GB1108778A - Improvements in and relating to methods of manufacturing semiconductor devices - Google Patents

Improvements in and relating to methods of manufacturing semiconductor devices

Info

Publication number
GB1108778A
GB1108778A GB38976/65A GB3897665A GB1108778A GB 1108778 A GB1108778 A GB 1108778A GB 38976/65 A GB38976/65 A GB 38976/65A GB 3897665 A GB3897665 A GB 3897665A GB 1108778 A GB1108778 A GB 1108778A
Authority
GB
United Kingdom
Prior art keywords
sheet
metal
oxide
anodization
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB38976/65A
Other languages
English (en)
Inventor
Ronald John Dean
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSOCIATED SEMICONDUCTOR MFT
Original Assignee
ASSOCIATED SEMICONDUCTOR MFT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASSOCIATED SEMICONDUCTOR MFT filed Critical ASSOCIATED SEMICONDUCTOR MFT
Priority to GB38976/65A priority Critical patent/GB1108778A/en
Priority to NL6612709A priority patent/NL6612709A/xx
Priority to DE19661564443 priority patent/DE1564443C3/de
Priority to ES0331088A priority patent/ES331088A1/es
Priority to CH1314566A priority patent/CH470760A/de
Priority to BE686760D priority patent/BE686760A/xx
Priority to US578631A priority patent/US3435514A/en
Priority to AT857966A priority patent/AT271570B/de
Priority to FR76173A priority patent/FR1497685A/fr
Publication of GB1108778A publication Critical patent/GB1108778A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
GB38976/65A 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices Expired GB1108778A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
GB38976/65A GB1108778A (en) 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices
NL6612709A NL6612709A (enExample) 1965-09-13 1966-09-09
DE19661564443 DE1564443C3 (de) 1965-09-13 1966-09-10 Verfahren zur Herstellung einer Halbleiteranordnung
ES0331088A ES331088A1 (es) 1965-09-13 1966-09-10 Un metodo de fabricar un dispositivo semiconductor.
CH1314566A CH470760A (de) 1965-09-13 1966-09-12 Verfahren zur Herstellung einer Halbleitervorrichtung
BE686760D BE686760A (enExample) 1965-09-13 1966-09-12
US578631A US3435514A (en) 1965-09-13 1966-09-12 Methods of manufacturing semiconductor devices
AT857966A AT271570B (de) 1965-09-13 1966-09-12 Verfahren zur Herstellung einer Halbleitervorrichtung
FR76173A FR1497685A (fr) 1965-09-13 1966-09-13 Procédé de fabrication d'un dispositif semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB38976/65A GB1108778A (en) 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
GB1108778A true GB1108778A (en) 1968-04-03

Family

ID=10406859

Family Applications (1)

Application Number Title Priority Date Filing Date
GB38976/65A Expired GB1108778A (en) 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices

Country Status (7)

Country Link
US (1) US3435514A (enExample)
AT (1) AT271570B (enExample)
BE (1) BE686760A (enExample)
CH (1) CH470760A (enExample)
ES (1) ES331088A1 (enExample)
GB (1) GB1108778A (enExample)
NL (1) NL6612709A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137809A (en) * 1983-02-25 1984-10-10 Shinko Electric Ind Co A ceramic package for semiconductor devices

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529759A (en) * 1967-06-15 1970-09-22 Bell Telephone Labor Inc Apparatus for bonding a beam-lead device to a substrate
FR2704094B1 (fr) * 1993-04-13 1995-07-07 Sgs Thomson Microelectronics Réseau de diodes monolithique.
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744308A (en) * 1950-11-17 1956-05-08 Bell Telephone Labor Inc Semi-conductor translating device and method of manufacture
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137809A (en) * 1983-02-25 1984-10-10 Shinko Electric Ind Co A ceramic package for semiconductor devices

Also Published As

Publication number Publication date
ES331088A1 (es) 1967-07-01
BE686760A (enExample) 1967-03-13
NL6612709A (enExample) 1967-03-14
AT271570B (de) 1969-06-10
DE1564443A1 (de) 1970-05-27
DE1564443B2 (de) 1975-06-26
CH470760A (de) 1969-03-31
US3435514A (en) 1969-04-01

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