FR3037836A1 - - Google Patents

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Publication number
FR3037836A1
FR3037836A1 FR1655968A FR1655968A FR3037836A1 FR 3037836 A1 FR3037836 A1 FR 3037836A1 FR 1655968 A FR1655968 A FR 1655968A FR 1655968 A FR1655968 A FR 1655968A FR 3037836 A1 FR3037836 A1 FR 3037836A1
Authority
FR
France
Prior art keywords
polishing
cylindrical chamber
side liquid
inner cylindrical
polishing layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
FR1655968A
Other languages
English (en)
French (fr)
Inventor
Bainian Qian
Brufau Teresa Brugarolas
Julia Kozhukh
David Michael Veneziale
Yuhua Tong
Diego Lugo
George C Jacob
Jeffrey B Miller
Tony Quan Tran
Marc R Stack
Andrew Wank
Jeffrey James Hendron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/751,410 external-priority patent/US10011002B2/en
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3037836A1 publication Critical patent/FR3037836A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H10P52/402—
    • H10P52/403—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR1655968A 2015-06-26 2016-06-27 Ceased FR3037836A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/751,410 US10011002B2 (en) 2015-06-26 2015-06-26 Method of making composite polishing layer for chemical mechanical polishing pad
US15/163,184 US10092998B2 (en) 2015-06-26 2016-05-24 Method of making composite polishing layer for chemical mechanical polishing pad

Publications (1)

Publication Number Publication Date
FR3037836A1 true FR3037836A1 (enExample) 2016-12-30

Family

ID=57537191

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1655968A Ceased FR3037836A1 (enExample) 2015-06-26 2016-06-27

Country Status (7)

Country Link
US (1) US10092998B2 (enExample)
JP (1) JP6783562B2 (enExample)
KR (1) KR102499031B1 (enExample)
CN (1) CN107695869B (enExample)
DE (1) DE102016007772A1 (enExample)
FR (1) FR3037836A1 (enExample)
TW (1) TWI719028B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10144115B2 (en) 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9776300B2 (en) 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
CN105171593B (zh) * 2015-08-11 2017-12-26 湖北鼎龙控股股份有限公司 耐候性化学机械抛光垫
TWI642772B (zh) * 2017-03-31 2018-12-01 智勝科技股份有限公司 研磨墊及研磨方法
WO2019042428A1 (zh) * 2017-08-31 2019-03-07 湖北鼎汇微电子材料有限公司 一种聚氨酯抛光层、含抛光层的抛光垫、抛光层的制备方法及平坦化材料的方法
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
CN111571427B (zh) * 2020-05-22 2022-05-17 宁波江丰电子材料股份有限公司 一种保持环
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
JP7239049B1 (ja) 2022-02-18 2023-03-14 東洋インキＳｃホールディングス株式会社 研磨パッド用の湿気硬化型ホットメルト接着剤および研磨パッド
CN115365922B (zh) * 2022-10-24 2023-02-28 西安奕斯伟材料科技有限公司 研磨轮、研磨设备及硅片

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050171225A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
WO2012156690A2 (en) * 2011-05-13 2012-11-22 Mas Research And Innovation (Pvt) Ltd. A foam composition and its uses thereof
WO2014141889A1 (ja) * 2013-03-12 2014-09-18 国立大学法人九州大学 研磨パッド及び研磨方法

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DE2538437C3 (de) 1975-08-29 1980-05-08 Elastogran Maschinenbau Gmbh & Co, 8021 Strasslach Mischvorrichtung für Mehrkomponentenkunststoffe mit Poren- oder Zellenstruktur, insbesondere Polyurethan
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US5110081A (en) * 1990-09-26 1992-05-05 Lang Jr William O Vibration-isolating mount
US5163584A (en) 1990-12-18 1992-11-17 Polyfoam Products, Inc. Method and apparatus for mixing and dispensing foam with injected low pressure gas
CN1137013C (zh) * 1999-01-21 2004-02-04 罗德尔控股公司 改进的抛光垫及其抛光方法
US6315820B1 (en) 1999-10-19 2001-11-13 Ford Global Technologies, Inc. Method of manufacturing thin metal alloy foils
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US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
JP4313761B2 (ja) * 2002-11-18 2009-08-12 ドン ソン エイ アンド ティ カンパニー リミテッド 微細気孔が含まれたポリウレタン発泡体の製造方法及びそれから製造された研磨パッド
JP3776428B2 (ja) 2002-12-27 2006-05-17 株式会社加平 ポリウレタン発泡体シート及びそれを用いた積層体シートの製造方法
JP3872081B2 (ja) * 2004-12-29 2007-01-24 東邦エンジニアリング株式会社 研磨用パッド
DE102005058292A1 (de) 2005-12-07 2007-06-14 Hennecke Gmbh Verfahren und Vorrichtung zur Herstellung von beschichteten Formteilen
US8192257B2 (en) * 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads
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US20090094900A1 (en) 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
SG11201402224WA (en) * 2011-11-29 2014-09-26 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
EP2974089A4 (en) 2013-03-14 2017-03-08 Zte Wistron Telecom Ab Method and apparatus to adapt the number of harq processes in a distributed network topology
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
JP6184856B2 (ja) * 2013-12-16 2017-08-23 株式会社クラレ 研磨パッドの製造方法および該研磨パッドを用いる研磨方法
US10005172B2 (en) 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
US9586305B2 (en) 2015-06-26 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and method of making same
US10105825B2 (en) 2015-06-26 2018-10-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US10144115B2 (en) 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9776300B2 (en) 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050171225A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
WO2012156690A2 (en) * 2011-05-13 2012-11-22 Mas Research And Innovation (Pvt) Ltd. A foam composition and its uses thereof
WO2014141889A1 (ja) * 2013-03-12 2014-09-18 国立大学法人九州大学 研磨パッド及び研磨方法
EP2974829A1 (en) * 2013-03-12 2016-01-20 Kyushu University, National University Corporation Polishing pad and polishing method

Also Published As

Publication number Publication date
KR102499031B1 (ko) 2023-02-14
DE102016007772A1 (de) 2016-12-29
JP6783562B2 (ja) 2020-11-11
CN107695869A (zh) 2018-02-16
KR20170001627A (ko) 2017-01-04
CN107695869B (zh) 2019-06-21
TW201700556A (zh) 2017-01-01
JP2017052079A (ja) 2017-03-16
US20160375554A1 (en) 2016-12-29
US10092998B2 (en) 2018-10-09
TWI719028B (zh) 2021-02-21

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Effective date: 20200610