IT1068815B - Procedimento per fabbricare circuiti stampati e circuitio stampa to ottenuto secondo questo procedimento - Google Patents

Procedimento per fabbricare circuiti stampati e circuitio stampa to ottenuto secondo questo procedimento

Info

Publication number
IT1068815B
IT1068815B IT09657/75A IT965775A IT1068815B IT 1068815 B IT1068815 B IT 1068815B IT 09657/75 A IT09657/75 A IT 09657/75A IT 965775 A IT965775 A IT 965775A IT 1068815 B IT1068815 B IT 1068815B
Authority
IT
Italy
Prior art keywords
procedure
obtained according
printed circuits
printing circuit
circuit obtained
Prior art date
Application number
IT09657/75A
Other languages
English (en)
Inventor
Peter Blaha
Joseph Drasch
Original Assignee
Vockenhuber Karl
Hauser Raimund
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vockenhuber Karl, Hauser Raimund filed Critical Vockenhuber Karl
Application granted granted Critical
Publication of IT1068815B publication Critical patent/IT1068815B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
IT09657/75A 1974-12-19 1975-12-18 Procedimento per fabbricare circuiti stampati e circuitio stampa to ottenuto secondo questo procedimento IT1068815B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (de) 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen

Publications (1)

Publication Number Publication Date
IT1068815B true IT1068815B (it) 1985-03-21

Family

ID=3620430

Family Applications (1)

Application Number Title Priority Date Filing Date
IT09657/75A IT1068815B (it) 1974-12-19 1975-12-18 Procedimento per fabbricare circuiti stampati e circuitio stampa to ottenuto secondo questo procedimento

Country Status (7)

Country Link
AT (1) ATA1017674A (it)
BE (1) BE836866A (it)
DE (1) DE2556826A1 (it)
FR (1) FR2295678A1 (it)
IT (1) IT1068815B (it)
NL (1) NL7514723A (it)
SE (1) SE7514432L (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3663433D1 (en) * 1985-03-14 1989-06-22 Toshiba Kk Printed circuit board and method of manufacturing the same
GB8602330D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
US5316831A (en) * 1991-05-08 1994-05-31 Fuji Electric Co., Ltd. Metallic printed board
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
DE112004001263D2 (de) * 2003-07-17 2006-03-23 Ksg Leiterplatten Gmbh Schichtanordnung für ein mit elektronischen Bauelementen bestückbaren Trägerbauteil und Verfahren zur Herstellung
DE10339692A1 (de) * 2003-08-28 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Entwärmende Isolationsschicht
DE102005002508B4 (de) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Leiterplatte mit Oxidationsschicht
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
EP2025209B1 (de) * 2006-06-07 2013-03-27 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Verfahren zur herstellung eines schaltungsträgers
DE102011108198A1 (de) * 2011-07-22 2012-03-29 Fela Holding Gmbh Metallkernleiterplatte mit Eloxalschicht

Also Published As

Publication number Publication date
SE7514432L (sv) 1976-06-21
FR2295678A1 (fr) 1976-07-16
ATA1017674A (de) 1976-06-15
BE836866A (fr) 1976-04-16
DE2556826A1 (de) 1976-06-24
NL7514723A (nl) 1976-06-22

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