FR2823188B1 - Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques - Google Patents

Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques

Info

Publication number
FR2823188B1
FR2823188B1 FR0105067A FR0105067A FR2823188B1 FR 2823188 B1 FR2823188 B1 FR 2823188B1 FR 0105067 A FR0105067 A FR 0105067A FR 0105067 A FR0105067 A FR 0105067A FR 2823188 B1 FR2823188 B1 FR 2823188B1
Authority
FR
France
Prior art keywords
manipulator
discs
electronic
computer components
transferring media
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0105067A
Other languages
English (en)
Other versions
FR2823188A1 (fr
Inventor
Cesare Robert Di
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R2D INGENIERIE
Original Assignee
R2D INGENIERIE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R2D INGENIERIE filed Critical R2D INGENIERIE
Priority to FR0105067A priority Critical patent/FR2823188B1/fr
Priority to US09/904,104 priority patent/US20020146309A1/en
Priority to DE10214550A priority patent/DE10214550B4/de
Priority to TW091106859A priority patent/TW576821B/zh
Priority to JP2002103123A priority patent/JP2002368063A/ja
Publication of FR2823188A1 publication Critical patent/FR2823188A1/fr
Application granted granted Critical
Publication of FR2823188B1 publication Critical patent/FR2823188B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR0105067A 2001-04-06 2001-04-06 Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques Expired - Fee Related FR2823188B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0105067A FR2823188B1 (fr) 2001-04-06 2001-04-06 Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques
US09/904,104 US20020146309A1 (en) 2001-04-06 2001-07-13 Method and apparatus for the transfer of supports of electronic and/or computer components in the form of disks
DE10214550A DE10214550B4 (de) 2001-04-06 2002-04-02 Verfahren und Vorrichtung für den Transport von plattenförmigen Substraten von elektronischen Bauteilen und/oder Informationen
TW091106859A TW576821B (en) 2001-04-06 2002-04-04 Method and manipulator for the transport of disk-shaped memory device of informative components
JP2002103123A JP2002368063A (ja) 2001-04-06 2002-04-04 ディスク状基板の搬送方法及びそれに用いるマニピュレータ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0105067A FR2823188B1 (fr) 2001-04-06 2001-04-06 Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques

Publications (2)

Publication Number Publication Date
FR2823188A1 FR2823188A1 (fr) 2002-10-11
FR2823188B1 true FR2823188B1 (fr) 2003-09-05

Family

ID=8862307

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0105067A Expired - Fee Related FR2823188B1 (fr) 2001-04-06 2001-04-06 Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques

Country Status (5)

Country Link
US (1) US20020146309A1 (fr)
JP (1) JP2002368063A (fr)
DE (1) DE10214550B4 (fr)
FR (1) FR2823188B1 (fr)
TW (1) TW576821B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004039787A1 (de) * 2004-08-16 2006-02-23 Leybold Optics Gmbh Handlingsystem zum Be- und Entladen einer Prozessanlage und Verfahren zu seinem Betrieb
DE102006051493A1 (de) * 2006-10-31 2008-05-08 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur vertikalen Scheibenhandhabung in einer Prozesslinie
TWI587434B (zh) * 2016-03-29 2017-06-11 辛耘企業股份有限公司 晶圓轉向裝置
JP6688714B2 (ja) * 2016-09-29 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板配列装置および基板配列方法
JP6700149B2 (ja) * 2016-09-29 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス 姿勢変更装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03125453A (ja) * 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
JPH07307319A (ja) * 1994-05-10 1995-11-21 Dainippon Screen Mfg Co Ltd 基板整列装置及び方法
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability
US5954472A (en) * 1996-07-15 1999-09-21 Brooks Automation, Inc. Batch loader arm
JP3548373B2 (ja) * 1997-03-24 2004-07-28 大日本スクリーン製造株式会社 基板処理装置
US6152680A (en) 1997-08-26 2000-11-28 Daitron, Inc. Wafer cassette rotation mechanism
JP3627132B2 (ja) * 1997-11-18 2005-03-09 東京エレクトロン株式会社 基板乾燥処理装置及び基板乾燥処理方法
JP3577204B2 (ja) * 1997-12-02 2004-10-13 大日本スクリーン製造株式会社 基板姿勢変換装置
JP3615042B2 (ja) * 1998-01-29 2005-01-26 大日本スクリーン製造株式会社 基板搬送装置
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
JP3938436B2 (ja) * 1998-06-05 2007-06-27 大日本スクリーン製造株式会社 基板移載装置およびそれを用いた基板処理装置
JP3905658B2 (ja) * 1999-02-08 2007-04-18 大日本スクリーン製造株式会社 基板搬送装置

Also Published As

Publication number Publication date
FR2823188A1 (fr) 2002-10-11
DE10214550B4 (de) 2005-07-21
JP2002368063A (ja) 2002-12-20
TW576821B (en) 2004-02-21
US20020146309A1 (en) 2002-10-10
DE10214550A1 (de) 2003-03-13

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