FR2915625B1 - Procede de transfert d'une couche epitaxiale - Google Patents
Procede de transfert d'une couche epitaxialeInfo
- Publication number
- FR2915625B1 FR2915625B1 FR0754777A FR0754777A FR2915625B1 FR 2915625 B1 FR2915625 B1 FR 2915625B1 FR 0754777 A FR0754777 A FR 0754777A FR 0754777 A FR0754777 A FR 0754777A FR 2915625 B1 FR2915625 B1 FR 2915625B1
- Authority
- FR
- France
- Prior art keywords
- transferring
- epitaxial layer
- epitaxial
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754777A FR2915625B1 (fr) | 2007-04-27 | 2007-04-27 | Procede de transfert d'une couche epitaxiale |
CN2008800066321A CN101636833B (zh) | 2007-04-27 | 2008-04-15 | 转移外延层的方法 |
PCT/IB2008/000967 WO2008132569A1 (fr) | 2007-04-27 | 2008-04-15 | Procédé pour transférer une couche épitaxiale |
JP2010504889A JP5380429B2 (ja) | 2007-04-27 | 2008-04-15 | エピタキシャル層を移動させる方法 |
KR1020097018793A KR101527063B1 (ko) | 2007-04-27 | 2008-04-15 | 에피택시층 이동 방법 |
US12/528,573 US7981768B2 (en) | 2007-04-27 | 2008-04-15 | Method for transferring an epitaxial layer |
EP08737488A EP2140488A1 (fr) | 2007-04-27 | 2008-04-15 | Procédé pour transférer une couche épitaxiale |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754777A FR2915625B1 (fr) | 2007-04-27 | 2007-04-27 | Procede de transfert d'une couche epitaxiale |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2915625A1 FR2915625A1 (fr) | 2008-10-31 |
FR2915625B1 true FR2915625B1 (fr) | 2009-10-02 |
Family
ID=39212207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0754777A Active FR2915625B1 (fr) | 2007-04-27 | 2007-04-27 | Procede de transfert d'une couche epitaxiale |
Country Status (7)
Country | Link |
---|---|
US (1) | US7981768B2 (fr) |
EP (1) | EP2140488A1 (fr) |
JP (1) | JP5380429B2 (fr) |
KR (1) | KR101527063B1 (fr) |
CN (1) | CN101636833B (fr) |
FR (1) | FR2915625B1 (fr) |
WO (1) | WO2008132569A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2467935B (en) | 2009-02-19 | 2013-10-30 | Iqe Silicon Compounds Ltd | Formation of thin layers of GaAs and germanium materials |
US8492325B2 (en) | 2010-03-01 | 2013-07-23 | The Procter & Gamble Company | Dual-usage liquid laundry detergents comprising a silicone anti-foam |
DE102010046215B4 (de) | 2010-09-21 | 2019-01-03 | Infineon Technologies Austria Ag | Halbleiterkörper mit verspanntem Bereich, Elektronisches Bauelement und ein Verfahren zum Erzeugen des Halbleiterkörpers. |
US9548218B2 (en) | 2012-02-07 | 2017-01-17 | The Regents Of The University Of Michigan | Thermal surface treatment for reuse of wafers after epitaxial lift off |
US9257339B2 (en) * | 2012-05-04 | 2016-02-09 | Silicon Genesis Corporation | Techniques for forming optoelectronic devices |
CN103839976A (zh) * | 2012-11-27 | 2014-06-04 | 中国科学院微电子研究所 | 一种硅基绝缘体上砷化镓衬底结构及其制备方法 |
US9064789B2 (en) | 2013-08-12 | 2015-06-23 | International Business Machines Corporation | Bonded epitaxial oxide structures for compound semiconductor on silicon substrates |
JP2015065241A (ja) * | 2013-09-24 | 2015-04-09 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
DE102013020693A1 (de) * | 2013-12-04 | 2015-06-11 | Siltectra Gmbh | Verfahren zum Erzeugen großflächiger Festkörperschichten |
CN108598218B (zh) * | 2018-04-26 | 2020-08-11 | 上海空间电源研究所 | 一种外延层刚性-柔性衬底无机键合转移方法 |
CN109545999B (zh) * | 2018-11-21 | 2021-05-04 | 京东方科技集团股份有限公司 | 初始显示装置和柔性显示面板的制造方法 |
CN111893566A (zh) * | 2020-07-21 | 2020-11-06 | 璨隆科技发展有限公司 | 一种氮化镓晶体的制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
JP3112106B2 (ja) * | 1991-10-11 | 2000-11-27 | キヤノン株式会社 | 半導体基材の作製方法 |
EP1758169A3 (fr) * | 1996-08-27 | 2007-05-23 | Seiko Epson Corporation | Méthode de séparation, procédé de transfert d'un dispositif à film mince, et dispositif d'affichage à cristaux liquides obtenu par application du procédé de transfert |
DE19640594B4 (de) * | 1996-10-01 | 2016-08-04 | Osram Gmbh | Bauelement |
US6210479B1 (en) * | 1999-02-26 | 2001-04-03 | International Business Machines Corporation | Product and process for forming a semiconductor structure on a host substrate |
JP2002110949A (ja) * | 2000-09-28 | 2002-04-12 | Canon Inc | Soiの熱処理方法及び製造方法 |
WO2002082514A1 (fr) * | 2001-04-04 | 2002-10-17 | Massachusetts Institute Of Technology | Procede de fabrication d'un dispositif semi-conducteur |
US6723165B2 (en) * | 2001-04-13 | 2004-04-20 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating Group III nitride semiconductor substrate |
JP3803606B2 (ja) * | 2001-04-13 | 2006-08-02 | 松下電器産業株式会社 | Iii族窒化物半導体基板の製造方法 |
DE602004013292T2 (de) * | 2004-06-11 | 2009-05-28 | S.O.I. Tec Silicon On Insulator Technologies S.A. | Verfahren zur Herstellung eines Verbundsubstrats |
JP2006287166A (ja) * | 2005-04-05 | 2006-10-19 | Advanced Lcd Technologies Development Center Co Ltd | 半導体素子保持装置、半導体素子の剥離方法および表示装置 |
JP2006344865A (ja) * | 2005-06-10 | 2006-12-21 | Toyoko Kagaku Co Ltd | Soi基板及び該基板の製造方法 |
US7608471B2 (en) * | 2005-08-09 | 2009-10-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method and apparatus for integrating III-V semiconductor devices into silicon processes |
-
2007
- 2007-04-27 FR FR0754777A patent/FR2915625B1/fr active Active
-
2008
- 2008-04-15 CN CN2008800066321A patent/CN101636833B/zh active Active
- 2008-04-15 JP JP2010504889A patent/JP5380429B2/ja active Active
- 2008-04-15 EP EP08737488A patent/EP2140488A1/fr not_active Withdrawn
- 2008-04-15 WO PCT/IB2008/000967 patent/WO2008132569A1/fr active Application Filing
- 2008-04-15 US US12/528,573 patent/US7981768B2/en active Active
- 2008-04-15 KR KR1020097018793A patent/KR101527063B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101636833B (zh) | 2011-06-08 |
WO2008132569A1 (fr) | 2008-11-06 |
JP5380429B2 (ja) | 2014-01-08 |
KR20100014953A (ko) | 2010-02-11 |
US7981768B2 (en) | 2011-07-19 |
US20110008948A1 (en) | 2011-01-13 |
CN101636833A (zh) | 2010-01-27 |
FR2915625A1 (fr) | 2008-10-31 |
KR101527063B1 (ko) | 2015-06-08 |
JP2010525599A (ja) | 2010-07-22 |
EP2140488A1 (fr) | 2010-01-06 |
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Legal Events
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CD | Change of name or company name |
Owner name: SOITEC, FR Effective date: 20120907 |
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