FR2881890B1 - Module optique - Google Patents

Module optique

Info

Publication number
FR2881890B1
FR2881890B1 FR0600997A FR0600997A FR2881890B1 FR 2881890 B1 FR2881890 B1 FR 2881890B1 FR 0600997 A FR0600997 A FR 0600997A FR 0600997 A FR0600997 A FR 0600997A FR 2881890 B1 FR2881890 B1 FR 2881890B1
Authority
FR
France
Prior art keywords
optical module
module
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0600997A
Other languages
English (en)
Other versions
FR2881890A1 (fr
Inventor
Hiroshi Aruga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2881890A1 publication Critical patent/FR2881890A1/fr
Application granted granted Critical
Publication of FR2881890B1 publication Critical patent/FR2881890B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
FR0600997A 2005-02-04 2006-02-03 Module optique Expired - Fee Related FR2881890B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005029112A JP4815814B2 (ja) 2005-02-04 2005-02-04 光モジュール

Publications (2)

Publication Number Publication Date
FR2881890A1 FR2881890A1 (fr) 2006-08-11
FR2881890B1 true FR2881890B1 (fr) 2008-03-07

Family

ID=36694601

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0600997A Expired - Fee Related FR2881890B1 (fr) 2005-02-04 2006-02-03 Module optique

Country Status (4)

Country Link
US (2) US7366215B2 (fr)
JP (1) JP4815814B2 (fr)
CN (1) CN100423389C (fr)
FR (1) FR2881890B1 (fr)

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KR101542443B1 (ko) * 2013-06-19 2015-08-06 주식회사 포벨 고속 통신용 to형 광소자 패키지
JP6238226B2 (ja) * 2013-09-30 2017-11-29 住友電工デバイス・イノベーション株式会社 半導体レーザ装置
JP6299301B2 (ja) * 2014-03-14 2018-03-28 三菱電機株式会社 半導体光変調装置
JP6502797B2 (ja) * 2015-08-31 2019-04-17 日本オクラロ株式会社 光モジュール
CN108988120A (zh) * 2017-06-02 2018-12-11 海信集团有限公司 同轴封装的激光器以及光模块
WO2018219318A1 (fr) * 2017-06-02 2018-12-06 青岛海信宽带多媒体技术有限公司 Laser à boîtier coaxial et module optique
CN109212678A (zh) * 2017-06-29 2019-01-15 苏州旭创科技有限公司 光传输装置及同轴封装的光发射模组
CN108390255A (zh) * 2018-02-22 2018-08-10 青岛海信宽带多媒体技术有限公司 光学次模块及光模块
JP6928174B2 (ja) * 2018-05-29 2021-09-01 三菱電機株式会社 光モジュール、および光送信器
US10852493B2 (en) * 2018-08-03 2020-12-01 Lumentum Japan, Inc. Optical subassembly and optical module
JP7245620B2 (ja) * 2018-08-03 2023-03-24 日本ルメンタム株式会社 光サブアッセンブリ及び光モジュール
JP7249745B2 (ja) * 2018-08-03 2023-03-31 日本ルメンタム株式会社 光サブアッセンブリ及び光モジュール
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WO2020056662A1 (fr) * 2018-09-20 2020-03-26 华为技术有限公司 Composant photoélectronique et son procédé de fabrication
US12015242B2 (en) * 2018-11-21 2024-06-18 Mitsubishi Electric Corporation Optical module
WO2020111257A1 (fr) * 2018-11-30 2020-06-04 京セラ株式会社 Carte de circuit imprimé, boîtier pour montage de parties électroniques et dispositif électronique
JP7295634B2 (ja) * 2018-12-17 2023-06-21 日本ルメンタム株式会社 光サブアッセンブリ及び光モジュール
JP2021044331A (ja) * 2019-09-10 2021-03-18 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光サブアッセンブリ及び光モジュール
US11740419B2 (en) * 2019-11-01 2023-08-29 CIG Photonics Japan Limited Optical subassembly
CN112835150A (zh) * 2019-11-22 2021-05-25 佑胜光电股份有限公司 光发射组件、光学收发模块及光纤缆线模块
JP7350646B2 (ja) * 2019-12-17 2023-09-26 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
JP7369047B2 (ja) * 2020-01-30 2023-10-25 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール及び光伝送装置
JPWO2021166073A1 (fr) * 2020-02-18 2021-08-26
US11340412B2 (en) * 2020-02-28 2022-05-24 CIG Photonics Japan Limited Optical module
JP7474143B2 (ja) 2020-02-28 2024-04-24 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
JP7382872B2 (ja) * 2020-03-24 2023-11-17 新光電気工業株式会社 半導体パッケージ用ステム、半導体パッケージ
JP7382871B2 (ja) 2020-03-24 2023-11-17 新光電気工業株式会社 半導体パッケージ用ステム、半導体パッケージ
EP3965146A1 (fr) * 2020-09-03 2022-03-09 Schott Ag Embase pour un composant électronique
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Also Published As

Publication number Publication date
FR2881890A1 (fr) 2006-08-11
US20060176918A1 (en) 2006-08-10
JP4815814B2 (ja) 2011-11-16
CN100423389C (zh) 2008-10-01
CN1829013A (zh) 2006-09-06
US20080137699A1 (en) 2008-06-12
US7869479B2 (en) 2011-01-11
JP2006216839A (ja) 2006-08-17
US7366215B2 (en) 2008-04-29

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Effective date: 20181031