FR2295678A1 - Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede - Google Patents

Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Info

Publication number
FR2295678A1
FR2295678A1 FR7539075A FR7539075A FR2295678A1 FR 2295678 A1 FR2295678 A1 FR 2295678A1 FR 7539075 A FR7539075 A FR 7539075A FR 7539075 A FR7539075 A FR 7539075A FR 2295678 A1 FR2295678 A1 FR 2295678A1
Authority
FR
France
Prior art keywords
conductors
layer
insulation
substrate
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7539075A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2295678A1 publication Critical patent/FR2295678A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR7539075A 1974-12-19 1975-12-19 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede Withdrawn FR2295678A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (de) 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen

Publications (1)

Publication Number Publication Date
FR2295678A1 true FR2295678A1 (fr) 1976-07-16

Family

ID=3620430

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7539075A Withdrawn FR2295678A1 (fr) 1974-12-19 1975-12-19 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Country Status (7)

Country Link
AT (1) ATA1017674A (fr)
BE (1) BE836866A (fr)
DE (1) DE2556826A1 (fr)
FR (1) FR2295678A1 (fr)
IT (1) IT1068815B (fr)
NL (1) NL7514723A (fr)
SE (1) SE7514432L (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194655A2 (fr) * 1985-03-14 1986-09-17 Kabushiki Kaisha Toshiba Support pour circuit imprimé et procédé pour sa fabrication
EP0232026A2 (fr) * 1986-01-30 1987-08-12 Imperial Chemical Industries Plc Circuits multicouches et leur méthode de production
EP0936849A1 (fr) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Assemblage à circuit imprimé et son procédé de fabrication

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255676B (en) * 1991-05-08 1995-09-27 Fuji Electric Co Ltd Metallic printed board
DE112004001263D2 (de) * 2003-07-17 2006-03-23 Ksg Leiterplatten Gmbh Schichtanordnung für ein mit elektronischen Bauelementen bestückbaren Trägerbauteil und Verfahren zur Herstellung
DE10339692A1 (de) * 2003-08-28 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Entwärmende Isolationsschicht
DE102005002508B4 (de) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Leiterplatte mit Oxidationsschicht
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
WO2007140495A2 (fr) * 2006-06-07 2007-12-13 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Procédé de fabrication d'un support de circuit
DE102011108198A1 (de) * 2011-07-22 2012-03-29 Fela Holding Gmbh Metallkernleiterplatte mit Eloxalschicht

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194655A2 (fr) * 1985-03-14 1986-09-17 Kabushiki Kaisha Toshiba Support pour circuit imprimé et procédé pour sa fabrication
EP0194655A3 (en) * 1985-03-14 1987-08-12 Kabushiki Kaisha Toshiba Print circuit board and method of manufacturing the same
US4704318A (en) * 1985-03-14 1987-11-03 Kabushiki Kaisha Toshiba Print circuit board
EP0232026A2 (fr) * 1986-01-30 1987-08-12 Imperial Chemical Industries Plc Circuits multicouches et leur méthode de production
EP0232026A3 (fr) * 1986-01-30 1988-07-27 Imperial Chemical Industries Plc Circuits multicouches et leur méthode de production
EP0936849A1 (fr) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Assemblage à circuit imprimé et son procédé de fabrication

Also Published As

Publication number Publication date
NL7514723A (nl) 1976-06-22
BE836866A (fr) 1976-04-16
SE7514432L (sv) 1976-06-21
ATA1017674A (de) 1976-06-15
IT1068815B (it) 1985-03-21
DE2556826A1 (de) 1976-06-24

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Legal Events

Date Code Title Description
ST Notification of lapse