DE69920842D1 - Flüssigkeitsgekühltes elektronisches Gerät - Google Patents

Flüssigkeitsgekühltes elektronisches Gerät

Info

Publication number
DE69920842D1
DE69920842D1 DE69920842T DE69920842T DE69920842D1 DE 69920842 D1 DE69920842 D1 DE 69920842D1 DE 69920842 T DE69920842 T DE 69920842T DE 69920842 T DE69920842 T DE 69920842T DE 69920842 D1 DE69920842 D1 DE 69920842D1
Authority
DE
Germany
Prior art keywords
electronic device
liquid cooled
cooled electronic
liquid
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69920842T
Other languages
English (en)
Other versions
DE69920842T2 (de
Inventor
Junichi Ishimine
Masahiro Suzuki
Akira Tamura
Masahiro Miyo
Akihiko Fujisaki
Keizo Takemura
Jie Wei
Hisashi Kawashima
Yoshiaki Udagawa
Haruhiko Yamamoto
Masahiro Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69920842D1 publication Critical patent/DE69920842D1/de
Application granted granted Critical
Publication of DE69920842T2 publication Critical patent/DE69920842T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69920842T 1998-08-11 1999-01-25 Flüssigkeitsgekühltes elektronisches Gerät Expired - Lifetime DE69920842T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22690698A JP3315649B2 (ja) 1998-08-11 1998-08-11 電子機器
JP22690698 1998-08-11

Publications (2)

Publication Number Publication Date
DE69920842D1 true DE69920842D1 (de) 2004-11-11
DE69920842T2 DE69920842T2 (de) 2005-02-10

Family

ID=16852460

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69920842T Expired - Lifetime DE69920842T2 (de) 1998-08-11 1999-01-25 Flüssigkeitsgekühltes elektronisches Gerät

Country Status (4)

Country Link
US (2) US6404640B1 (de)
EP (1) EP0985999B1 (de)
JP (1) JP3315649B2 (de)
DE (1) DE69920842T2 (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6496366B1 (en) 1999-10-26 2002-12-17 Rackable Systems, Llc High density computer equipment storage system
US20020062767A1 (en) * 2000-11-30 2002-05-30 Walker James T. Safe
US20060060114A1 (en) * 2000-11-30 2006-03-23 Walker James T Security safe
JP3658317B2 (ja) * 2000-12-19 2005-06-08 株式会社日立製作所 冷却方法および冷却システムならびに情報処理装置
EP1372367A4 (de) 2001-03-02 2008-09-03 Sanyo Electric Co Elektronische einrichtung
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
DE10210480B4 (de) * 2002-03-11 2005-07-21 Rittal Gmbh & Co. Kg Kühlanordnung
JP3885679B2 (ja) * 2002-06-28 2007-02-21 株式会社日立製作所 電子機器
JP2006511968A (ja) * 2003-03-11 2006-04-06 リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト 冷媒案内エレメントおよび冷媒案内装置
US7173821B2 (en) * 2003-05-16 2007-02-06 Rackable Systems, Inc. Computer rack with power distribution system
DE10335197B4 (de) 2003-07-30 2005-10-27 Kermi Gmbh Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
US7150109B2 (en) * 2003-08-25 2006-12-19 Isothermal Systems Research, Inc. Dry-wet thermal management system
US7180741B1 (en) 2003-08-26 2007-02-20 Isothermal Systems Research, Inc. Spray cool system with a dry access chamber
US7043933B1 (en) 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US20050123418A1 (en) * 2003-12-08 2005-06-09 Manole Dan M. Compact compressors and refrigeration systems
US7000467B2 (en) * 2003-12-16 2006-02-21 International Business Machines Corporation Method, system and program product for monitoring rate of volume change of coolant within a cooling system
US6958911B2 (en) * 2004-01-30 2005-10-25 Isothermal Systems Research, Inc. Low momentum loss fluid manifold system
DE102004008461A1 (de) * 2004-02-17 2005-10-06 Rittal Gmbh & Co. Kg Gehäuseanordnung
DE102004012026B3 (de) * 2004-03-11 2005-11-17 Hüttinger Elektronik GmbH & Co. KG Anordnung zum Kühlen
US20060011472A1 (en) * 2004-07-19 2006-01-19 Flick Timothy J Deep well geothermal hydrogen generator
US7086247B2 (en) * 2004-08-31 2006-08-08 International Business Machines Corporation Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
US7478541B2 (en) * 2004-11-01 2009-01-20 Tecumseh Products Company Compact refrigeration system for providing multiple levels of cooling
US7617696B2 (en) * 2004-11-12 2009-11-17 Tecumseh Products Company Compact refrigeration system and power supply unit including dynamic insulation
JP4321478B2 (ja) * 2005-03-31 2009-08-26 日本電気株式会社 情報処理用ブレード及び情報処理装置
US7342789B2 (en) * 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
JP4593438B2 (ja) * 2005-10-24 2010-12-08 富士通株式会社 電子機器および冷却モジュール
US7212409B1 (en) * 2005-12-05 2007-05-01 Hewlett-Packard Development Company, L.P. Cam actuated cold plate
US20080032794A1 (en) * 2006-07-24 2008-02-07 Rambus, Inc. Partitioned game console system
US7285851B1 (en) 2006-09-29 2007-10-23 Teradyne, Inc. Liquid immersion cooled multichip module
US7450385B1 (en) * 2007-06-15 2008-11-11 International Business Machines Corporation Liquid-based cooling apparatus for an electronics rack
US20090038324A1 (en) 2007-08-07 2009-02-12 Syracuse University Power and Refrigeration Cascade System
US7819667B2 (en) 2007-08-28 2010-10-26 General Dynamics Advanced Information Systems, Inc. System and method for interconnecting circuit boards
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP2009230505A (ja) * 2008-03-24 2009-10-08 Fujitsu Ltd 基板ユニットおよび電子機器
EP2117288A1 (de) * 2008-05-07 2009-11-11 3M Innovative Properties Company Wärmeregelungssystem für einen Schrank mit elektronischer Ausrüstung
US9426903B1 (en) 2008-06-27 2016-08-23 Amazon Technologies, Inc. Cooling air stack for computer equipment
WO2010016842A1 (en) * 2008-08-07 2010-02-11 Syracuse University Power and refrigeration cascade system
DK2321849T3 (da) * 2008-08-11 2022-01-31 Green Revolution Cooling Inc Horisontalt computerserverstativ nedsænket i væske og systemer og fremgangsmåder til afkøling af et sådant serverstativ
US20110162818A1 (en) * 2008-09-23 2011-07-07 Tyrell Kyle Kumlin Providing Connection Elements For Connecting Fluid Pipes To Carry Cooling Fluid In A System
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
JP5062191B2 (ja) * 2009-02-02 2012-10-31 ダイキン工業株式会社 室外機
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
DK2259310T3 (da) * 2009-06-05 2020-06-22 Siemens Gamesa Renewable Energy As Integreret varmeveksler
JP5460362B2 (ja) * 2010-02-04 2014-04-02 株式会社日立製作所 電子機器の冷却システム
US9894808B2 (en) * 2010-03-31 2018-02-13 Amazon Technologies, Inc. Compressed air cooling system for data center
US8755192B1 (en) 2010-03-31 2014-06-17 Amazon Technologies, Inc. Rack-mounted computer system with shock-absorbing chassis
US8638553B1 (en) 2010-03-31 2014-01-28 Amazon Technologies, Inc. Rack system cooling with inclined computing devices
US9622387B1 (en) 2010-03-31 2017-04-11 Amazon Technologies, Inc. Rack-mounted air directing device with scoop
ES2398514T3 (es) * 2010-05-13 2013-03-19 Lg Electronics, Inc. Acondicionador de aire
US8144467B2 (en) * 2010-05-26 2012-03-27 International Business Machines Corporation Dehumidifying and re-humidifying apparatus and method for an electronics rack
US9038406B2 (en) 2010-05-26 2015-05-26 International Business Machines Corporation Dehumidifying cooling apparatus and method for an electronics rack
US8189334B2 (en) 2010-05-26 2012-05-29 International Business Machines Corporation Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US10492331B1 (en) 2010-09-29 2019-11-26 Amazon Technologies, Inc. System and method for cooling power distribution units
JP5126343B2 (ja) * 2010-11-17 2013-01-23 ダイキン工業株式会社 空気調和装置
TW201221874A (en) * 2010-11-22 2012-06-01 Hon Hai Prec Ind Co Ltd Computer sever center
CN102478224A (zh) * 2010-11-29 2012-05-30 欧司朗有限公司 光引擎的散热结构、其制造方法、包含该结构的发光系统
KR101796448B1 (ko) * 2010-12-03 2017-11-10 삼성전자주식회사 기판 냉각플레이트 분리장치 및 기판 냉각플레이트 분리방법
US20130052936A1 (en) * 2011-08-31 2013-02-28 John C. Jordan Heating and cooling ventilation system
EP2812769B1 (de) 2012-02-09 2018-11-07 Hewlett-Packard Enterprise Development LP Wärmeableitungssystem
KR20140132333A (ko) 2012-03-12 2014-11-17 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 액체 온도 제어 냉각
US10082857B1 (en) 2012-08-07 2018-09-25 Amazon Technologies, Inc. Cooling electrical systems based on power measurements
EP2901828A4 (de) 2012-09-28 2016-06-01 Hewlett Packard Development Co Kühlanordnung
DE102012217872A1 (de) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Wärmeübertrager
DE102012217868A1 (de) 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Wärmeübertrager
EP2915417B1 (de) 2012-10-31 2017-11-29 Hewlett-Packard Enterprise Development LP Modulares regalsystem
EP2952076B1 (de) * 2013-01-31 2019-10-30 Hewlett-Packard Enterprise Development LP Flüssigkeitskühlung
DE102014202007A1 (de) * 2013-02-07 2014-08-07 Ceramtec Gmbh Mehrebenenmetallisierung auf einem Keramiksubstrat
US9894809B1 (en) 2013-02-28 2018-02-13 Amazon Technologies, Inc. System for supplying cooling air from sub-floor space
US9451730B2 (en) 2013-03-06 2016-09-20 Amazon Technologies, Inc. Managing airflow supplied through soft ducts
US9326386B2 (en) * 2013-04-22 2016-04-26 International Business Machines Corporation Computer system component bay
AU2014262796A1 (en) 2013-05-06 2015-12-24 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
TWI487923B (zh) * 2013-06-18 2015-06-11 Chroma Ate Inc Test the temperature control module
WO2015175693A1 (en) 2014-05-13 2015-11-19 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
JP6565611B2 (ja) * 2015-11-04 2019-08-28 富士通株式会社 情報処理装置
US20170314850A1 (en) * 2016-04-28 2017-11-02 General Electric Company Refrigerator Appliance and Heater for Preventing Condensation
CN107589804A (zh) * 2017-10-04 2018-01-16 张四清 一种便于拆装的计算机用水冷散热机箱
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
CN109874275B (zh) * 2019-01-18 2024-03-12 广东西江数据科技有限公司 一种干湿分离式机箱及使用该机箱的网络设备
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
US12089368B2 (en) 2022-09-14 2024-09-10 Green Revolution Cooling, Inc. System and method for cooling computing devices using a primary circuit dielectric cooling fluid
WO2024176349A1 (ja) * 2023-02-21 2024-08-29 三菱電機株式会社 モジュール
CN117038869B (zh) * 2023-08-18 2024-04-12 长兴太湖能谷科技有限公司 一种电池硫化铅匀化用组合式插入导管
CN117525771B (zh) * 2024-01-05 2024-05-10 深圳市誉辰智能装备股份有限公司 电池等压注液密封仓及其降压泄压方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580399A (en) 1978-12-13 1980-06-17 Fujitsu Ltd Electronic device cooling structure
JPS56104457A (en) 1980-01-23 1981-08-20 Nippon Telegr & Teleph Corp <Ntt> Cooler for electronic device
JPS5899205A (ja) * 1981-12-09 1983-06-13 株式会社日立製作所 密閉型制御盤の冷却装置
ATE26520T1 (de) * 1982-12-21 1987-04-15 Siemens Ag Baugruppentraeger.
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
JPS63192256A (ja) 1987-02-04 1988-08-09 Nec Corp 集積回路の冷却構造
JPS6484700A (en) 1987-09-28 1989-03-29 Hitachi Ltd Electronic computer
US4791983A (en) 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
EP0320198B1 (de) 1987-12-07 1995-03-01 Nec Corporation Kühlungssystem für integrierte Schaltungspackung
US4809134A (en) 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4825337A (en) * 1988-05-17 1989-04-25 Prime Computer, Inc. Circuit board thermal contact device
JPH02136390A (ja) 1988-11-16 1990-05-24 Suzuki Motor Co Ltd ウォータビークルのステアリング装置
JPH0766027B2 (ja) 1989-12-21 1995-07-19 安藤電気株式会社 Icテスタ用テストヘッドの冷却構造
US4994937A (en) * 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
JPH03208365A (ja) 1990-01-10 1991-09-11 Hitachi Ltd 電子装置の冷却機構及びその使用方法
JP2910127B2 (ja) * 1990-03-01 1999-06-23 富士通株式会社 冷却装置
JPH073914B2 (ja) 1990-07-13 1995-01-18 三菱伸銅株式会社 回路基板用冷却体および回路基板の冷却構造
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH04320399A (ja) 1991-04-19 1992-11-11 Fujitsu Ltd 電子機器の冷却装置
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
JPH06326226A (ja) 1993-03-15 1994-11-25 Toshiba Corp 冷却装置
JPH06266474A (ja) 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
DE4312057A1 (de) 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
JP3166423B2 (ja) 1993-07-22 2001-05-14 株式会社デンソー 冷却構造体
JPH0864732A (ja) 1994-08-26 1996-03-08 Mitsubishi Electric Corp 半導体集積回路装置
JPH08316676A (ja) 1995-05-15 1996-11-29 Hitachi Ltd 電子装置および筐体構造およびその冷却ユニット
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
JP3651081B2 (ja) * 1995-10-06 2005-05-25 株式会社デンソー 沸騰冷却装置
JPH09148498A (ja) 1995-11-24 1997-06-06 Hitachi Ltd 電子部品
KR100211058B1 (ko) * 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
JPH09257352A (ja) 1996-03-26 1997-10-03 Matsushita Electric Works Ltd 蓄冷式冷風装置
JP3725257B2 (ja) 1996-08-27 2005-12-07 富士通株式会社 実装部品の冷却構造
JPH10117078A (ja) 1996-10-09 1998-05-06 Fujitsu General Ltd 電子機器の放熱構造
US5954127A (en) * 1997-07-16 1999-09-21 International Business Machines Corporation Cold plate for dual refrigeration system
US6053238A (en) * 1998-10-30 2000-04-25 International Business Machines Corporation Center feed parallel flow cold plate for dual refrigeration systems

Also Published As

Publication number Publication date
US6621707B2 (en) 2003-09-16
JP3315649B2 (ja) 2002-08-19
US6404640B1 (en) 2002-06-11
US20020021557A1 (en) 2002-02-21
JP2000059062A (ja) 2000-02-25
EP0985999A1 (de) 2000-03-15
DE69920842T2 (de) 2005-02-10
EP0985999B1 (de) 2004-10-06

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