WO2012050375A3 - 측정장치 및 이의 보정방법 - Google Patents

측정장치 및 이의 보정방법 Download PDF

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Publication number
WO2012050375A3
WO2012050375A3 PCT/KR2011/007622 KR2011007622W WO2012050375A3 WO 2012050375 A3 WO2012050375 A3 WO 2012050375A3 KR 2011007622 W KR2011007622 W KR 2011007622W WO 2012050375 A3 WO2012050375 A3 WO 2012050375A3
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WO
WIPO (PCT)
Prior art keywords
measuring
correcting
phase
measured
state imaging
Prior art date
Application number
PCT/KR2011/007622
Other languages
English (en)
French (fr)
Other versions
WO2012050375A2 (ko
Inventor
이현기
권달안
전정열
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority to US13/879,539 priority Critical patent/US9250071B2/en
Publication of WO2012050375A2 publication Critical patent/WO2012050375A2/ko
Publication of WO2012050375A3 publication Critical patent/WO2012050375A3/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C11/00—Photogrammetry or videogrammetry, e.g. stereogrammetry; Photographic surveying
    • G01C11/02—Picture taking arrangements specially adapted for photogrammetry or photographic surveying, e.g. controlling overlapping of pictures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

본 발명은 측정대상물이 형성된 기판을 측정하는 측정장치 및 이의 보정방법에 관한 것으로, 본 발명의 보정방법에 따르면, 기준위상 측정을 위한 기판의 위상을 촬상부를 통해 측정하여 기준위상을 측정하고, 측정된 기준위상의 기준면이 촬상부의 이미지 평면에 대해 기울어진 자세를 획득한 후, 기울어진 자세를 기초로 촬상부에 대한 기준면의 보정이 필요한 높이를 산출한다. 이와 같이, 기준위상의 기울어진 자세를 기초로 높이 측정의 기준이 되는 기준면을 보정함으로써, 측정대상물의 측정 신뢰도를 향상시킬 수 있다.
PCT/KR2011/007622 2010-10-13 2011-10-13 측정장치 및 이의 보정방법 WO2012050375A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/879,539 US9250071B2 (en) 2010-10-13 2011-10-13 Measurement apparatus and correction method of the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100099607A KR101281454B1 (ko) 2010-10-13 2010-10-13 측정장치 및 이의 보정방법
KR10-2010-0099607 2010-10-13

Publications (2)

Publication Number Publication Date
WO2012050375A2 WO2012050375A2 (ko) 2012-04-19
WO2012050375A3 true WO2012050375A3 (ko) 2012-06-28

Family

ID=45938809

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/007622 WO2012050375A2 (ko) 2010-10-13 2011-10-13 측정장치 및 이의 보정방법

Country Status (3)

Country Link
US (1) US9250071B2 (ko)
KR (1) KR101281454B1 (ko)
WO (1) WO2012050375A2 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101358287B1 (ko) * 2012-04-27 2014-02-05 (주)하드램 레이저 빔 스캔 장치의 캘리브레이션 시스템
US9167314B2 (en) * 2012-05-21 2015-10-20 Video Expressions LLC Embedding information in an image
US20140293011A1 (en) * 2013-03-28 2014-10-02 Phasica, LLC Scanner System for Determining the Three Dimensional Shape of an Object and Method for Using
DE102013207598A1 (de) * 2013-04-25 2014-10-30 Finetech Gmbh & Co.Kg Platziervorrichtung und Platzierverfahren
KR20180040186A (ko) 2016-10-11 2018-04-20 삼성전자주식회사 검사 방법, 검사 시스템, 및 이를 이용한 반도체 패키지의 제조 방법
DE102017202651A1 (de) * 2017-02-20 2018-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zur Kalibrierung mittels projizierter Muster mit virtueller Ebene
CN110928324B (zh) * 2019-12-30 2023-07-14 北京润科通用技术有限公司 无人机飞行参数采集设备及其校准方法
CN113739703B (zh) * 2021-08-27 2024-09-10 浙江大学台州研究院 一种回转体扫描测量方法及其数据补偿校准方法
JP2023039753A (ja) * 2021-09-09 2023-03-22 Ｔｏｗａ株式会社 校正方法、及び電子部品の製造方法
JP2023039754A (ja) * 2021-09-09 2023-03-22 Ｔｏｗａ株式会社 メンテナンス方法、及び電子部品の製造方法
CN115541611B (zh) * 2022-09-29 2024-04-16 武汉大学 混凝土墙体外观图像采集系统参数检校方法及装置

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JPH06260393A (ja) * 1993-03-09 1994-09-16 Hitachi Ltd 位置決め装置
JP2003017536A (ja) * 2001-07-04 2003-01-17 Nec Corp パターン検査方法及び検査装置
JP2007129303A (ja) * 2005-11-01 2007-05-24 Olympus Corp 画像処理装置
KR100808536B1 (ko) * 2006-10-31 2008-03-06 (주) 이즈커뮤니케이션즈 패턴 영상을 이용한 캘리브레이션 방법
KR20090103152A (ko) * 2008-03-27 2009-10-01 호서대학교 산학협력단 반도체 패키지의 외관 검사를 위한 광학 시스템
JP4419980B2 (ja) * 2006-04-20 2010-02-24 横河電機株式会社 歪補正方法及び歪補正装置

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NL9000503A (nl) * 1990-03-05 1991-10-01 Asm Lithography Bv Apparaat en werkwijze voor het afbeelden van een maskerpatroon op een substraat.
DE69531854T2 (de) * 1994-08-02 2004-08-19 Koninklijke Philips Electronics N.V. Verfahren zur wiederholten abbildung eines maskenmusters auf einem substrat
US6151122A (en) * 1995-02-21 2000-11-21 Nikon Corporation Inspection method and apparatus for projection optical systems
US20060060781A1 (en) * 1997-08-11 2006-03-23 Masahiro Watanabe Charged-particle beam apparatus and method for automatically correcting astigmatism and for height detection
JP2003097931A (ja) 2001-09-21 2003-04-03 Olympus Optical Co Ltd 光学検査方法及びその装置
JP3779308B2 (ja) * 2004-07-21 2006-05-24 独立行政法人科学技術振興機構 カメラ校正システム及び三次元計測システム
JP2006292412A (ja) 2005-04-06 2006-10-26 Murakami Corp 表面検査装置、表面検査方法、及び基板の製造方法
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WO2009006919A1 (en) * 2007-07-09 2009-01-15 Carl Zeiss Smt Ag Method of measuring a deviation an optical surface from a target shape
JP5412757B2 (ja) 2008-07-25 2014-02-12 Ｊｆｅスチール株式会社 光学系歪補正方法および光学系歪補正装置
KR101237497B1 (ko) 2009-03-30 2013-02-26 주식회사 고영테크놀러지 검사영역의 설정방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260393A (ja) * 1993-03-09 1994-09-16 Hitachi Ltd 位置決め装置
JP2003017536A (ja) * 2001-07-04 2003-01-17 Nec Corp パターン検査方法及び検査装置
JP2007129303A (ja) * 2005-11-01 2007-05-24 Olympus Corp 画像処理装置
JP4419980B2 (ja) * 2006-04-20 2010-02-24 横河電機株式会社 歪補正方法及び歪補正装置
KR100808536B1 (ko) * 2006-10-31 2008-03-06 (주) 이즈커뮤니케이션즈 패턴 영상을 이용한 캘리브레이션 방법
KR20090103152A (ko) * 2008-03-27 2009-10-01 호서대학교 산학협력단 반도체 패키지의 외관 검사를 위한 광학 시스템

Also Published As

Publication number Publication date
WO2012050375A2 (ko) 2012-04-19
US20130222579A1 (en) 2013-08-29
KR101281454B1 (ko) 2013-07-03
US9250071B2 (en) 2016-02-02
KR20120038072A (ko) 2012-04-23

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