FR2888039B1 - PROCEDE DE FABRICATION D'UNE COUCHE DE COMPOSE A BASE DE NITRURE, D'UN SUBSTRAT DE GaN ET D'UN DISPOSITIF D'EMISSION DE LUMIERE A SEMI-CONDUCTEUR A BASE DE NITRURE A STRUCTURE VERTICALE - Google Patents
PROCEDE DE FABRICATION D'UNE COUCHE DE COMPOSE A BASE DE NITRURE, D'UN SUBSTRAT DE GaN ET D'UN DISPOSITIF D'EMISSION DE LUMIERE A SEMI-CONDUCTEUR A BASE DE NITRURE A STRUCTURE VERTICALEInfo
- Publication number
- FR2888039B1 FR2888039B1 FR0605561A FR0605561A FR2888039B1 FR 2888039 B1 FR2888039 B1 FR 2888039B1 FR 0605561 A FR0605561 A FR 0605561A FR 0605561 A FR0605561 A FR 0605561A FR 2888039 B1 FR2888039 B1 FR 2888039B1
- Authority
- FR
- France
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- compound layer
- gan substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title 1
- -1 NITRIDE COMPOUND Chemical class 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02469—Group 12/16 materials
- H01L21/02472—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02483—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050053331A KR100638869B1 (ko) | 2005-06-21 | 2005-06-21 | 질화물계 화합물층을 형성하는 방법 및 이를 이용한 GaN기판 및 수직구조 질화물계 반도체 발광소자를 제조하는방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2888039A1 FR2888039A1 (fr) | 2007-01-05 |
FR2888039B1 true FR2888039B1 (fr) | 2016-11-25 |
Family
ID=37573936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0605561A Active FR2888039B1 (fr) | 2005-06-21 | 2006-06-21 | PROCEDE DE FABRICATION D'UNE COUCHE DE COMPOSE A BASE DE NITRURE, D'UN SUBSTRAT DE GaN ET D'UN DISPOSITIF D'EMISSION DE LUMIERE A SEMI-CONDUCTEUR A BASE DE NITRURE A STRUCTURE VERTICALE |
Country Status (5)
Country | Link |
---|---|
US (2) | US7569461B2 (fr) |
JP (1) | JP4509973B2 (fr) |
KR (1) | KR100638869B1 (fr) |
DE (1) | DE102006028137B4 (fr) |
FR (1) | FR2888039B1 (fr) |
Families Citing this family (22)
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KR100916366B1 (ko) * | 2006-12-08 | 2009-09-11 | 고려대학교 산학협력단 | 반도체 발광소자용 지지기판 및 이를 이용한 수직구조의 반도체 발광소자 제조 방법 |
US8222669B2 (en) * | 2008-03-27 | 2012-07-17 | Nitek, Inc. | Mixed source growth apparatus and method of fabricating III-nitride ultraviolet emitters |
KR100978568B1 (ko) | 2008-04-30 | 2010-08-27 | 삼성엘이디 주식회사 | 질화물 반도체 발광소자의 제조 방법 |
WO2009148253A2 (fr) * | 2008-06-02 | 2009-12-10 | 고려대학교 산학협력단 | Substrat de support utilise dans la fabrication d’un dispositif electroluminescent semiconducteur et dispositif comprenant ledit substrat |
WO2009146583A1 (fr) * | 2008-06-02 | 2009-12-10 | Hong Kong Applied Science and Technology Research Institute Co. Ltd | Tranche semi-conductrice, dispositif semi-conducteur et procédés de fabrication de tranche et de dispositif semi-conducteurs |
KR101525076B1 (ko) * | 2008-12-15 | 2015-06-03 | 삼성전자 주식회사 | 발광 소자의 제조 방법 |
KR101064068B1 (ko) * | 2009-02-25 | 2011-09-08 | 엘지이노텍 주식회사 | 발광소자의 제조방법 |
KR20110123118A (ko) | 2010-05-06 | 2011-11-14 | 삼성전자주식회사 | 패터닝된 발광부를 구비한 수직형 발광소자 |
US8318563B2 (en) * | 2010-05-19 | 2012-11-27 | National Semiconductor Corporation | Growth of group III nitride-based structures and integration with conventional CMOS processing tools |
CN102117869B (zh) * | 2011-01-21 | 2013-12-11 | 厦门市三安光电科技有限公司 | 一种剥离发光二极管衬底的方法 |
FR2978601B1 (fr) * | 2011-07-29 | 2016-05-13 | Nanovation | Procede de fabrication d'un substrat de gan ou d'un dispositif a base de gan sur substrat natif de type gan, utilisant une fine couche tampon sacrificielle |
US8846482B2 (en) * | 2011-09-22 | 2014-09-30 | Avogy, Inc. | Method and system for diffusion and implantation in gallium nitride based devices |
US8981432B2 (en) * | 2012-08-10 | 2015-03-17 | Avogy, Inc. | Method and system for gallium nitride electronic devices using engineered substrates |
EP2908330B1 (fr) * | 2012-10-12 | 2021-05-19 | Sumitomo Electric Industries, Ltd. | Substrat composite à nitrure du groupe iii, procédé pour sa fabrication et procédé de fabrication d'un dispositif semi-conducteur à nitrure du groupe iii |
KR20140104756A (ko) | 2013-02-21 | 2014-08-29 | 삼성전자주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
KR101471621B1 (ko) * | 2013-08-14 | 2014-12-11 | 광주과학기술원 | 습식식각을 통한 GaN 기판 분리방법 |
KR101591677B1 (ko) * | 2014-09-26 | 2016-02-18 | 광주과학기술원 | 고품위 질화물계 반도체 성장방법 |
KR102028507B1 (ko) * | 2017-10-24 | 2019-10-04 | 한국전력공사 | 선택영역 성장법을 이용한 기판 재활용 방법 |
WO2020180785A1 (fr) * | 2019-03-01 | 2020-09-10 | The Regents Of The University Of California | Procédé d'aplatissement d'une surface sur une couche de croissance latérale épitaxiale |
CN111243946B (zh) * | 2020-01-19 | 2023-04-07 | 镓特半导体科技(上海)有限公司 | 半导体结构、自支撑氮化镓层及其制备方法 |
CN111223763B (zh) * | 2020-01-19 | 2024-04-12 | 镓特半导体科技(上海)有限公司 | 半导体结构、自支撑氮化镓层及其制备方法 |
KR102504967B1 (ko) * | 2021-07-29 | 2023-03-02 | (재)한국나노기술원 | 고감도 센서용 반도체 소자의 제조방법 |
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JP3925753B2 (ja) * | 1997-10-24 | 2007-06-06 | ソニー株式会社 | 半導体素子およびその製造方法ならびに半導体発光素子 |
KR100629558B1 (ko) * | 1997-10-30 | 2006-09-27 | 스미토모덴키고교가부시키가이샤 | GaN단결정기판 및 그 제조방법 |
JP3036495B2 (ja) * | 1997-11-07 | 2000-04-24 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の製造方法 |
TW417315B (en) * | 1998-06-18 | 2001-01-01 | Sumitomo Electric Industries | GaN single crystal substrate and its manufacture method of the same |
JP3525061B2 (ja) * | 1998-09-25 | 2004-05-10 | 株式会社東芝 | 半導体発光素子の製造方法 |
JP2000173929A (ja) * | 1998-12-03 | 2000-06-23 | Mitsubishi Cable Ind Ltd | GaN系結晶成長用基板およびその用途 |
US6812053B1 (en) * | 1999-10-14 | 2004-11-02 | Cree, Inc. | Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures |
JP3568112B2 (ja) * | 1999-12-27 | 2004-09-22 | 豊田合成株式会社 | 半導体基板の製造方法 |
DE10008583A1 (de) | 2000-02-24 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optisch transparenten Substrates und Verfahren zum Herstellen eines lichtemittierenden Halbleiterchips |
JP3662806B2 (ja) * | 2000-03-29 | 2005-06-22 | 日本電気株式会社 | 窒化物系半導体層の製造方法 |
JP2001313259A (ja) * | 2000-04-28 | 2001-11-09 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体基板の製造方法及び半導体素子 |
JP4356208B2 (ja) * | 2000-08-01 | 2009-11-04 | ソニー株式会社 | 窒化物半導体の気相成長方法 |
JP2002241198A (ja) | 2001-02-13 | 2002-08-28 | Hitachi Cable Ltd | GaN単結晶基板及びその製造方法 |
JP2002280314A (ja) * | 2001-03-22 | 2002-09-27 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法、及びそれに基づくiii族窒化物系化合物半導体素子 |
JP2002284600A (ja) * | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
JP3631724B2 (ja) * | 2001-03-27 | 2005-03-23 | 日本電気株式会社 | Iii族窒化物半導体基板およびその製造方法 |
US6939730B2 (en) * | 2001-04-24 | 2005-09-06 | Sony Corporation | Nitride semiconductor, semiconductor device, and method of manufacturing the same |
US7008839B2 (en) * | 2002-03-08 | 2006-03-07 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing semiconductor thin film |
WO2004073045A2 (fr) * | 2003-02-12 | 2004-08-26 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Croissance epitaxiale de nitrures du groupe iii sur des substrats en silicium par l'intermediaire d'une couche reflechissante tampon de diborure de zirconium presentant une correspondance de reseau moleculaire avec un substrat |
JP3966207B2 (ja) * | 2003-03-28 | 2007-08-29 | 豊田合成株式会社 | 半導体結晶の製造方法及び半導体発光素子 |
JP2004336040A (ja) * | 2003-04-30 | 2004-11-25 | Osram Opto Semiconductors Gmbh | 複数の半導体チップの製造方法および電子半導体基体 |
JP2005001928A (ja) * | 2003-06-11 | 2005-01-06 | Fujikura Ltd | 自立基板およびその製造方法 |
JP4600641B2 (ja) * | 2004-01-27 | 2010-12-15 | 日立電線株式会社 | 窒化物半導体自立基板及びそれを用いた窒化物半導体発光素子 |
JP4868709B2 (ja) * | 2004-03-09 | 2012-02-01 | 三洋電機株式会社 | 発光素子 |
-
2005
- 2005-06-21 KR KR1020050053331A patent/KR100638869B1/ko active IP Right Grant
-
2006
- 2006-06-16 DE DE102006028137A patent/DE102006028137B4/de active Active
- 2006-06-20 JP JP2006170286A patent/JP4509973B2/ja active Active
- 2006-06-21 US US11/471,697 patent/US7569461B2/en active Active
- 2006-06-21 FR FR0605561A patent/FR2888039B1/fr active Active
-
2009
- 2009-06-23 US US12/489,819 patent/US8026156B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20060286777A1 (en) | 2006-12-21 |
FR2888039A1 (fr) | 2007-01-05 |
US8026156B2 (en) | 2011-09-27 |
US7569461B2 (en) | 2009-08-04 |
KR100638869B1 (ko) | 2006-10-27 |
US20090258453A1 (en) | 2009-10-15 |
JP4509973B2 (ja) | 2010-07-21 |
DE102006028137A1 (de) | 2007-01-25 |
DE102006028137B4 (de) | 2008-04-10 |
JP2007001857A (ja) | 2007-01-11 |
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