FR2883889B1 - Electrode de reduction pour depot de metal par oxydoreduction. - Google Patents

Electrode de reduction pour depot de metal par oxydoreduction.

Info

Publication number
FR2883889B1
FR2883889B1 FR0550877A FR0550877A FR2883889B1 FR 2883889 B1 FR2883889 B1 FR 2883889B1 FR 0550877 A FR0550877 A FR 0550877A FR 0550877 A FR0550877 A FR 0550877A FR 2883889 B1 FR2883889 B1 FR 2883889B1
Authority
FR
France
Prior art keywords
oxidoreduction
metal deposition
reduction electrode
electrode
reduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0550877A
Other languages
English (en)
Other versions
FR2883889A1 (fr
Inventor
Ronan Botrel
Herve Bourcier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0550877A priority Critical patent/FR2883889B1/fr
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to AU2006231249A priority patent/AU2006231249B2/en
Priority to CN200680018441.8A priority patent/CN101248220B/zh
Priority to US11/887,896 priority patent/US8246797B2/en
Priority to EP06726175A priority patent/EP1866462A2/fr
Priority to PCT/FR2006/000732 priority patent/WO2006106221A2/fr
Priority to CA2603286A priority patent/CA2603286C/fr
Priority to JP2008504803A priority patent/JP5313661B2/ja
Publication of FR2883889A1 publication Critical patent/FR2883889A1/fr
Application granted granted Critical
Publication of FR2883889B1 publication Critical patent/FR2883889B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
FR0550877A 2005-04-04 2005-04-04 Electrode de reduction pour depot de metal par oxydoreduction. Active FR2883889B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0550877A FR2883889B1 (fr) 2005-04-04 2005-04-04 Electrode de reduction pour depot de metal par oxydoreduction.
CN200680018441.8A CN101248220B (zh) 2005-04-04 2006-04-03 表面处理电极
US11/887,896 US8246797B2 (en) 2005-04-04 2006-04-03 Surface treatment electrode
EP06726175A EP1866462A2 (fr) 2005-04-04 2006-04-03 Electrode de traitement de surface
AU2006231249A AU2006231249B2 (en) 2005-04-04 2006-04-03 Surface processing electrode
PCT/FR2006/000732 WO2006106221A2 (fr) 2005-04-04 2006-04-03 Electrode de traitement de surface
CA2603286A CA2603286C (fr) 2005-04-04 2006-04-03 Electrode de traitement de surface
JP2008504803A JP5313661B2 (ja) 2005-04-04 2006-04-03 表面処理電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0550877A FR2883889B1 (fr) 2005-04-04 2005-04-04 Electrode de reduction pour depot de metal par oxydoreduction.

Publications (2)

Publication Number Publication Date
FR2883889A1 FR2883889A1 (fr) 2006-10-06
FR2883889B1 true FR2883889B1 (fr) 2007-06-08

Family

ID=34982441

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0550877A Active FR2883889B1 (fr) 2005-04-04 2005-04-04 Electrode de reduction pour depot de metal par oxydoreduction.

Country Status (8)

Country Link
US (1) US8246797B2 (fr)
EP (1) EP1866462A2 (fr)
JP (1) JP5313661B2 (fr)
CN (1) CN101248220B (fr)
AU (1) AU2006231249B2 (fr)
CA (1) CA2603286C (fr)
FR (1) FR2883889B1 (fr)
WO (1) WO2006106221A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103276376A (zh) * 2013-06-14 2013-09-04 苏州异导光电材料科技有限公司 一种在高分子微球表面化学镀镍的方法
FR3008429A1 (fr) 2013-07-12 2015-01-16 Commissariat Energie Atomique Procede de synthese d'une mousse metallique, mousse metallique, ses utilisations et dispositif comprenant une telle mousse metallique
US10844507B2 (en) * 2017-06-21 2020-11-24 Lawrence Livermore National Security, Llc Cathode system for electrodeposition of metals on microspheres
CN117740883A (zh) * 2023-12-19 2024-03-22 广东工业大学 一种用于管道堵塞的检测方法及装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR550877A (fr) 1922-05-02 1923-03-22 Sharples Specialty Co Procédé pour la résolution des émulsions d'eau dans l'huile
US3664354A (en) * 1968-11-12 1972-05-23 Udylite Corp Apparatus for processing workpieces
BR6913915D0 (pt) * 1968-11-12 1973-01-02 Wdylite Corp Processo e aparelho para processamento de pecas a trabalhar
CH555752A (de) * 1972-06-02 1974-11-15 Montblanc Simplo Gmbh Kugelschreiberminenspitze.
DE2543599A1 (de) * 1975-09-30 1977-04-07 Herbert Fruehschuetz Vorrichtung zur elektrochemischen oberflaechenbehandlung von kleinteilen
US4316786A (en) 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
JPS5881990A (ja) 1981-11-11 1983-05-17 Fujitsu Ltd 電気めつき処理方法
JPH04354881A (ja) * 1991-05-31 1992-12-09 Soken Kagaku Kk 無電解鍍金方法
JPH08120497A (ja) * 1994-10-21 1996-05-14 Seikosha Co Ltd 回転バレル装置
CN2270056Y (zh) * 1996-06-14 1997-12-10 吕安 可移式电镀装置
US6174425B1 (en) * 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate

Also Published As

Publication number Publication date
AU2006231249B2 (en) 2012-02-02
CA2603286C (fr) 2014-03-25
EP1866462A2 (fr) 2007-12-19
WO2006106221A2 (fr) 2006-10-12
JP5313661B2 (ja) 2013-10-09
CA2603286A1 (fr) 2006-10-12
WO2006106221A3 (fr) 2007-08-23
US8246797B2 (en) 2012-08-21
AU2006231249A1 (en) 2006-10-12
FR2883889A1 (fr) 2006-10-06
US20090014321A1 (en) 2009-01-15
CN101248220A (zh) 2008-08-20
JP2008534787A (ja) 2008-08-28
CN101248220B (zh) 2011-02-09

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