JPS54128945A - Electroplating method - Google Patents
Electroplating methodInfo
- Publication number
- JPS54128945A JPS54128945A JP3765878A JP3765878A JPS54128945A JP S54128945 A JPS54128945 A JP S54128945A JP 3765878 A JP3765878 A JP 3765878A JP 3765878 A JP3765878 A JP 3765878A JP S54128945 A JPS54128945 A JP S54128945A
- Authority
- JP
- Japan
- Prior art keywords
- current
- cathodes
- value
- ratio
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To stabilize the edge overcoat inhibiting effect of auxiliary cathodes by regulating the distance between a material to be plated and each of the cathodes so as to make optimal the ratio of the value of a current flowing to the cathodes and the value of a current flowing to the material.
CONSTITUTION: Auxiliary cathodes 4 attached to shields 5 are set movably to material 1 to be plated, and servovalve 9 is actuated with a signal of controller 10 to expand or contract cylinder 8, thereby controlling the positions of cathodes 4. Plating current value is picked up with ammeter 11 provided to the cathod side current flowing path of main power source 6, and auxiliary cathode current value is picked up with ammeter 12 set between cathode 4 and power source 7. The measured values are sent to controller 10 to obtain the actual current ratio of the auxiliary cathode current and the plating current. The ratio is compared to the preset optimal value, and controller 10 sends instructions to valve 9 to regulate the distance between each edge of material 1 and each cathode 4 so as to allow the current ratio to coincide with the optimal value by increasing or decreasing the auxiliary cathode current.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3765878A JPS54128945A (en) | 1978-03-30 | 1978-03-30 | Electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3765878A JPS54128945A (en) | 1978-03-30 | 1978-03-30 | Electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54128945A true JPS54128945A (en) | 1979-10-05 |
Family
ID=12503732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3765878A Pending JPS54128945A (en) | 1978-03-30 | 1978-03-30 | Electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54128945A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2763343A1 (en) * | 1997-05-14 | 1998-11-20 | Motorola Inc | METHOD OF DEPOSITING A MATERIAL LAYER ON A SUBSTRATE USING A PLATING SYSTEM |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
-
1978
- 1978-03-30 JP JP3765878A patent/JPS54128945A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2763343A1 (en) * | 1997-05-14 | 1998-11-20 | Motorola Inc | METHOD OF DEPOSITING A MATERIAL LAYER ON A SUBSTRATE USING A PLATING SYSTEM |
| NL1009157C2 (en) * | 1997-05-14 | 2000-01-10 | Motorola Inc | Method for applying a material layer to a substrate and a plating system. |
| US6174425B1 (en) | 1997-05-14 | 2001-01-16 | Motorola, Inc. | Process for depositing a layer of material over a substrate |
| US6500324B1 (en) | 1997-05-14 | 2002-12-31 | Motorola, Inc. | Process for depositing a layer of material on a substrate |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
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