FR2791056B1 - Anthracenylmethyl(meth)acrylates, polymeres qu'ils permettent de preparer et revetements anti-reflechissants les contenant - Google Patents
Anthracenylmethyl(meth)acrylates, polymeres qu'ils permettent de preparer et revetements anti-reflechissants les contenantInfo
- Publication number
- FR2791056B1 FR2791056B1 FR9915748A FR9915748A FR2791056B1 FR 2791056 B1 FR2791056 B1 FR 2791056B1 FR 9915748 A FR9915748 A FR 9915748A FR 9915748 A FR9915748 A FR 9915748A FR 2791056 B1 FR2791056 B1 FR 2791056B1
- Authority
- FR
- France
- Prior art keywords
- anthracenylmethyl
- acrylates
- meth
- polymers
- prepare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/14—Preparation of carboxylic acid esters from carboxylic acid halides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1806—C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2603/00—Systems containing at least three condensed rings
- C07C2603/02—Ortho- or ortho- and peri-condensed systems
- C07C2603/04—Ortho- or ortho- and peri-condensed systems containing three rings
- C07C2603/22—Ortho- or ortho- and peri-condensed systems containing three rings containing only six-membered rings
- C07C2603/24—Anthracenes; Hydrogenated anthracenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1999-0008668A KR100465864B1 (ko) | 1999-03-15 | 1999-03-15 | 유기 난반사방지 중합체 및 그의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2791056A1 FR2791056A1 (fr) | 2000-09-22 |
FR2791056B1 true FR2791056B1 (fr) | 2004-01-02 |
Family
ID=36597906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9915748A Expired - Fee Related FR2791056B1 (fr) | 1999-03-15 | 1999-12-14 | Anthracenylmethyl(meth)acrylates, polymeres qu'ils permettent de preparer et revetements anti-reflechissants les contenant |
Country Status (10)
Country | Link |
---|---|
US (1) | US6309790B1 (fr) |
JP (2) | JP4121683B2 (fr) |
KR (1) | KR100465864B1 (fr) |
CN (1) | CN1200012C (fr) |
DE (1) | DE19962663A1 (fr) |
FR (1) | FR2791056B1 (fr) |
GB (1) | GB2347927B (fr) |
IT (1) | IT1308671B1 (fr) |
NL (1) | NL1014639C2 (fr) |
TW (1) | TWI234689B (fr) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100395904B1 (ko) * | 1999-04-23 | 2003-08-27 | 주식회사 하이닉스반도체 | 유기 반사방지 중합체 및 그의 제조방법 |
KR100310252B1 (ko) * | 1999-06-22 | 2001-11-14 | 박종섭 | 유기 반사방지 중합체 및 그의 제조방법 |
KR100427440B1 (ko) * | 1999-12-23 | 2004-04-17 | 주식회사 하이닉스반도체 | 유기 반사방지 화합물 및 그의 제조방법 |
KR100355604B1 (ko) * | 1999-12-23 | 2002-10-12 | 주식회사 하이닉스반도체 | 난반사 방지막용 중합체와 그 제조방법 |
KR100549574B1 (ko) * | 1999-12-30 | 2006-02-08 | 주식회사 하이닉스반도체 | 유기 반사 방지막용 중합체 및 그의 제조방법 |
US6444408B1 (en) * | 2000-02-28 | 2002-09-03 | International Business Machines Corporation | High silicon content monomers and polymers suitable for 193 nm bilayer resists |
KR100574486B1 (ko) * | 2000-06-30 | 2006-04-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
KR100687851B1 (ko) * | 2000-06-30 | 2007-02-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
KR100721182B1 (ko) * | 2000-06-30 | 2007-05-23 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
KR100687850B1 (ko) * | 2000-06-30 | 2007-02-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
KR100721181B1 (ko) * | 2000-06-30 | 2007-05-23 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
KR100504436B1 (ko) * | 2000-12-29 | 2005-07-29 | 주식회사 하이닉스반도체 | 포토 레지스트용 중합체 및 이의 제조 방법 |
KR20020090584A (ko) * | 2001-05-28 | 2002-12-05 | 주식회사 동진쎄미켐 | 유기 반사 방지막용 고분자 수지, 및 이를 이용하는KrF 포토레지스트용 유기 반사 방지막 조성물 |
KR100351459B1 (ko) * | 2001-05-30 | 2002-09-05 | 주식회사 하이닉스반도체 | 유기 반사방지 중합체 및 그의 제조방법 |
US6670425B2 (en) | 2001-06-05 | 2003-12-30 | Brewer Science, Inc. | Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings |
US6893684B2 (en) * | 2001-06-05 | 2005-05-17 | Brewer Science Inc. | Anti-reflective coating compositions for use with low k dielectric materials |
KR20030059970A (ko) * | 2002-01-04 | 2003-07-12 | 주식회사 몰커스 | 패턴 무너짐 현상을 극복하기 위한 유기 난반사 방지막조성물 및 이를 이용한 패턴 형성방법 |
KR100480235B1 (ko) * | 2002-07-18 | 2005-04-06 | 주식회사 하이닉스반도체 | 유기 반사방지막 조성물 및 이를 이용한 포토레지스트의패턴 형성 방법 |
US7361447B2 (en) | 2003-07-30 | 2008-04-22 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
TWI363251B (en) | 2003-07-30 | 2012-05-01 | Nissan Chemical Ind Ltd | Sublayer coating-forming composition for lithography containing compound having protected carboxy group |
JP2005059064A (ja) * | 2003-08-13 | 2005-03-10 | Toshiba Corp | 加工方法及び半導体装置の製造方法 |
WO2005055248A2 (fr) * | 2003-11-28 | 2005-06-16 | Merck Patent Gmbh | Ameliorations apportees a des couches semiconductrices organiques |
KR101156973B1 (ko) * | 2005-03-02 | 2012-06-20 | 주식회사 동진쎄미켐 | 유기 반사방지막 형성용 유기 중합체 및 이를 포함하는 유기 조성물 |
WO2008080201A1 (fr) * | 2007-01-05 | 2008-07-10 | Francisco Mathieu | Copolymère de méthacrylate de méthyle et de méthacrylate d'anthracényle |
US7847013B2 (en) * | 2007-06-19 | 2010-12-07 | Cheil Industries Inc. | Glycidyl-, OH-, COOH- and aryl-(meth)acrylate copolymer for color filter |
US20090035704A1 (en) * | 2007-08-03 | 2009-02-05 | Hong Zhuang | Underlayer Coating Composition Based on a Crosslinkable Polymer |
US8039201B2 (en) * | 2007-11-21 | 2011-10-18 | Az Electronic Materials Usa Corp. | Antireflective coating composition and process thereof |
KR100944227B1 (ko) | 2007-12-17 | 2010-02-24 | 제일모직주식회사 | 방향족 산 분해성 기를 갖는 (메타)아크릴레이트 화합물 및감광성 고분자 및 레지스트 조성물 |
KR100952465B1 (ko) * | 2007-12-18 | 2010-04-13 | 제일모직주식회사 | 방향족 (메타)아크릴레이트 화합물 및 감광성 고분자, 및레지스트 조성물 |
US20100015550A1 (en) * | 2008-07-17 | 2010-01-21 | Weihong Liu | Dual damascene via filling composition |
KR101259001B1 (ko) | 2009-12-01 | 2013-04-29 | 영창케미칼 주식회사 | 유기 반사방지막 형성용 조성물 및 이를 포함하는 유기 반사방지막 |
TWI662370B (zh) * | 2015-11-30 | 2019-06-11 | 南韓商羅門哈斯電子材料韓國公司 | 與外塗佈光致抗蝕劑一起使用之塗料組合物 |
JP7297559B2 (ja) * | 2019-06-28 | 2023-06-26 | 東京応化工業株式会社 | 硬化性樹脂組成物及び硬化物 |
CN115725216B (zh) * | 2022-10-26 | 2023-10-24 | 北京科华微电子材料有限公司 | 一种底部抗反射涂层组合物及其用途 |
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US4413052A (en) * | 1981-02-04 | 1983-11-01 | Ciba-Geigy Corporation | Photopolymerization process employing compounds containing acryloyl group and anthryl group |
JPS59231531A (ja) * | 1983-06-13 | 1984-12-26 | Agency Of Ind Science & Technol | 感光性高分子材料 |
US6165697A (en) * | 1991-11-15 | 2000-12-26 | Shipley Company, L.L.C. | Antihalation compositions |
JP3204465B2 (ja) * | 1992-07-17 | 2001-09-04 | 東京応化工業株式会社 | 半導体素子製造用レジストパターン形成材料及びそれを用いたパターン形成方法 |
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US5939236A (en) * | 1997-02-07 | 1999-08-17 | Shipley Company, L.L.C. | Antireflective coating compositions comprising photoacid generators |
JP3854367B2 (ja) * | 1997-06-04 | 2006-12-06 | Azエレクトロニックマテリアルズ株式会社 | 光吸収性ポリマー、光吸収膜形成性組成物及び光吸収膜とそれを用いた反射防止膜 |
US6190839B1 (en) * | 1998-01-15 | 2001-02-20 | Shipley Company, L.L.C. | High conformality antireflective coating compositions |
TW457403B (en) * | 1998-07-03 | 2001-10-01 | Clariant Int Ltd | Composition for forming a radiation absorbing coating containing blocked isocyanate compound and anti-reflective coating formed therefrom |
JP3928278B2 (ja) * | 1998-11-16 | 2007-06-13 | Jsr株式会社 | 反射防止膜形成組成物 |
US6316165B1 (en) * | 1999-03-08 | 2001-11-13 | Shipley Company, L.L.C. | Planarizing antireflective coating compositions |
KR100395904B1 (ko) * | 1999-04-23 | 2003-08-27 | 주식회사 하이닉스반도체 | 유기 반사방지 중합체 및 그의 제조방법 |
-
1999
- 1999-03-15 KR KR10-1999-0008668A patent/KR100465864B1/ko not_active IP Right Cessation
- 1999-11-17 TW TW088120016A patent/TWI234689B/zh not_active IP Right Cessation
- 1999-11-26 GB GB9927834A patent/GB2347927B/en not_active Expired - Fee Related
- 1999-12-14 FR FR9915748A patent/FR2791056B1/fr not_active Expired - Fee Related
- 1999-12-14 JP JP35449299A patent/JP4121683B2/ja not_active Expired - Fee Related
- 1999-12-14 IT IT1999TO001092A patent/IT1308671B1/it active
- 1999-12-15 CN CNB991263804A patent/CN1200012C/zh not_active Expired - Fee Related
- 1999-12-23 DE DE19962663A patent/DE19962663A1/de not_active Ceased
-
2000
- 2000-02-07 US US09/499,873 patent/US6309790B1/en not_active Expired - Fee Related
- 2000-03-14 NL NL1014639A patent/NL1014639C2/nl not_active IP Right Cessation
-
2007
- 2007-11-14 JP JP2007295799A patent/JP4791433B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20000060410A (ko) | 2000-10-16 |
JP4121683B2 (ja) | 2008-07-23 |
KR100465864B1 (ko) | 2005-01-24 |
GB2347927B (en) | 2004-03-24 |
FR2791056A1 (fr) | 2000-09-22 |
ITTO991092A1 (it) | 2001-06-14 |
DE19962663A1 (de) | 2000-09-21 |
JP2000264921A (ja) | 2000-09-26 |
CN1200012C (zh) | 2005-05-04 |
JP4791433B2 (ja) | 2011-10-12 |
GB9927834D0 (en) | 2000-01-26 |
NL1014639A1 (nl) | 2000-09-18 |
CN1266843A (zh) | 2000-09-20 |
US6309790B1 (en) | 2001-10-30 |
JP2008197624A (ja) | 2008-08-28 |
ITTO991092A0 (it) | 1999-12-14 |
GB2347927A (en) | 2000-09-20 |
TWI234689B (en) | 2005-06-21 |
NL1014639C2 (nl) | 2001-12-28 |
IT1308671B1 (it) | 2002-01-09 |
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