NL6612709A - - Google Patents

Info

Publication number
NL6612709A
NL6612709A NL6612709A NL6612709A NL6612709A NL 6612709 A NL6612709 A NL 6612709A NL 6612709 A NL6612709 A NL 6612709A NL 6612709 A NL6612709 A NL 6612709A NL 6612709 A NL6612709 A NL 6612709A
Authority
NL
Netherlands
Application number
NL6612709A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6612709A publication Critical patent/NL6612709A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
NL6612709A 1965-09-13 1966-09-09 NL6612709A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB38976/65A GB1108778A (en) 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
NL6612709A true NL6612709A (enExample) 1967-03-14

Family

ID=10406859

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6612709A NL6612709A (enExample) 1965-09-13 1966-09-09

Country Status (7)

Country Link
US (1) US3435514A (enExample)
AT (1) AT271570B (enExample)
BE (1) BE686760A (enExample)
CH (1) CH470760A (enExample)
ES (1) ES331088A1 (enExample)
GB (1) GB1108778A (enExample)
NL (1) NL6612709A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529759A (en) * 1967-06-15 1970-09-22 Bell Telephone Labor Inc Apparatus for bonding a beam-lead device to a substrate
JPS59155950A (ja) * 1983-02-25 1984-09-05 Shinko Electric Ind Co Ltd 半導体装置用セラミックパッケージ
FR2704094B1 (fr) * 1993-04-13 1995-07-07 Sgs Thomson Microelectronics Réseau de diodes monolithique.
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744308A (en) * 1950-11-17 1956-05-08 Bell Telephone Labor Inc Semi-conductor translating device and method of manufacture
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices

Also Published As

Publication number Publication date
GB1108778A (en) 1968-04-03
ES331088A1 (es) 1967-07-01
BE686760A (enExample) 1967-03-13
AT271570B (de) 1969-06-10
DE1564443A1 (de) 1970-05-27
DE1564443B2 (de) 1975-06-26
CH470760A (de) 1969-03-31
US3435514A (en) 1969-04-01

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