FR2805807B1 - Composition en film epais isolante et dispositif electronique en ceramique et appareil electronique l'utilisant - Google Patents

Composition en film epais isolante et dispositif electronique en ceramique et appareil electronique l'utilisant

Info

Publication number
FR2805807B1
FR2805807B1 FR0102826A FR0102826A FR2805807B1 FR 2805807 B1 FR2805807 B1 FR 2805807B1 FR 0102826 A FR0102826 A FR 0102826A FR 0102826 A FR0102826 A FR 0102826A FR 2805807 B1 FR2805807 B1 FR 2805807B1
Authority
FR
France
Prior art keywords
electronic
insulating film
same
film composition
highly insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0102826A
Other languages
English (en)
Other versions
FR2805807A1 (fr
Inventor
Mitsuyoshi Nishide
Jun Urakawa
Yukinobu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of FR2805807A1 publication Critical patent/FR2805807A1/fr
Application granted granted Critical
Publication of FR2805807B1 publication Critical patent/FR2805807B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
    • C04B35/195—Alkaline earth aluminosilicates, e.g. cordierite or anorthite
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR0102826A 2000-03-02 2001-03-01 Composition en film epais isolante et dispositif electronique en ceramique et appareil electronique l'utilisant Expired - Lifetime FR2805807B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000057474 2000-03-02
JP2000354131A JP3882500B2 (ja) 2000-03-02 2000-11-21 厚膜絶縁組成物およびそれを用いたセラミック電子部品、ならびに電子装置

Publications (2)

Publication Number Publication Date
FR2805807A1 FR2805807A1 (fr) 2001-09-07
FR2805807B1 true FR2805807B1 (fr) 2005-04-29

Family

ID=26586627

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0102826A Expired - Lifetime FR2805807B1 (fr) 2000-03-02 2001-03-01 Composition en film epais isolante et dispositif electronique en ceramique et appareil electronique l'utilisant

Country Status (5)

Country Link
US (1) US6452264B2 (fr)
JP (1) JP3882500B2 (fr)
DE (1) DE10108666A1 (fr)
FR (1) FR2805807B1 (fr)
GB (1) GB2361811B (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2368454B (en) * 2000-10-24 2005-04-06 Ibm A chip carrier for high-frequency electronic device
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
KR100481216B1 (ko) * 2002-06-07 2005-04-08 엘지전자 주식회사 볼 그리드 어레이 패키지 및 그의 제조 방법
JP3855947B2 (ja) * 2003-03-10 2006-12-13 株式会社村田製作所 電子部品装置およびその製造方法
US20050247761A1 (en) * 2004-05-04 2005-11-10 Albanese Patricia M Surface mount attachment of components
US20080179618A1 (en) * 2007-01-26 2008-07-31 Ching-Tai Cheng Ceramic led package
JP5693940B2 (ja) * 2010-12-13 2015-04-01 株式会社トクヤマ セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法
JP5977021B2 (ja) * 2011-11-30 2016-08-24 日本電波工業株式会社 表面実装型圧電発振器
US9799627B2 (en) * 2012-01-19 2017-10-24 Semiconductor Components Industries, Llc Semiconductor package structure and method
JP6094768B2 (ja) 2012-04-27 2017-03-15 パナソニックＩｐマネジメント株式会社 セラミック基板複合体およびセラミック基板複合体の製造方法
US9113583B2 (en) * 2012-07-31 2015-08-18 General Electric Company Electronic circuit board, assembly and a related method thereof
JP5838978B2 (ja) * 2013-01-24 2016-01-06 株式会社村田製作所 セラミック積層部品
JP6070588B2 (ja) 2014-01-24 2017-02-01 株式会社村田製作所 多層配線基板
JP2018026793A (ja) * 2016-08-05 2018-02-15 株式会社村田製作所 アンテナ素子
KR101952876B1 (ko) * 2017-06-28 2019-02-28 삼성전기주식회사 적층 세라믹 커패시터

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014494A (ja) * 1983-07-04 1985-01-25 株式会社日立製作所 セラミツク多層配線基板およびその製造方法
US4724021A (en) * 1986-07-23 1988-02-09 E. I. Du Pont De Nemours And Company Method for making porous bottom-layer dielectric composite structure
GB8914023D0 (en) * 1989-06-19 1989-08-09 Alcan Int Ltd Porous ceramic membrane method
JP2610375B2 (ja) * 1992-02-27 1997-05-14 富士通株式会社 多層セラミック基板の製造方法
US5411563A (en) * 1993-06-25 1995-05-02 Industrial Technology Research Institute Strengthening of multilayer ceramic/glass articles
JP3662955B2 (ja) * 1994-09-16 2005-06-22 株式会社東芝 回路基板および回路基板の製造方法
EP0845445B1 (fr) * 1996-06-17 2004-10-27 Toray Industries, Inc. Feuille crue de ceramique photosensible, emballage ceramique, procede de fabrication et utilisation
JP3548366B2 (ja) * 1997-02-27 2004-07-28 京セラ株式会社 セラミック回路基板
JPH11207872A (ja) * 1998-01-21 1999-08-03 Mitsubishi Heavy Ind Ltd 傾斜機能耐火材
JPH11251723A (ja) 1998-02-26 1999-09-17 Kyocera Corp 回路基板
JP2000165020A (ja) * 1998-11-26 2000-06-16 Kyocera Corp セラミック回路基板

Also Published As

Publication number Publication date
JP2001316169A (ja) 2001-11-13
GB2361811B (en) 2002-09-04
DE10108666A1 (de) 2001-09-13
FR2805807A1 (fr) 2001-09-07
GB2361811A (en) 2001-10-31
GB0104065D0 (en) 2001-04-04
JP3882500B2 (ja) 2007-02-14
US6452264B2 (en) 2002-09-17
US20020011659A1 (en) 2002-01-31

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