CN104805483B - A kind of preparation method of high intensity and high conductivity copper bus-bar - Google Patents
A kind of preparation method of high intensity and high conductivity copper bus-bar Download PDFInfo
- Publication number
- CN104805483B CN104805483B CN201510250056.7A CN201510250056A CN104805483B CN 104805483 B CN104805483 B CN 104805483B CN 201510250056 A CN201510250056 A CN 201510250056A CN 104805483 B CN104805483 B CN 104805483B
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- China
- Prior art keywords
- bar
- copper
- copper bus
- high intensity
- high conductivity
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 74
- 239000010949 copper Substances 0.000 title claims abstract description 74
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000013078 crystal Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004070 electrodeposition Methods 0.000 claims abstract description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 12
- 239000010935 stainless steel Substances 0.000 claims abstract description 12
- 239000003792 electrolyte Substances 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 5
- 210000003746 feather Anatomy 0.000 abstract description 2
- 230000008520 organization Effects 0.000 abstract description 2
- 238000011084 recovery Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention provides a kind of high intensity and the preparation method of high conductivity copper bus-bar, this method is to first pass through electrodeposition method to prepare nano twin crystal copper bar blank, then nano twin crystal copper bar blank is obtained into the high intensity and high conductivity copper bus-bar by extruding extending forming, it is characterised in that：Anode in the electro-deposition method is copper coin, and negative electrode is gate hole shape stainless steel plate, and the porosity of the gate hole shape stainless steel plate is 30 60%.The present invention proposes using gate hole shape stainless steel plate and is used as the negative electrode during pulse electrodeposition, and, by adding CNT, rare earth element ce into electrolyte to improve the institutional framework stability of nano twin crystal copper product, avoid copper bus-bar causes the dynamic recovery of feather organization due to temperature rise during shaping, welding and heavy current impact, and the copper bus-bar obtained using the inventive method vegetation has high intensity and high conductivity.The inventive method is simple, and cost is low, and effect is good, practical.
Description
Technical field
The present invention relates to conductive copper bus-bar, the preparation method of specifically a kind of high intensity and high conductivity copper bus-bar.
Background technology
Copper is widely used in because of excellent performances such as conductions in electric and electronic industry.But fine copper hardness, tensile strength,
Creep-resistant property is relatively low, and heat endurance is also poor, it is difficult to meet electric and electronic industry it is some under the conditions of requirement to its intensity.
The method of tradition reinforcing copper, such as refined crystalline strengthening, solution strengthening also increase crystal boundary, dislocation, the while copper intensity is improved
Two equal defects, so that the scattering increase of electronics, seriously reduces the electric conductivity of material.It can be said that the intensity of copper product with
There is shifting contradiction in electric conductivity.Shenyang metal institute of Chinese science research institute Lu Ke et al. (Lu L, Shen Y F, Chen
X H et al.Ultrahigh strength and high electrical conductivity in
copper.Science,2004,304(5669):422-426.) crystallite dimension receiving for 30nm is prepared using electro-deposition techniques
, there is the twin lamellae structure of high density different orientation in rice copper product, nano twin crystal circle can effective agretope in its intra-die
Wrong motion, and its scattering process to electronics is very low.But nanoscale fine copper film can only be made or a small amount of in the current technology
Lumpy nanometer twin material, be not suitable for industrialized production.Therefore, how to realize and have receiving for high intensity and high conductivity concurrently
Prepared by the mass of rice twin copper bus-bar is technical bottleneck main at present.
The content of the invention
The purpose of the present invention is that the preparation of a kind of high intensity and high conductivity copper bus-bar is provided according to the deficiencies in the prior art
Method, can prepare that not only intensity is high with the method for the present invention, and conductance also very high copper bus-bar.
The present invention is achieved through the following technical solutions：A kind of preparation method of high intensity and high conductivity copper bus-bar,
This method is to first pass through electrodeposition method to prepare nano twin crystal copper bar blank, then leads to nano twin crystal copper bar blank
Cross extruding extending forming and obtain the high intensity and high conductivity copper bus-bar, it is characterised in that：Sun in the electro-deposition method
Extremely copper coin, negative electrode is gate hole shape stainless steel plate, and the porosity of the gate hole shape stainless steel plate is 30-60%.
It is preferred that, during the electro-deposition method prepares copper bus-bar, the current density of pulse current is 60-120A/
cm2。
It is preferred that, with the addition of in the electrolyte in the electro-deposition method concentration be 0.3-0.5mg/L CNT or
Rare earth element ce.
It is preferred that, the pH value of the electrolyte is 1-2.
It is preferred that, the cross section of the nano twin crystal copper bar blank is rectangle.
It is preferred that, the extruding extending forming refers to, nano twin crystal copper bar blank first is entered into extruding wheel by charging aperture
Race in, full of inside race, subsequently entering cavity under compact wheel effect, and extruded after mould.
The present invention is proposed using gate hole shape stainless steel plate as the negative electrode during pulse electrodeposition, and it promotes electrolyte
Abundant convection current and diffusion, it is ensured that the deposition efficiency and deposition quality of nano twin crystal copper product.It is transversal at the same time it can also obtain
Face is the nano twin crystal copper bar blank of rectangle, consequently facilitating follow-up extruding extending forming, solves nano twin crystal copper bus-bar batch
Quantify the technique obstacle of production.Also, by adding CNT, rare earth element ce into electrolyte to improve nano twin crystal copper
Materials microstructure structural stability, it is to avoid copper bus-bar is led due to temperature rise during shaping, welding and heavy current impact
The dynamic recovery of feather organization is caused, the copper bus-bar prepared using the inventive method has fabulous mechanical performance, its room temperature
Tensile strength is more than 900MPa, and conductance almost can be suitable with conventional fine copper busbar product.The inventive method is simple, into
This is low, and effect is good, practical.
Brief description of the drawings
Fig. 1 is the structural representation of the poroid stainless steel plate of cathode grid of the present invention；
Fig. 2 is the conductance and tensile strength properties comparison diagram of copper bus-bar of the present invention and existing copper bus-bar；
1. gate hole, the conductance of 2. copper bus-bars of the present invention, the tensile strength of 3. copper bus-bars of the present invention, 4. prior art copper are female
The tensile strength of the conductance of row, 5. prior art copper bus-bars.
Embodiment
By the following specific examples further illustrate the invention：
Embodiment 1
Impulse electrodeposition technology is used to prepare strip nano twin crystal copper bar blank of the cross section for rectangle.Electrolyte is
CuSO4Solution, wherein copper ion concentration are about 100g/L, and the rare earth element ce content of addition is 0.3mg/L, the pH value control of solution
System is in 1-2.Negative electrode is gate hole shape stainless steel plate as shown in Figure 1, and porosity is 50%, anode be purity for 99.99% it is pure
Copper coin.Pulse current density is 80A/cm2, in electrodeposition process, electrolyte flow is forced by way of outer circulation, and protect
Demonstrate,prove the constant of electrodeposition temperature.The nano twin crystal copper bar blank prepared is prepared into required rule by extruding extending forming again
The copper bus-bar product of lattice size.The extruding extending forming refers to, first enters nano twin crystal copper bar blank by charging aperture and squeezes
In the race of pinch roller, full of inside race under compact wheel effect, cavity is subsequently entered, and obtained copper is extruded after mould
Busbar specification is 40mm*4mm.
D.C. resistance test, after conversion, nano twin crystal copper bus-bar are carried out to nano twin crystal copper bus-bar using double bridge method
Conductance at 20 DEG C reaches 97%IACS.Meanwhile, tensile sample is intercepted from nano twin crystal copper bus-bar, on universal testing machine
Tension test is carried out, every group of sample is surveyed 3, averaged.The performance of acquired results and conventional fine copper busbar is contrasted, such as
Shown in Fig. 2.Compared with existing copper bus-bar, nano twin crystal copper bus-bar conductance fall very little prepared by the present invention, but machinery
Performance is greatly improved, and its tensile strength is more than 900MPa.
Embodiment 2
Difference from Example 1 is：CNT is added in electrolyte as steady in nano twin crystal copper product
Qualitative, its concentration is about 0.5mg/L.Pulse current density is 60A/cm2.The porosity of the poroid stainless steel plate of cathode grid is
30%.Nano twin crystal copper bar blank prepares the copper bus-bar product that specification is 40mm*4mm by extruding extending forming, its
Tensile strength is about 920MPa, and conductivity at room temperature rate is close to 98%IACS.
Embodiment 3
Difference from Example 1 is：CNT is added in electrolyte as steady in nano twin crystal copper product
Qualitative, its concentration is about 0.4mg/L.Pulse current density is 120A/cm2.The porosity of the poroid stainless steel plate of cathode grid is
60%.Nano twin crystal copper bar blank prepares the copper bus-bar product that specification is 30mm*4mm by extruding extending forming, its
Tensile strength is about 923MPa, and conductivity at room temperature rate is close to 97%IACS.
Claims (5)
1. a kind of preparation method of high intensity and high conductivity copper bus-bar, this method is to first pass through electrodeposition method to be prepared into
To nano twin crystal copper bar blank, nano twin crystal copper bar blank is then obtained into the high intensity by extruding extending forming and height is led
Electric rate copper bus-bar, it is characterised in that：Anode in the electro-deposition method is copper coin, and negative electrode is gate hole shape stainless steel plate, described
The porosity of gate hole shape stainless steel plate is 30-60%；Concentration is with the addition of in electrolyte in the electro-deposition method for 0.3-
0.5mg/L CNT or rare earth element ce.
2. high intensity and the preparation method of high conductivity copper bus-bar according to claim 1, it is characterised in that：The electro-deposition
During method prepares copper bus-bar, the current density of pulse current is 60-120A/cm2。
3. high intensity and the preparation method of high conductivity copper bus-bar according to claim 1, it is characterised in that：The electrolyte
PH value be 1-2.
4. high intensity and the preparation method of high conductivity copper bus-bar according to claim 1, it is characterised in that：The nanometer is twin
The cross section of brilliant copper bar blank is rectangle.
5. high intensity and the preparation method of high conductivity copper bus-bar according to claim 1, it is characterised in that：The extruding is expanded
Transform into shape to refer to, first enter nano twin crystal copper bar blank in the race of extruding wheel by charging aperture, filled under compact wheel effect
Inside full race, cavity is subsequently entered, and extruded after mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510250056.7A CN104805483B (en) | 2015-05-15 | 2015-05-15 | A kind of preparation method of high intensity and high conductivity copper bus-bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510250056.7A CN104805483B (en) | 2015-05-15 | 2015-05-15 | A kind of preparation method of high intensity and high conductivity copper bus-bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104805483A CN104805483A (en) | 2015-07-29 |
| CN104805483B true CN104805483B (en) | 2017-07-28 |
Family
ID=53690663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510250056.7A Active CN104805483B (en) | 2015-05-15 | 2015-05-15 | A kind of preparation method of high intensity and high conductivity copper bus-bar |
Country Status (1)
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| CN (1) | CN104805483B (en) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1234914C (en) * | 2002-11-01 | 2006-01-04 | 中国科学院金属研究所 | Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method |
| JP4041803B2 (en) * | 2004-01-23 | 2008-02-06 | 株式会社神戸製鋼所 | High strength and high conductivity copper alloy |
| CN100575561C (en) * | 2007-08-24 | 2009-12-30 | 仲庆 | The electroplating preparation method of copper-clad aluminium wire or copper cladded aluminum-magnesium alloy wire |
| CN101527185A (en) * | 2008-03-05 | 2009-09-09 | 王康力 | Copper coated steel contact wire with high strength, low relaxation and high electric conductivity for electric traction |
| CN101665966B (en) * | 2009-09-25 | 2011-05-25 | 江苏广庆电子材料有限公司（中外合资） | Electroplating preparation method of copper-clad aluminium bars |
| CN201887163U (en) * | 2010-11-30 | 2011-06-29 | 苏州市南方欣达双金属材料有限公司 | Earthing bar |
| KR20120084479A (en) * | 2011-01-20 | 2012-07-30 | 엘에스전선 주식회사 | Aluminum alloy wire with high electrical conductivity and high strength and manufacturing method thereof |
| CN102108451A (en) * | 2011-02-15 | 2011-06-29 | 常州大学 | Preparation method of copper alloys with high strength and high electric conductivity |
| CN102409376B (en) * | 2011-11-23 | 2014-05-28 | 江苏大学 | Method and device for manufacturing copper/aluminum compound conductive bar by plating |
| CN102417960A (en) * | 2011-12-07 | 2012-04-18 | 南通弘扬金属制品有限公司 | Copper clad steel wire and production method thereof |
| CN103046084B (en) * | 2012-12-20 | 2015-09-16 | 北京九能京通新能源科技有限公司 | electrolytic reduction system and electrolytic reduction method |
| CN103614583B (en) * | 2013-09-29 | 2016-04-13 | 魏玲 | A kind of Novel high-conductivity, high-strength graphene/copper material and preparation method thereof |
| CN103556181B (en) * | 2013-10-28 | 2016-01-13 | 奉新赣锋锂业有限公司 | A kind of metal lithium electrolytic bath |
| CN104492875A (en) * | 2014-12-01 | 2015-04-08 | 国家电网公司 | Busbar processing device |
| CN105632584B (en) * | 2014-12-30 | 2018-03-20 | 天津普洛仙科技有限公司 | A kind of copper-clad aluminum alloy wire and preparation method thereof |
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