FR2865478B1 - COPPER ALLOY WITH HIGH MECHANICAL RESISTANCE AND HIGH CONDUCTIVITY - Google Patents

COPPER ALLOY WITH HIGH MECHANICAL RESISTANCE AND HIGH CONDUCTIVITY

Info

Publication number
FR2865478B1
FR2865478B1 FR0500428A FR0500428A FR2865478B1 FR 2865478 B1 FR2865478 B1 FR 2865478B1 FR 0500428 A FR0500428 A FR 0500428A FR 0500428 A FR0500428 A FR 0500428A FR 2865478 B1 FR2865478 B1 FR 2865478B1
Authority
FR
France
Prior art keywords
copper alloy
mechanical resistance
high mechanical
conductivity
high conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0500428A
Other languages
French (fr)
Other versions
FR2865478A1 (en
Inventor
Yasuhiro Aruga
Katsura Kajihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of FR2865478A1 publication Critical patent/FR2865478A1/en
Application granted granted Critical
Publication of FR2865478B1 publication Critical patent/FR2865478B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
FR0500428A 2004-01-23 2005-01-14 COPPER ALLOY WITH HIGH MECHANICAL RESISTANCE AND HIGH CONDUCTIVITY Expired - Fee Related FR2865478B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004015677A JP4041803B2 (en) 2004-01-23 2004-01-23 High strength and high conductivity copper alloy

Publications (2)

Publication Number Publication Date
FR2865478A1 FR2865478A1 (en) 2005-07-29
FR2865478B1 true FR2865478B1 (en) 2008-05-30

Family

ID=34737328

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0500428A Expired - Fee Related FR2865478B1 (en) 2004-01-23 2005-01-14 COPPER ALLOY WITH HIGH MECHANICAL RESISTANCE AND HIGH CONDUCTIVITY

Country Status (6)

Country Link
US (1) US20050161126A1 (en)
JP (1) JP4041803B2 (en)
KR (1) KR100651303B1 (en)
CN (1) CN1269979C (en)
DE (1) DE102005002763B4 (en)
FR (1) FR2865478B1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100510131C (en) * 2004-08-17 2009-07-08 株式会社神户制钢所 Copper alloy plate for electric and electronic parts having bending workability
JP4441467B2 (en) * 2004-12-24 2010-03-31 株式会社神戸製鋼所 Copper alloy with bending workability and stress relaxation resistance
US20090116996A1 (en) * 2005-06-08 2009-05-07 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.) Copper alloy, copper alloy plate, and process for producing the same
EP1918390B1 (en) 2005-07-07 2012-01-18 Kabushiki Kaisha Kobe Seiko Sho Process for producing copper alloy plate with high strength and excellent processability in bending
JP5170851B2 (en) 2005-07-15 2013-03-27 古河電気工業株式会社 Storage battery charge state detection method and storage battery charge state detection device
EP2048251B1 (en) * 2006-05-26 2012-01-25 Kabushiki Kaisha Kobe Seiko Sho Copper alloy having high strength, high electric conductivity and excellent bending workability
EP2339038B8 (en) * 2006-07-21 2017-01-11 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electric and electronic part
JP4950584B2 (en) * 2006-07-28 2012-06-13 株式会社神戸製鋼所 Copper alloy with high strength and heat resistance
WO2008041584A1 (en) * 2006-10-02 2008-04-10 Kabushiki Kaisha Kobe Seiko Sho Copper alloy plate for electrical and electronic components
JP4157898B2 (en) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent press punchability
WO2009024132A2 (en) * 2007-08-21 2009-02-26 Prymetall Gmbh & Co. Kg Cable having a coaxial design for transmitting high-frequency signals and method for producing such a cable
JP2009179864A (en) * 2008-01-31 2009-08-13 Kobe Steel Ltd Copper alloy sheet superior in stress relaxation resistance
JP5214282B2 (en) * 2008-03-07 2013-06-19 株式会社神戸製鋼所 Copper alloy plate for QFN package with excellent dicing workability
JP5260201B2 (en) * 2008-09-10 2013-08-14 三井住友金属鉱山伸銅株式会社 Highly conductive heat-resistant copper alloy and method for producing the same
JP5291494B2 (en) * 2008-09-30 2013-09-18 株式会社神戸製鋼所 High strength high heat resistance copper alloy sheet
US20110123389A1 (en) 2008-09-30 2011-05-26 Jx Nippon Mining & Metals Corporation High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis
EP3128039B1 (en) * 2008-09-30 2019-05-01 JX Nippon Mining & Metals Corp. High-purity copper sputtering target or high-purity copper alloy sputtering target
JP5468423B2 (en) * 2010-03-10 2014-04-09 株式会社神戸製鋼所 High strength and high heat resistance copper alloy material
CN101906553A (en) * 2010-08-26 2010-12-08 中铝华中铜业有限公司 Lead frame material and processing method thereof
JP5700834B2 (en) * 2011-12-09 2015-04-15 株式会社神戸製鋼所 High strength copper alloy sheet with excellent oxide film adhesion
JP5467163B1 (en) * 2013-03-26 2014-04-09 Ｊｘ日鉱日石金属株式会社 Copper alloy plate, heat dissipating electronic component comprising the same, and method for producing copper alloy plate
CN104073677B (en) 2013-03-27 2017-01-11 株式会社神户制钢所 Copper alloy strip for lead frame of led
CN104805483B (en) * 2015-05-15 2017-07-28 国家电网公司 A kind of preparation method of high intensity and high conductivity copper bus-bar
CN106868334A (en) * 2017-02-22 2017-06-20 铜陵格里赛铜冠电子材料有限公司 A kind of special-shaped copper alloy belt and its production method
KR101834335B1 (en) * 2017-11-02 2018-04-13 주식회사 풍산 Copper alloy for electrical and electronic parts and semiconductor with high strength and high electrical conductivity and a method of preparing same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154540A (en) * 1979-05-22 1980-12-02 Furukawa Electric Co Ltd:The Electrically-conductive wear-resistant copper alloy and its manufacture
JPS62267456A (en) * 1986-05-13 1987-11-20 Kobe Steel Ltd Manufacture of high strength copper alloy for lead frame having high electric conductivity
JPH06220594A (en) * 1993-01-21 1994-08-09 Mitsui Mining & Smelting Co Ltd Production of copper alloy for electric parts having good workability
KR0160342B1 (en) * 1994-03-22 1999-01-15 코오노 히로노리 Production of high-strength and high-conductivity copper alloy material for electronic equipment
JP3313006B2 (en) * 1995-02-25 2002-08-12 株式会社神戸製鋼所 Copper alloy lead frame for bare bond
JP3550233B2 (en) * 1995-10-09 2004-08-04 同和鉱業株式会社 Manufacturing method of high strength and high conductivity copper base alloy
JPH09111372A (en) * 1995-10-12 1997-04-28 Mitsuba Corp Copper alloy for commutator for motor used for fuel transport pump
JPH09296237A (en) * 1996-04-28 1997-11-18 Nikko Kinzoku Kk Metallic substrate material for semiconductor packaging
JPH10130755A (en) * 1996-11-01 1998-05-19 Kobe Steel Ltd High strength and high conductivity copper alloy excellent in shearing workability
US5820701A (en) * 1996-11-07 1998-10-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
JP3772319B2 (en) * 1997-03-24 2006-05-10 同和鉱業株式会社 Copper alloy for lead frame and manufacturing method thereof
US5893953A (en) * 1997-09-16 1999-04-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
JPH11264037A (en) * 1998-03-18 1999-09-28 Nippon Mining & Metals Co Ltd Copper alloy foil
JP3344700B2 (en) * 1998-06-01 2002-11-11 株式会社神戸製鋼所 High-strength, high-conductivity copper alloy sheet for leadframes with excellent heat treatment during press punching
JP3717321B2 (en) * 1998-12-11 2005-11-16 古河電気工業株式会社 Copper alloy for semiconductor lead frames
JP2000285261A (en) * 1999-03-29 2000-10-13 Japan Radio Co Ltd Three-dimensional visualizing device
JP4056175B2 (en) * 1999-05-13 2008-03-05 株式会社神戸製鋼所 Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability
JP3989161B2 (en) 2000-06-20 2007-10-10 古河電気工業株式会社 Copper alloy for electronic and electrical equipment with excellent bending workability and stress relaxation resistance

Also Published As

Publication number Publication date
KR20050076767A (en) 2005-07-27
KR100651303B1 (en) 2006-11-29
CN1644726A (en) 2005-07-27
CN1269979C (en) 2006-08-16
US20050161126A1 (en) 2005-07-28
JP2005206891A (en) 2005-08-04
DE102005002763A1 (en) 2005-08-18
JP4041803B2 (en) 2008-02-06
FR2865478A1 (en) 2005-07-29
DE102005002763B4 (en) 2012-04-26

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