GB0719469D0 - Measurement apparatus and method - Google Patents

Measurement apparatus and method

Info

Publication number
GB0719469D0
GB0719469D0 GBGB0719469.9A GB0719469A GB0719469D0 GB 0719469 D0 GB0719469 D0 GB 0719469D0 GB 0719469 A GB0719469 A GB 0719469A GB 0719469 D0 GB0719469 D0 GB 0719469D0
Authority
GB
United Kingdom
Prior art keywords
wafer
weight
electrostatic
measurement
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0719469.9A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Priority to GBGB0719469.9A priority Critical patent/GB0719469D0/en
Publication of GB0719469D0 publication Critical patent/GB0719469D0/en
Priority to US12/680,756 priority patent/US8683880B2/en
Priority to EP08806451A priority patent/EP2201340B1/en
Priority to PCT/GB2008/003301 priority patent/WO2009044121A1/en
Priority to AT08806451T priority patent/ATE510194T1/de
Priority to JP2010527517A priority patent/JP5414124B2/ja
Priority to TW097138323A priority patent/TWI424149B/zh
Priority to US14/187,422 priority patent/US9310244B2/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/14—Devices for determining tare weight or for cancelling out the tare by zeroising, e.g. mechanically operated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/22—Weigh pans or other weighing receptacles; Weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
GBGB0719469.9A 2007-10-04 2007-10-04 Measurement apparatus and method Ceased GB0719469D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GBGB0719469.9A GB0719469D0 (en) 2007-10-04 2007-10-04 Measurement apparatus and method
US12/680,756 US8683880B2 (en) 2007-10-04 2008-09-30 Semiconductor wafer metrology apparatus and method
EP08806451A EP2201340B1 (en) 2007-10-04 2008-09-30 Semiconductor wafer metrology apparatus and method
PCT/GB2008/003301 WO2009044121A1 (en) 2007-10-04 2008-09-30 Semiconductor wafer metrology apparatus and method
AT08806451T ATE510194T1 (de) 2007-10-04 2008-09-30 Vorrichtung und verfahren zur metrologie von halbleiterwafern
JP2010527517A JP5414124B2 (ja) 2007-10-04 2008-09-30 半導体ウェハ計測装置および方法
TW097138323A TWI424149B (zh) 2007-10-04 2008-10-03 半導體晶圓量測裝置和方法
US14/187,422 US9310244B2 (en) 2007-10-04 2014-02-24 Semiconductor wafer metrology apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0719469.9A GB0719469D0 (en) 2007-10-04 2007-10-04 Measurement apparatus and method

Publications (1)

Publication Number Publication Date
GB0719469D0 true GB0719469D0 (en) 2007-11-14

Family

ID=38739182

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0719469.9A Ceased GB0719469D0 (en) 2007-10-04 2007-10-04 Measurement apparatus and method

Country Status (7)

Country Link
US (2) US8683880B2 (https=)
EP (1) EP2201340B1 (https=)
JP (1) JP5414124B2 (https=)
AT (1) ATE510194T1 (https=)
GB (1) GB0719469D0 (https=)
TW (1) TWI424149B (https=)
WO (1) WO2009044121A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108627226A (zh) * 2017-05-10 2018-10-09 新疆畜牧科学院畜牧业质量标准研究所 电场同性静电荷互斥式毛绒称重器

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GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
EP2426468B1 (de) * 2010-09-02 2018-05-23 Mettler-Toledo GmbH Verfahren zur Bereitstellung von Proben
DE102011001354B4 (de) * 2011-03-17 2014-06-26 Sartorius Lab Instruments Gmbh & Co. Kg Windschutz für eine Präzisionswaage
US9709327B2 (en) * 2011-03-17 2017-07-18 Dry Ventures, Inc. Rapid rescue of inundated cellphones
US10240867B2 (en) 2012-02-01 2019-03-26 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US11713924B2 (en) 2012-02-01 2023-08-01 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
PL2757354T3 (pl) * 2013-01-22 2016-03-31 Mettler Toledo Gmbh Detekcja sił elektrostatycznych
CN103292934B (zh) * 2013-05-15 2015-04-08 北京京东方光电科技有限公司 一种承载物检测系统
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
DE102014101563A1 (de) * 2013-11-08 2015-05-13 Sartorius Lab Instruments Gmbh & Co. Kg Präzisionswaage oder Massekomparator mit Modul zur Messunsicherheitsbestimmung
GB201321423D0 (en) * 2013-12-04 2014-01-15 Metryx Ltd Semiconductor wafer processing methods and apparatus
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
JP6288026B2 (ja) * 2015-09-28 2018-03-07 株式会社タツノ 校正装置
JP6288027B2 (ja) * 2015-09-28 2018-03-07 株式会社タツノ 校正装置及び校正方法
CN205909927U (zh) * 2016-07-06 2017-01-25 中山市永衡日用制品有限公司 一种旋钮式发电的电子秤
GB201806377D0 (en) 2018-04-19 2018-06-06 Metryx Ltd Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
GB201815815D0 (en) 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN111336914B (zh) * 2020-03-25 2021-12-10 长江存储科技有限责任公司 晶圆翘曲度测量装置及方法
CN113819985A (zh) * 2020-06-18 2021-12-21 拓荆科技股份有限公司 晶圆防干扰称重装置及其应用
DE102021104307B4 (de) * 2021-02-23 2025-03-13 Sartorius Lab Instruments Gmbh & Co. Kg Verfahren zum Betrieb einer Waage mit Ionisator
US20250102349A1 (en) 2022-01-14 2025-03-27 Metryx Ltd. Weighing device
GB202218260D0 (en) * 2022-12-05 2023-01-18 Metryx Ltd Apparatus for measuring the weight or mass of an object
GB202303542D0 (en) * 2023-03-10 2023-04-26 Metryx Ltd Apparatus for measuring the mass and/or the change in mass of an object
GB202410338D0 (en) 2024-07-16 2024-08-28 Metryx Ltd Apparatus for determining information relating to the weight or mass of a wafer

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JPH0432028A (ja) 1990-05-28 1992-02-04 Sony Corp 光ディスク再生装置
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JPH05129405A (ja) 1991-11-05 1993-05-25 Hitachi Ltd 成膜装置
JP2913962B2 (ja) * 1991-11-27 1999-06-28 株式会社島津製作所 板状試料測定用天びん
JP2647585B2 (ja) * 1991-11-28 1997-08-27 三菱電機株式会社 自動薄膜計測装置
DE4334470A1 (de) * 1993-10-10 1995-04-13 Brockhaus Peter Vorrichtung zur Messung kleiner Massen- oder Kraftdifferenzen
IT1264247B1 (it) * 1993-10-22 1996-09-23 Mg 2 Spa Metodo per la determinazione del peso di prodotti farmaceutici e macchina per la dosatura di prodotti farmaceutici utilizzante
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
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US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
DE19744618A1 (de) 1997-10-09 1999-04-22 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zur Bestimmung des Materialabtrags einer Halbleiterscheibe
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DE19849399A1 (de) * 1998-10-27 2000-05-04 Mettler Toledo Gmbh Windschutz für eine Waage und Waage mit einem Windschutz
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US6257046B1 (en) * 1999-11-22 2001-07-10 Kang Na Hsiung Enterprise Co., Ltd. Method and apparatus for determining electrostatic force present in an object
JP4486217B2 (ja) 2000-05-01 2010-06-23 浜松ホトニクス株式会社 厚み計測装置、及びそれを用いたウエットエッチング装置、ウエットエッチング方法
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6603081B2 (en) * 2000-10-04 2003-08-05 Mettler-Toledo Gmbh Balance with a weighing compartment
DE20104455U1 (de) * 2001-03-14 2001-05-17 Harro Höfliger Verpackungsmaschinen GmbH, 71573 Allmersbach Waage zum Verwiegen von Pulver enthaltenden Blisterpackungen
US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same
US6719142B1 (en) * 2002-07-16 2004-04-13 Ion Systems, Inc. Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays
CA2460683A1 (en) * 2002-07-17 2004-01-22 Teijin Limited Method and device for weighing easily charged weighed object
JP2005274307A (ja) * 2004-03-24 2005-10-06 Fuji Photo Film Co Ltd 粉体の放電エネルギー測定方法、及び粉体投入時の安全性評価方法
EP1813920B1 (de) * 2006-01-27 2009-12-09 Mettler-Toledo AG Verfahren und Vorrichtung zum Betrieb einer Waage
EP1873504A1 (de) * 2006-06-28 2008-01-02 Mettler-Toledo AG Kalibriergewichtsanordnung für eine elektronische Waage
JP5149780B2 (ja) 2007-12-18 2013-02-20 住友ゴム工業株式会社 ランフラットタイヤに使用するケースおよび／またはブレーカーのトッピング用ゴム組成物およびそれを用いたランフラットタイヤ
TWI438736B (zh) 2008-07-29 2014-05-21 Advanced Optoelectronic Tech 燈箱裝置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108627226A (zh) * 2017-05-10 2018-10-09 新疆畜牧科学院畜牧业质量标准研究所 电场同性静电荷互斥式毛绒称重器
CN108627226B (zh) * 2017-05-10 2024-06-07 新疆畜牧科学院畜牧业质量标准研究所 电场同性静电荷互斥式毛绒称重器

Also Published As

Publication number Publication date
TW200938815A (en) 2009-09-16
EP2201340B1 (en) 2011-05-18
JP2010540952A (ja) 2010-12-24
US20100206098A1 (en) 2010-08-19
EP2201340A1 (en) 2010-06-30
JP5414124B2 (ja) 2014-02-12
WO2009044121A1 (en) 2009-04-09
US9310244B2 (en) 2016-04-12
US8683880B2 (en) 2014-04-01
TWI424149B (zh) 2014-01-21
ATE510194T1 (de) 2011-06-15
US20140231152A1 (en) 2014-08-21

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)