CN104805483A - Preparation method for copper bus bar with high strength and high electrical conductivity - Google Patents
Preparation method for copper bus bar with high strength and high electrical conductivity Download PDFInfo
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- CN104805483A CN104805483A CN201510250056.7A CN201510250056A CN104805483A CN 104805483 A CN104805483 A CN 104805483A CN 201510250056 A CN201510250056 A CN 201510250056A CN 104805483 A CN104805483 A CN 104805483A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Materials Engineering (AREA)
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- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
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Abstract
The invention provides a preparation method for a copper bus bar with high strength and high electrical conductivity. The preparation method comprises the following steps of firstly, preparing by using a pulse electrodeposition method to obtain a nano twin-crystal copper strip billet; secondly, performing extruding, extending and forming on the nano twin-crystal copper strip billet to obtain the copper bus bar with high strength and high electrical conductivity. The preparation method is characterized in that an anode in the electrodeposition method is a copper plate, and a cathode in the electrodeposition method is a grid-hole-shaped stainless steel plate with the porosity of 30 to 60 percent. According to the preparation method provided by the invention, the grid-hole-shaped stainless steel plate is taken as the cathode in the pulse electrodeposition process; in addition, carbon nano-tubes and rare earth element Ce are added in electrolyte, so that the stability of an organization structure of a nano twin-crystal copper material is improved, and dynamic recovery of a twin-crystal organization due to temperature rise in the forming, welding and heavy current impact processes of the copper bus bar is avoided. The copper bus bar prepared by the preparation method disclosed by the invention has high strength and high electrical conductivity. The method disclosed by the invention has the advantages of high simplicity, low cost, good effect and high practicality.
Description
Technical field
The present invention relates to conductive copper bus-bar, specifically the preparation method of a kind of high strength and high conductivity copper bus-bar.
Background technology
Copper is widely used in electric and electronic industry because of excellent performances such as conductions.But fine copper hardness, tensile strength, creep-resistant property are all lower, thermostability is also poor, is difficult to meet the requirement to its intensity under some condition of electric and electronic industry.The method of tradition strengthening copper, as refined crystalline strengthening, solution strengthening etc., too increases crystal boundary, dislocation, the second equal defect, thus the scattering of electronics is increased, seriously reduce the electroconductibility of material while raising copper intensity.Can say, there is shifting contradiction in the intensity of copper product and electroconductibility.People (the Lu L such as Shenyang metal institute of Chinese science research institute Lu Ke, Shen Y F, Chen X H et al.Ultrahighstrength and high electrical conductivity in copper.Science, 2004,304 (5669): 422-426.) electro-deposition techniques is utilized to prepare the Nanometer Copper material that grain-size is 30nm, the twin lamellae structure of high-density different orientation is there is at its intra-die, nano twin crystal circle effectively can limit the motion of dislocation, and it is very low to the scattering process of electronics.But this technology can only obtain nano level fine copper film or lumpy nanometer twin material in a small amount at present, and is not suitable for suitability for industrialized production.Therefore, the mass preparation how realizing the nano twin crystal copper bus-bar having high strength and high conductivity concurrently is technical bottleneck main at present.
Summary of the invention
The object of the invention is the preparation method that a kind of high strength and high conductivity copper bus-bar are provided according to the deficiencies in the prior art, can prepare not only by method of the present invention that intensity is high, and the copper bus-bar that electric conductivity is also very high.
The present invention is achieved through the following technical solutions: the preparation method of a kind of high strength and high conductivity copper bus-bar, the method first prepares nano twin crystal copper bar blank by electrodeposition method, then nano twin crystal copper bar blank is obtained described high strength and high conductivity copper bus-bar by extruding extending forming, it is characterized in that: the anode in described electro-deposition method is copper coin, negative electrode is gate hole shape stainless steel plate, and the porosity of described gate hole shape stainless steel plate is 30-60%.
Preferably, described electro-deposition method is prepared in the process of copper bus-bar, and the current density of pulsed current is 60-120A/cm
2.
Preferably, with the addition of the carbon nanotube that concentration is 0.3-0.5mg/L or rare earth element ce in the electrolytic solution in described electro-deposition method.
Preferably, the pH value of described electrolytic solution is 1-2.
Preferably, the cross section of described nano twin crystal copper bar blank is rectangle.
Preferably, described extruding extending forming refers to, first enters in the race of squeegee roller by nano twin crystal copper bar blank by opening for feed, is full of race inside, enters cavity subsequently, and extrude after mould under compact wheel effect.
The present invention proposes using gate hole shape stainless steel plate as the negative electrode in pulse electrodeposition process, it promote abundant convection current and the diffusion of electrolytic solution, ensure that sedimentation effect and the deposition quality of nano twin crystal copper product.Meanwhile, the nano twin crystal copper bar blank that cross section is rectangle can also be obtained, thus be convenient to follow-up extruding extending forming, solve the technique obstacle of nano twin crystal copper bus-bar mass production.And, by adding carbon nanotube, rare earth element ce to improve the weave construction stability of nano twin crystal copper product in electrolytic solution, avoid copper bus-bar be shaped, welding and in heavy current impact process, cause the dynamic recovery of feather organization due to temperature rise, the copper bus-bar using the inventive method to prepare has fabulous mechanical property, its room temperature tensile intensity is more than 900MPa, and electric conductivity almost can be suitable with conventional fine copper busbar product.The inventive method is simple, and cost is low, effective, practical.
Accompanying drawing explanation
Fig. 1 is the structural representation of the poroid stainless steel plate of cathode grid of the present invention;
Fig. 2 is electric conductivity and the tensile strength properties comparison diagram of copper bus-bar of the present invention and existing copper busbar;
1. the tensile strength of electric conductivity, 5. the prior art copper bus-bar of tensile strength, 4. the prior art copper bus-bar of electric conductivity, the 3. copper bus-bar of the present invention of gate hole, 2. copper bus-bar of the present invention.
Embodiment
By the following specific examples further illustrate the invention:
Embodiment 1
Impulse electrodeposition technology is adopted to prepare the strip nano twin crystal copper bar blank that cross section is rectangle.Electrolytic solution is CuSO
4solution, wherein copper ion concentration is about 100g/L, and the rare earth element ce content of interpolation is 0.3mg/L, and the pH value of solution controls at 1-2.Negative electrode is gate hole shape stainless steel plate as shown in Figure 1, and porosity is 50%, anode to be purity be 99.99% fine copper plate.Pulse current density is 80A/cm
2, in electrodeposition process, force electrolyte flow by the mode of outer circulation, and ensure the constant of electrodeposition temperature.Again the nano twin crystal copper bar blank prepared is prepared the copper bus-bar product of required specification by extruding extending forming.Described extruding extending forming refers to, first enters in the race of squeegee roller by nano twin crystal copper bar blank by opening for feed, is full of race inside, enters cavity subsequently under compact wheel effect, and after mould, extrude the copper bus-bar specification obtained be 40mm*4mm.
Adopt double bridge method to carry out direct current resistance test to nano twin crystal copper bus-bar, after converting, the electric conductivity at nano twin crystal copper bus-bar 20 DEG C reaches 97%IACS.Meanwhile, intercept tension specimen from nano twin crystal copper bus-bar, universal testing machine carries out tension test, often organize sample and survey 3, average.The performance of acquired results and conventional fine copper busbar is contrasted, as shown in Figure 2.Compared with existing copper busbar, nano twin crystal copper bus-bar electric conductivity fall prepared by the present invention is very little, but mechanical property acquisition significantly improves, and its tensile strength is more than 900MPa.
Embodiment 2
Difference from Example 1 is: add carbon nanotube in electrolytic solution as the stability in nano twin crystal copper product, its concentration is about 0.5mg/L.Pulse current density is 60A/cm
2.The porosity of the poroid stainless steel plate of cathode grid is 30%.Nano twin crystal copper bar blank is by extruding extending forming, and prepare the copper bus-bar product that specification is 40mm*4mm, its tensile strength is about 920MPa, and conductivity at room temperature rate is close to 98%IACS.
Embodiment 3
Difference from Example 1 is: add carbon nanotube in electrolytic solution as the stability in nano twin crystal copper product, its concentration is about 0.4mg/L.Pulse current density is 120A/cm
2.The porosity of the poroid stainless steel plate of cathode grid is 60%.Nano twin crystal copper bar blank is by extruding extending forming, and prepare the copper bus-bar product that specification is 30mm*4mm, its tensile strength is about 923MPa, and conductivity at room temperature rate is close to 97%IACS.
Claims (6)
1. the preparation method of a high strength and high conductivity copper bus-bar, the method first prepares nano twin crystal copper bar blank by electrodeposition method, then nano twin crystal copper bar blank is obtained described high strength and high conductivity copper bus-bar by extruding extending forming, it is characterized in that: the anode in described electro-deposition method is copper coin, negative electrode is gate hole shape stainless steel plate, and the porosity of described gate hole shape stainless steel plate is 30-60%.
2. the preparation method of high strength and high conductivity copper bus-bar according to claim 1, it is characterized in that: described electro-deposition method is prepared in the process of copper bus-bar, the current density of pulsed current is 60-120A/cm
2.
3. the preparation method of high strength and high conductivity copper bus-bar according to claim 1, is characterized in that: with the addition of carbon nanotube or rare earth element ce that concentration is 0.3-0.5mg/L in the electrolytic solution in described electro-deposition method.
4. the preparation method of high strength and high conductivity copper bus-bar according to claim 3, is characterized in that: the pH value of described electrolytic solution is 1-2.
5. the preparation method of high strength and high conductivity copper bus-bar according to claim 1, is characterized in that: the cross section of described nano twin crystal copper bar blank is rectangle.
6. the preparation method of high strength and high conductivity copper bus-bar according to claim 1, it is characterized in that: described extruding extending forming refers to, first nano twin crystal copper bar blank is entered in the race of squeegee roller by opening for feed, race inside is full of under compact wheel effect, enter cavity subsequently, and extrude after mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510250056.7A CN104805483B (en) | 2015-05-15 | 2015-05-15 | A kind of preparation method of high intensity and high conductivity copper bus-bar |
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| CN201510250056.7A CN104805483B (en) | 2015-05-15 | 2015-05-15 | A kind of preparation method of high intensity and high conductivity copper bus-bar |
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| CN104805483A true CN104805483A (en) | 2015-07-29 |
| CN104805483B CN104805483B (en) | 2017-07-28 |
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Citations (15)
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| CN1498987A (en) * | 2002-11-01 | 2004-05-26 | 中国科学院金属研究所 | Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method |
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| CN103556181A (en) * | 2013-10-28 | 2014-02-05 | 奉新赣锋锂业有限公司 | Metallic lithium electrolytic cell |
| CN103614583A (en) * | 2013-09-29 | 2014-03-05 | 魏玲 | Novel high-conductivity and high-strength graphene/copper material and preparation method thereof |
| CN104492875A (en) * | 2014-12-01 | 2015-04-08 | 国家电网公司 | Busbar processing device |
| CN104498780A (en) * | 2014-12-30 | 2015-04-08 | 吴俊� | High-conductivity high-strength copper-clad aluminum alloy, alloy conducting wire and preparation method |
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2015
- 2015-05-15 CN CN201510250056.7A patent/CN104805483B/en active Active
Patent Citations (15)
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| CN1498987A (en) * | 2002-11-01 | 2004-05-26 | 中国科学院金属研究所 | Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method |
| CN1644726A (en) * | 2004-01-23 | 2005-07-27 | 株式会社神户制钢所 | High-strength high-conductivity copper alloy |
| CN101187046A (en) * | 2007-08-24 | 2008-05-28 | 仲庆 | Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire |
| CN101527185A (en) * | 2008-03-05 | 2009-09-09 | 王康力 | Copper coated steel contact wire with high strength, low relaxation and high electric conductivity for electric traction |
| CN101665966A (en) * | 2009-09-25 | 2010-03-10 | 江苏广庆电子材料有限公司（中外合资） | Electroplating preparation method of copper-clad aluminium bars |
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| CN104805483B (en) | 2017-07-28 |
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