FR2799554B1 - Composition d'elimination de photoresist et procede pour eliminer un photoresist au moyen de cette composition - Google Patents
Composition d'elimination de photoresist et procede pour eliminer un photoresist au moyen de cette compositionInfo
- Publication number
- FR2799554B1 FR2799554B1 FR0012799A FR0012799A FR2799554B1 FR 2799554 B1 FR2799554 B1 FR 2799554B1 FR 0012799 A FR0012799 A FR 0012799A FR 0012799 A FR0012799 A FR 0012799A FR 2799554 B1 FR2799554 B1 FR 2799554B1
- Authority
- FR
- France
- Prior art keywords
- photoresist
- elimination
- same
- composition
- elimination composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000008030 elimination Effects 0.000 title 2
- 238000003379 elimination reaction Methods 0.000 title 2
- 229920002120 photoresistant polymer Polymers 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Emergency Medicine (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1999-0043486A KR100434485B1 (ko) | 1999-10-08 | 1999-10-08 | 포토레지스트 스트립퍼 조성물 및 이를 이용한 포토레지스트 스트립 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2799554A1 FR2799554A1 (fr) | 2001-04-13 |
FR2799554B1 true FR2799554B1 (fr) | 2004-04-30 |
Family
ID=19614522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0012799A Expired - Fee Related FR2799554B1 (fr) | 1999-10-08 | 2000-10-06 | Composition d'elimination de photoresist et procede pour eliminer un photoresist au moyen de cette composition |
Country Status (7)
Country | Link |
---|---|
US (2) | US6432622B1 (fr) |
JP (1) | JP3946428B2 (fr) |
KR (1) | KR100434485B1 (fr) |
DE (1) | DE10049831B4 (fr) |
FR (1) | FR2799554B1 (fr) |
GB (1) | GB2357343B (fr) |
TW (1) | TW554240B (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6589719B1 (en) | 2001-12-14 | 2003-07-08 | Samsung Electronics Co., Ltd. | Photoresist stripper compositions |
US6682876B2 (en) | 2001-12-14 | 2004-01-27 | Samsung Electronics Co., Ltd. | Thinner composition and method of stripping a photoresist using the same |
US7074726B2 (en) * | 2002-01-31 | 2006-07-11 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating method and substrate treating apparatus |
WO2003067631A2 (fr) * | 2002-02-06 | 2003-08-14 | Arch Specialty Chemicals, Inc. | Composition et procede ameliores d'elimination des bourrelets lateraux de semi-conducteurs, et leur procede d'utilisation |
US6682607B1 (en) * | 2002-03-05 | 2004-01-27 | Sandia Corporation | Reconditioning of semiconductor substrates to remove photoresist during semiconductor device fabrication |
US6878500B2 (en) * | 2002-04-06 | 2005-04-12 | Marlborough, | Stripping method |
DE10244862B4 (de) * | 2002-09-23 | 2006-09-14 | IHP GmbH - Innovations for High Performance Microelectronics/Institut für innovative Mikroelektronik | Verfahren zur Herstellung eines elektronischen Bauelements mit einer Praseodymoxid-Schicht |
TWI231950B (en) * | 2002-11-28 | 2005-05-01 | Tokyo Electron Ltd | Substrate processing apparatus and cleaning method |
JP2004207454A (ja) * | 2002-12-25 | 2004-07-22 | Renesas Technology Corp | 半導体装置の製造方法 |
US6955984B2 (en) * | 2003-05-16 | 2005-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Surface treatment of metal interconnect lines |
JP2005286208A (ja) * | 2004-03-30 | 2005-10-13 | Shin Etsu Chem Co Ltd | 剥離液および薄膜除去方法 |
KR100690347B1 (ko) * | 2005-04-09 | 2007-03-09 | 주식회사 엘지화학 | 박리액 조성물, 이를 이용한 박리 방법 및 그 박리 장치 |
KR100646418B1 (ko) * | 2005-09-26 | 2006-11-14 | 세메스 주식회사 | 기판의 감광막 제거 방법 |
TWI365362B (en) * | 2005-12-02 | 2012-06-01 | Tokyo Ohka Kogyo Co Ltd | Cleaning liquid for photolithography and method of cleaning substrate using the same |
KR20070081572A (ko) * | 2006-02-13 | 2007-08-17 | 삼성전자주식회사 | 슬릿 코터 세정제, 표시장치 제조용 슬릿 코터 및표시장치의 제조방법 |
WO2008039730A1 (fr) * | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | compositions et procÉdÉs d'Élimination d'un agent photorÉsistant pour le recyclage d'une galette de silicium |
GB0623621D0 (en) * | 2006-11-27 | 2007-01-03 | Skype Ltd | Communication system |
US8021490B2 (en) * | 2007-01-04 | 2011-09-20 | Eastman Chemical Company | Substrate cleaning processes through the use of solvents and systems |
EP2045320B1 (fr) * | 2007-09-19 | 2012-04-25 | Bubbles & Beyond Gmbh | Produit de nettoyage pour la suppression de couches de couleurs de surfaces, procédé de fabrication du produit et procédé de nettoyage |
US7670438B2 (en) * | 2007-10-03 | 2010-03-02 | United Microelectronics Corp. | Method of removing particles from wafer |
US8227182B2 (en) * | 2008-08-11 | 2012-07-24 | Samsung Electronics Co., Ltd. | Methods of forming a photosensitive film |
DE102009014380A1 (de) | 2009-03-26 | 2010-10-07 | Bubbles And Beyond Gmbh | Verfahren und Zusammensetzung zum Reinigen von Gegenständen |
US9875916B2 (en) * | 2012-07-09 | 2018-01-23 | Tokyo Electron Limited | Method of stripping photoresist on a single substrate system |
US9029268B2 (en) * | 2012-11-21 | 2015-05-12 | Dynaloy, Llc | Process for etching metals |
CN108946656A (zh) * | 2017-05-25 | 2018-12-07 | 联华电子股份有限公司 | 半导体制作工艺 |
KR102638509B1 (ko) * | 2020-12-29 | 2024-02-19 | 세메스 주식회사 | 기판 처리 방법 |
KR20240082612A (ko) | 2022-12-02 | 2024-06-11 | 덕산네오룩스 주식회사 | 착색 감광성 수지 제거를 위한 씬너 조성물 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US168050A (en) * | 1875-09-21 | Improvement in sad-irons | ||
US3923882A (en) | 1974-04-17 | 1975-12-02 | Union Carbide Corp | Production of acetic acid |
US4229514A (en) * | 1978-12-29 | 1980-10-21 | Konishiroku Photo Industry Co., Ltd. | Photosensitive composition |
US5173392A (en) * | 1989-08-28 | 1992-12-22 | International Business Machines, Corp. | Forming a pattern on a substrate |
US5296330A (en) | 1991-08-30 | 1994-03-22 | Ciba-Geigy Corp. | Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive |
US5268260A (en) * | 1991-10-22 | 1993-12-07 | International Business Machines Corporation | Photoresist develop and strip solvent compositions and method for their use |
US5571417A (en) | 1991-10-22 | 1996-11-05 | International Business Machines Corporation | Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol |
JPH07504455A (ja) | 1992-03-06 | 1995-05-18 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | コーティングを除去するためのラクトン及びエステル含有組成物 |
US5362608A (en) * | 1992-08-24 | 1994-11-08 | Brewer Science, Inc. | Microlithographic substrate cleaning and compositions therefor |
US5612303B1 (en) | 1993-06-15 | 2000-07-18 | Nitto Chemical Industry Co Ltd | Solvent composition |
JPH086241A (ja) | 1994-06-21 | 1996-01-12 | Konica Corp | 感光性平版印刷版 |
US5897982A (en) * | 1996-03-05 | 1999-04-27 | Kabushiki Kaisha Toshiba | Resist develop process having a post develop dispense step |
KR100234532B1 (ko) | 1996-09-21 | 1999-12-15 | 윤종용 | 반도체 제조공정의 포토레지스트 세정용 시너 조성물 및 그를 이용한 반도체장치의 제조방법 |
JPH10303106A (ja) * | 1997-04-30 | 1998-11-13 | Toshiba Corp | 現像処理装置およびその処理方法 |
KR100265766B1 (ko) * | 1997-09-04 | 2000-09-15 | 윤종용 | 반도체장치 제조용 웨이퍼의 리워크방법 및 반도체장치의 제조방법 |
KR100271761B1 (ko) | 1997-11-21 | 2000-12-01 | 윤종용 | 반도체장치 제조용 현상장치 및 그의 제어방법 |
JP3401201B2 (ja) * | 1998-12-02 | 2003-04-28 | 東京応化工業株式会社 | 電子部品用基材の製造方法及びそれに用いるレジスト除去剤 |
-
1999
- 1999-10-08 KR KR10-1999-0043486A patent/KR100434485B1/ko not_active IP Right Cessation
-
2000
- 2000-10-06 US US09/679,558 patent/US6432622B1/en not_active Expired - Fee Related
- 2000-10-06 FR FR0012799A patent/FR2799554B1/fr not_active Expired - Fee Related
- 2000-10-06 GB GB0024575A patent/GB2357343B/en not_active Expired - Lifetime
- 2000-10-06 TW TW089120922A patent/TW554240B/zh not_active IP Right Cessation
- 2000-10-09 DE DE10049831A patent/DE10049831B4/de not_active Expired - Fee Related
- 2000-10-10 JP JP2000308984A patent/JP3946428B2/ja not_active Expired - Fee Related
-
2002
- 2002-01-15 US US10/045,062 patent/US6458518B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2001159826A (ja) | 2001-06-12 |
GB0024575D0 (en) | 2000-11-22 |
KR100434485B1 (ko) | 2004-06-05 |
US6458518B1 (en) | 2002-10-01 |
US20020127500A1 (en) | 2002-09-12 |
DE10049831B4 (de) | 2010-10-28 |
DE10049831A1 (de) | 2001-08-30 |
GB2357343A (en) | 2001-06-20 |
TW554240B (en) | 2003-09-21 |
US6432622B1 (en) | 2002-08-13 |
KR20010036461A (ko) | 2001-05-07 |
FR2799554A1 (fr) | 2001-04-13 |
JP3946428B2 (ja) | 2007-07-18 |
GB2357343B (en) | 2003-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100630 |