FR2815487B1 - Oscillateur et appareil electronique l'utilisant - Google Patents
Oscillateur et appareil electronique l'utilisantInfo
- Publication number
- FR2815487B1 FR2815487B1 FR0113095A FR0113095A FR2815487B1 FR 2815487 B1 FR2815487 B1 FR 2815487B1 FR 0113095 A FR0113095 A FR 0113095A FR 0113095 A FR0113095 A FR 0113095A FR 2815487 B1 FR2815487 B1 FR 2815487B1
- Authority
- FR
- France
- Prior art keywords
- oscillator
- same
- electronic apparatus
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10174—Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000312142A JP2002124829A (ja) | 2000-10-12 | 2000-10-12 | 発振器およびそれを用いた電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2815487A1 FR2815487A1 (fr) | 2002-04-19 |
FR2815487B1 true FR2815487B1 (fr) | 2003-03-28 |
Family
ID=18791788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0113095A Expired - Fee Related FR2815487B1 (fr) | 2000-10-12 | 2001-10-11 | Oscillateur et appareil electronique l'utilisant |
Country Status (5)
Country | Link |
---|---|
US (1) | US6727766B2 (fr) |
JP (1) | JP2002124829A (fr) |
CA (1) | CA2357628C (fr) |
FR (1) | FR2815487B1 (fr) |
GB (1) | GB2370703B (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6753744B2 (en) * | 2002-06-27 | 2004-06-22 | Harris Corporation | High efficiency three port circuit |
US7301408B2 (en) * | 2002-10-15 | 2007-11-27 | Marvell World Trade Ltd. | Integrated circuit with low dielectric loss packaging material |
WO2005004322A1 (fr) * | 2003-07-02 | 2005-01-13 | Murata Manufacturing Co., Ltd. | Oscillateur et dispositif d'emission/reception |
US9230890B2 (en) * | 2012-04-27 | 2016-01-05 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
JP6083214B2 (ja) | 2012-11-30 | 2017-02-22 | セイコーエプソン株式会社 | 発振器、電子機器、及び移動体 |
JP6171516B2 (ja) * | 2013-04-12 | 2017-08-02 | セイコーエプソン株式会社 | 電子デバイス、電子デバイスの製造方法、電子機器、および移動体 |
WO2024036410A1 (fr) * | 2022-08-19 | 2024-02-22 | Quantum Valley Investment Fund LP | Changement d'échantillons dans un système de résonance magnétique |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS639203A (ja) | 1986-06-30 | 1988-01-14 | Toshiba Corp | マイクロ波発振器 |
US4758922A (en) * | 1986-11-14 | 1988-07-19 | Matsushita Electric Industrial Co., Ltd. | High frequency circuit having a microstrip resonance element |
JPH0354903A (ja) * | 1989-03-31 | 1991-03-08 | Kyocera Corp | 発振回路 |
JPH04326606A (ja) * | 1991-04-26 | 1992-11-16 | Sumitomo Electric Ind Ltd | 発振回路 |
JPH05206730A (ja) * | 1992-01-27 | 1993-08-13 | Murata Mfg Co Ltd | 電圧制御発振器およびその発振周波数の調整方法 |
US5357218A (en) * | 1993-05-03 | 1994-10-18 | Motorola, Inc. | Self-shielding microstrip assembly |
NL1000329C2 (en) * | 1995-05-09 | 1996-11-12 | Imec Vzw Interuniversitair Mic | Millimetre or microwave oscillator device for receiver or transmitter |
JPH08330816A (ja) * | 1995-05-29 | 1996-12-13 | Alps Electric Co Ltd | 誘電体共振器及びこれを用いた電圧制御発振器 |
JPH10173439A (ja) | 1996-12-05 | 1998-06-26 | Murata Mfg Co Ltd | 電圧制御発振器 |
DE69834456T2 (de) * | 1997-07-25 | 2006-09-21 | Matsushita Electric Industrial Co., Ltd., Kadoma | Hochfrequenz-Oszillatorschaltung |
JP2001230606A (ja) * | 2000-02-15 | 2001-08-24 | Matsushita Electric Ind Co Ltd | マイクロストリップ線路と、これを用いたマイクロ波装置 |
-
2000
- 2000-10-12 JP JP2000312142A patent/JP2002124829A/ja active Pending
-
2001
- 2001-09-21 CA CA002357628A patent/CA2357628C/fr not_active Expired - Fee Related
- 2001-09-24 GB GB0122953A patent/GB2370703B/en not_active Expired - Fee Related
- 2001-10-05 US US09/971,973 patent/US6727766B2/en not_active Expired - Fee Related
- 2001-10-11 FR FR0113095A patent/FR2815487B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20030107444A1 (en) | 2003-06-12 |
US6727766B2 (en) | 2004-04-27 |
GB0122953D0 (en) | 2001-11-14 |
JP2002124829A (ja) | 2002-04-26 |
FR2815487A1 (fr) | 2002-04-19 |
GB2370703A (en) | 2002-07-03 |
CA2357628C (fr) | 2005-06-07 |
GB2370703B (en) | 2003-02-19 |
CA2357628A1 (fr) | 2002-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100630 |