FR2763343B1 - Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage - Google Patents

Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage

Info

Publication number
FR2763343B1
FR2763343B1 FR9806021A FR9806021A FR2763343B1 FR 2763343 B1 FR2763343 B1 FR 2763343B1 FR 9806021 A FR9806021 A FR 9806021A FR 9806021 A FR9806021 A FR 9806021A FR 2763343 B1 FR2763343 B1 FR 2763343B1
Authority
FR
France
Prior art keywords
depositing
substrate
material layer
plating system
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9806021A
Other languages
English (en)
Other versions
FR2763343A1 (fr
Inventor
Cindy Reidsema Simpson
Matthew T Herrick
Gregory S Etherington
James Derek Legg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2763343A1 publication Critical patent/FR2763343A1/fr
Application granted granted Critical
Publication of FR2763343B1 publication Critical patent/FR2763343B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath
FR9806021A 1997-05-14 1998-05-13 Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage Expired - Fee Related FR2763343B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/856,459 US6174425B1 (en) 1997-05-14 1997-05-14 Process for depositing a layer of material over a substrate

Publications (2)

Publication Number Publication Date
FR2763343A1 FR2763343A1 (fr) 1998-11-20
FR2763343B1 true FR2763343B1 (fr) 2000-11-24

Family

ID=25323684

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9806021A Expired - Fee Related FR2763343B1 (fr) 1997-05-14 1998-05-13 Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage

Country Status (13)

Country Link
US (3) US6174425B1 (fr)
JP (1) JP3326112B2 (fr)
KR (1) KR100329454B1 (fr)
CN (1) CN1143906C (fr)
BR (1) BR9801617A (fr)
DE (1) DE19820878B4 (fr)
FR (1) FR2763343B1 (fr)
GB (2) GB2325242A (fr)
IT (1) IT1299444B1 (fr)
MY (1) MY126502A (fr)
NL (1) NL1009157C2 (fr)
SG (1) SG71111A1 (fr)
TW (1) TW372330B (fr)

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Also Published As

Publication number Publication date
US6500324B1 (en) 2002-12-31
KR19980087024A (ko) 1998-12-05
TW372330B (en) 1999-10-21
IT1299444B1 (it) 2000-03-16
US6174425B1 (en) 2001-01-16
ITRM980277A1 (it) 1999-10-29
GB2325242A (en) 1998-11-18
ITRM980277A0 (it) 1998-04-29
MY126502A (en) 2006-10-31
DE19820878B4 (de) 2011-03-03
FR2763343A1 (fr) 1998-11-20
GB9809856D0 (en) 1998-07-08
SG71111A1 (en) 2000-03-21
CN1143906C (zh) 2004-03-31
JPH10330991A (ja) 1998-12-15
US7323094B2 (en) 2008-01-29
KR100329454B1 (ko) 2002-08-28
MX9803339A (es) 1998-12-31
DE19820878A1 (de) 1998-11-19
NL1009157C2 (nl) 2000-01-10
BR9801617A (pt) 1999-06-08
NL1009157A1 (nl) 1998-11-17
US20020195347A1 (en) 2002-12-26
GB0111315D0 (en) 2001-07-04
JP3326112B2 (ja) 2002-09-17
CN1204702A (zh) 1999-01-13

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