critical Power Hybrids Inc
Priority to SE7414385A priority Critical patent/SE404634B/en
Publication of GB1396680A publication Critical patent/GB1396680A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

1396680 Semi-conductor devices POWER HYBRIDS Inc 28 Nov 1973 [30 Nov 1972] 55229/73 Heading H1K An hermetically sealed housing for a semiconductor device 100 comprises a ceramic carrier 10 having apertures 13, 14 therethrough lined by metallizations 15, 16, the metallizations making sealed contact with external leads 43, 44, the carrier having a metallic border 21 thereon, the border being sealed to a metallic border 42 of a ceramic cap 40. A gold or gold plated ring 30 may be interposed between borders 21 and 42 and include external leads 32, the ring also including a bridge portion 31. The carrier may be supported on a heat sink 50. The metallizations 15, 16 may be isolated from the border 21 by metal-free channels 18, the border haying bridge portions 22, 23 between the apertures 13 14. The semi-conductor device 100 may be supported on a further, isolated, metallization 17 and have connections to 15, 16 and 21. The device may be a diode or transistor in series with a capacitor supported by the bridge portion 31. The carrier may be of beryllium oxide, the metallizations being brazed to the carrier.
GB5522973A 1972-11-30 1973-11-28 Hermetically sealed semi-conductor device Expired GB1396680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE7414385A SE404634B (en) 1973-11-28 1974-11-15 WITH FASHION IMPLEMENTATION WORKING RADION NAVIGATION SYSTEM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31095072A 1972-11-30 1972-11-30

Publications (1)

Publication Number Publication Date
GB1396680A true GB1396680A (en) 1975-06-04

Family

ID=23204743

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5522973A Expired GB1396680A (en) 1972-11-30 1973-11-28 Hermetically sealed semi-conductor device

Country Status (2)

Country Link
JP (1) JPS5733705B2 (en)
GB (1) GB1396680A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2238908A (en) * 1989-12-05 1991-06-12 Mitsubishi Electric Corp High-frequency semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2238908A (en) * 1989-12-05 1991-06-12 Mitsubishi Electric Corp High-frequency semiconductor device
GB2238908B (en) * 1989-12-05 1993-09-22 Mitsubishi Electric Corp High-frequency semiconductor device

Also Published As

Publication number Publication date
JPS4988478A (en) 1974-08-23
JPS5733705B2 (en) 1982-07-19

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee