ES331088A1 - Un metodo de fabricar un dispositivo semiconductor. - Google Patents

Un metodo de fabricar un dispositivo semiconductor.

Info

Publication number
ES331088A1
ES331088A1 ES0331088A ES331088A ES331088A1 ES 331088 A1 ES331088 A1 ES 331088A1 ES 0331088 A ES0331088 A ES 0331088A ES 331088 A ES331088 A ES 331088A ES 331088 A1 ES331088 A1 ES 331088A1
Authority
ES
Spain
Prior art keywords
contacts
connection conductors
manufacturing
semiconductor device
semiconductor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0331088A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES331088A1 publication Critical patent/ES331088A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
ES0331088A 1965-09-13 1966-09-10 Un metodo de fabricar un dispositivo semiconductor. Expired ES331088A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB38976/65A GB1108778A (en) 1965-09-13 1965-09-13 Improvements in and relating to methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
ES331088A1 true ES331088A1 (es) 1967-07-01

Family

ID=10406859

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0331088A Expired ES331088A1 (es) 1965-09-13 1966-09-10 Un metodo de fabricar un dispositivo semiconductor.

Country Status (7)

Country Link
US (1) US3435514A (enExample)
AT (1) AT271570B (enExample)
BE (1) BE686760A (enExample)
CH (1) CH470760A (enExample)
ES (1) ES331088A1 (enExample)
GB (1) GB1108778A (enExample)
NL (1) NL6612709A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529759A (en) * 1967-06-15 1970-09-22 Bell Telephone Labor Inc Apparatus for bonding a beam-lead device to a substrate
JPS59155950A (ja) * 1983-02-25 1984-09-05 Shinko Electric Ind Co Ltd 半導体装置用セラミックパッケージ
FR2704094B1 (fr) * 1993-04-13 1995-07-07 Sgs Thomson Microelectronics Réseau de diodes monolithique.
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744308A (en) * 1950-11-17 1956-05-08 Bell Telephone Labor Inc Semi-conductor translating device and method of manufacture
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices

Also Published As

Publication number Publication date
GB1108778A (en) 1968-04-03
BE686760A (enExample) 1967-03-13
NL6612709A (enExample) 1967-03-14
AT271570B (de) 1969-06-10
DE1564443A1 (de) 1970-05-27
DE1564443B2 (de) 1975-06-26
CH470760A (de) 1969-03-31
US3435514A (en) 1969-04-01

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